Abstract:
Provided are new techniques for fault analysis in IC semiconductor devices, including system designs and methods to enable the probing of circuitry within an IC device under test (DUT) using electron beam (e-beam) techniques while the DUT is being stimulated electrically, or while the device is active on its own or within a host system mounted in a circuit board or other module. The DUT could be a packaged IC, or an IC in some unpackaged form. To create a local evacuated volume immediately outside the e-beam tool, a sealing element is sealed against or around the DUT for a localized seal. Such an arrangement obviates the need for vacuum feedthroughs of possibly thousands of signals required to operate and monitor the DUT, and further enables probing of a DUT while it is operating in its normal environment, such as installed on a circuit board in its system, or on a tester.
Abstract:
A support for an electron microscope sample includes a body defining a void for receiving a first micro-electronic device, and a first gasket positioned about the first surface. The first gasket further defines an arm extending at an angle away from a horizontal extending through the first micro-electronic device. In operation, the first micro-electronic device is installed onto the first gasket and the arm engages an outer facing side of the first micro-electronic device to grip the first micro-electronic device.
Abstract:
A support for an electron microscope sample includes a body defining a void for receiving a first micro-electronic device, and a first gasket positioned about the first surface. The first gasket further defines an arm extending at an angle away from a horizontal extending through the first micro-electronic device. In operation, the first micro-electronic device is installed onto the first gasket and the arm engages an outer facing side of the first micro-electronic device to grip the first micro-electronic device.
Abstract:
In a SEM device which enables observations under an atmospheric pressure, in the event that a diaphragm is damaged during an observation of a sample, air flows into a charged particle optical barrel from the vicinity of the sample, due to the differential pressure between the inside of the charged particle optical barrel under vacuum and the vicinity of the sample under the atmospheric pressure. At this time, the sample may be sucked into the charged particle optical barrel. In this case, a charged particle optical system and a detector are contaminated thereby, which causes performance degradation or failures of the charged particle microscope. For coping therewith, it is necessary to prevent the charged particle optical barrel from being contaminated, without inducing a time lag, with a simple structure. In a charged particle beam device adapted to place a sample in a non-vacuum environment, there is provided a filter member which is placed on the path of a primary charged particle beam at least in a state where the primary charged particle beam is directed to the sample and, further, is adapted to transmit or pass, therethrough, the primary charged particle beam and secondary charged particles derived from the sample, while intercepting at least a portion of a scattering substance which is scattered in the event of a fracture of the diaphragm.
Abstract:
This charged particle beam device irradiates a primary charged particle beam generated from a charged particle microscope onto a sample arranged on a light-emitting member that makes up at least a part of a sample base, and, in addition to obtaining charged particle microscope images by the light-emitting member detecting charged particles transmitted through or scattered inside the sample, obtains optical microscope images by means of an optical microscope while the sample is still arranged on the sample platform.
Abstract:
A member for a charged particle beam device (56), which is used for a charged particle beam device (1c), includes a frame (55) to be attached to a frame (3c), and a diaphragm element (18a) provided in the frame (55). In the diaphragm element (18a), a diaphragm (19), which air-tightly separates the inside and the outside of a vacuum chamber (4a) from each other in a state where the pressure inside the vacuum chamber (4a) partitioned by the frame (3c) and the frame (55) is reduced more than the pressure outside the vacuum chamber (4a), and allows a charged particle beam to be transmitted therethrough, is formed. Moreover, in the diaphragm element (18a), a buffer film (33) for preventing a sample (12) and the diaphragm (19) from coming into contact with each other is formed so as to be positioned on a sample stage (22) side rather than on the diaphragm (19).
Abstract:
A specimen positioning device (100) is for use in or with a charged particle beam system having a specimen chamber (1) and has: a base (10) provided with a hole (12) in operative communication with the specimen chamber (1); a specimen holder (20) movably mounted in the hole (12) and having a first portion (22) and a second portion (24); and a first portion support portion (40) supporting the first portion (22) in the specimen chamber (1). The second portion (24) supports the first portion (22) via a resilient member (34).
Abstract:
A target positioning device, in particular for a lithography system, comprising a carrier for carrying a target, and a stage for carrying and moving the carrier along a first direction (X). The stage comprising two X-stage bases, both arranged on top of a common base plate, each X-stage base carries an X-stage carriage, and a Y-beam comprising a Y-stage for carrying said carrier and moving the carrier said carrier in a second direction (Y). The Y-beam bridges the space between the X-stage carriages and is connected to the X-stage carriages via a flexible coupling. The device further comprises two motors each for driving a corresponding X-stage carriage along its corresponding X-stage base. The two motors are arranged at least substantially below the stage. Each motor of said two motors is coupled to an eccentric cam or crank which is connected to the corresponding X-stage carriage via a crank shaft.
Abstract:
A stage device to be used in a vacuum includes: a gas supply unit for generating a gas; a base member having four of upper, lower, right, and left surfaces; a slider formed in a frame shape surrounding the base member and having surfaces facing the respective surfaces of the base member, and disposed to be movable; and an air bearing configured to float the slider by supplying the gas to a space between the base member and the slider. The slider includes: an air chamber provided on the surface facing the base member for accumulating air, and the base member includes thereinside a slider-moving air flow passage configured to supply the gas from an inlet port for letting in the gas generated by the gas supply unit to an outlet port for supplying the gas to the air chamber of the slider.
Abstract:
A stage for processing a substrate, especially useful for vacuum applications, has a recess just large enough to hold a substantially flat substrate and a chuck or holder, but not much more. The perimeter of both top and bottom of the stage has air bearing surfaces separated from the recess by differentially pumped grooves and seal lands. The air bearing lands are guided between two reference surfaces and the seal lands, being substantially coplanar, create a resistance to flow between the bearings and the recess. On the other side of one of the reference plates mounts the radiation source or process. The opposite reference plate may have a large aperture, non-contact pumping port. This improves vacuum capability and stage precision. The stage may operate in a vacuum environment itself or can provide multiple stages moving between processes or inspection steps within the same tool or process sequence.