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    ELECTRONIC COMPONENT WITH A COMPONENT HOUSING
    82.
    发明申请
    ELECTRONIC COMPONENT WITH A COMPONENT HOUSING 审中-公开

    公开(公告)号：US20170283248A1

    公开(公告)日：2017-10-05

    申请号：US15463450

    申请日：2017-03-20

    Applicant: Hella KGaA Hueck & Co.

    Inventor： Silvio Fedgenhaeuer ,  Sergej Tonewizki ,  lngo Zoyke

    IPC: B81B7/00 ,  F01M11/12 ,  G01F23/296 ,  H01L41/113

    CPC classification number: B81B7/0058 ,  B81B2201/0214 ,  B81B2201/0264 ,  F01M11/12 ,  G01F23/296 ,  H01L41/1132

    Abstract: In an electronic component with a component housing and an integrated circuit with sensor function which is accommodated in a plastic electronic housing, wherein the component housing has a cutaway in the region of the circuit with sensor function so that the integrated circuit can perform its function as a sensor through the cutaways, the component housing lies flush with the edge of the cutaway on the electronic housing and is joined in sealing manner with an adhesive bond to the electronic housing. The component housing has an approximately vertical section on the edge of the cutaways, which section extends along the side of the electronic housing. A horizontal section is also present and projects horizontally over the electronic housing.

    Single Silicon Wafer Micromachined Thermal Conduction Sensor
    86.
    发明申请
    Single Silicon Wafer Micromachined Thermal Conduction Sensor 有权

    公开(公告)号：US20160355396A1

    公开(公告)日：2016-12-08

    申请号：US15237300

    申请日：2016-08-15

    Applicant: Xiang Zheng Tu

    Inventor： Xiang Zheng Tu

    IPC: B81C1/00 ,  G01N27/18

    CPC classification number: B81C1/0069 ,  B81B2201/0214 ,  B81C2201/0115 ,  G01N27/18

    Abstract: A single silicon wafer micromachined thermal conduction sensor is described. The sensor consists of a heat transfer cavity with a flat bottom and an arbitrary plane shape, which is created in a silicon substrate. A heated resistor with a temperature dependence resistance is deposed on a thin film bridge, which is the top of the cavity. A heat sink is the flat bottom of the cavity and parallel to the bridge completely. The heat transfer from the heated resistor to the heat sink is modulated by the change of the thermal conductivity of the gas or gas mixture filled in the cavity. This change can be measured to determine the composition concentration of the gas mixture or the pressure of the air in a vacuum system.

    Device comprising a fluid channel fitted with at least one microelectronic or nanoelectronic system, and method for manufacturing such a device
    89.
    发明授权
    Device comprising a fluid channel fitted with at least one microelectronic or nanoelectronic system, and method for manufacturing such a device 有权
    包括装配有至少一个微电子或纳米电子系统的流体通道的装置以及用于制造这种装置的方法

    公开(公告)号：US09340410B2

    公开(公告)日：2016-05-17

    申请号：US14336351

    申请日：2014-07-21

    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT

    Inventor： Eric Ollier ,  Carine Marcoux

    IPC: B81B7/00 ,  B81C1/00 ,  G01N30/60

    CPC classification number: B81B7/0061 ,  B81B7/007 ,  B81B2201/0214 ,  B81B2201/0292 ,  B81B2201/058 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/00269 ,  B81C1/00309 ,  B81C2203/0118 ,  G01N30/6095

    Abstract: A device comprising a substrate comprising at least one microelectronic and/or nanoelectronic structure comprising at least one sensitive portion and one fluid channel (2) defined between said substrate and a cap (6), where said fluid channel (2) comprises at least two apertures to provide a flow in said channel, where said microelectronic and/or nanoelectronic structure is located within the fluid channel, where said cap is assembled with the substrate at an assembly interface, where said device comprises electrical connections between said microelectronic and/or nanoelectronic structure and the exterior of the fluid channel (2), where said electrical connections (8) are formed by vias made through the substrate (4) directly below the microelectronic and/or nanoelectronic structure, and in electrical contact with said microelectronic and/or nanoelectronic structure.

    Abstract translation: 一种包括衬底的器件，包括至少一个微电子和/或纳米电子结构，所述微电子和/或纳米电子结构包括限定在所述衬底和帽（6）之间的至少一个敏感部分和一个流体通道（2），其中所述流体通道（2）包括至少两个 孔，以在所述通道中提供流动，其中所述微电子和/或纳米电子结构位于流体通道内，其中所述盖与基板组装在组装界面处，其中所述装置包括所述微电子和/或纳米电子 结构和流体通道（2）的外部，其中所述电连接（8）由通过直接在微电子和/或纳米电子结构下面的基板（4）制成的通孔形成，并且与所述微电子和/或 纳米电子结构。

    Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
    90.
    发明授权
    Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor 有权
    在半导体衬底上具有单片集成多传感器装置的运输装置及其方法

    公开(公告)号：US09327965B2

    公开(公告)日：2016-05-03

    申请号：US14207443

    申请日：2014-03-12

    Applicant: Versana Micro Inc.

    Inventor： Bishnu Prasanna Gogoi

    IPC: B81B7/02 ,  H01L27/14 ,  H01L27/22 ,  H01L27/16 ,  H05K7/02 ,  H01L41/113

    CPC classification number: B81B7/02 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/09 ,  H01L27/14 ,  H01L27/16 ,  H01L27/22 ,  H01L41/1132 ,  H01L41/1138 ,  H01L2924/00 ,  H05K7/02

    Abstract: A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The transportation device couples a first parameter to be measured directly to the direct sensor. Conversely, the transportation device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the transportation device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.

    Abstract translation: 提供了具有多个传感器的运输装置，其被配置为检测和测量不同的感兴趣的参数。 运输装置包括至少一个单片集成多传感器（MIMS）装置。 MIMS器件包括形成在公共半导体衬底上的至少两种不同类型的传感器。 例如，MIMS装置可以包括间接传感器和直接传感器。 运输装置将待测量的第一参数直接耦合到直接传感器。 相反，运输装置可间接地将待测量的第二参数耦合到间接传感器。 可以通过将传感器堆叠到MIMS装置或耦合到MIMS装置的另一基板上而将其它传感器添加到运输装置。 这支持集成多个传感器，如麦克风，加速度计和温度传感器，以降低成本，复杂性，简化组装，同时提高性能。

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