公开(公告)号：US5909078A

公开(公告)日：1999-06-01

申请号：US767192

申请日：1996-12-16

Applicant: Robert L. Wood ,  Vijayakumar R. Dhuler

Inventor： Robert L. Wood ,  Vijayakumar R. Dhuler

IPC: B81B3/00 ,  F03G7/06 ,  G02B6/38 ,  G02B6/42 ,  H01H1/00 ,  H01H9/14 ,  H01H61/00 ,  H02N11/00 ,  F01L1/00 ,  H01G7/00

CPC classification number: F03G7/06 ,  B81B3/0024 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  G02B6/3803 ,  G02B6/4226 ,  H01H1/0036 ,  H01H2001/0042 ,  H01H2001/0068 ,  H01H2061/006 ,  H01H61/00 ,  H01H9/14

Abstract: Microelectromechanical actuators include at least one arched beam which extends between spaced apart supports on a microelectronic substrate. The arched beams are arched in a predetermined direction and expand upon application of heat thereto. A coupler mechanically couples the plurality of arched beams between the spaced apart supports. Heat is applied to at least one of the arched beams to cause further arching as a result of thermal expansion thereof, and thereby cause displacement of the coupler along the predetermined direction. Internal heating of the arched beams by passing current through the arched beams may be used. External heating sources may also be used. The coupler may be attached to a capacitor plate to provide capacitive sensors such as flow sensors. The coupler may also be attached to a valve plate to provide microvalves. Compensating arched beams may be used to provide ambient temperature insensitivity.

Abstract translation: 微机电致动器包括至少一个拱形梁，其在微电子衬底上的间隔开的支撑件之间延伸。 拱形梁在预定方向上拱形并且在施加热量时膨胀。 耦合器在间隔开的支撑件之间机械耦合多个拱形梁。 对至少一个拱形梁施加热量，由于其热膨胀而导致进一步的拱起，从而引起联接器沿着预定方向的位移。 可以使用通过拱形梁使电流通过拱形梁的内部加热。 也可以使用外部加热源。 耦合器可以附接到电容器板以提供诸如流量传感器的电容式传感器。 联接器还可以附接到阀板以提供微型阀。 补偿拱形梁可用于提供环境温度不敏感性。

公开(公告)号：US20190122845A1

公开(公告)日：2019-04-25

申请号：US16222017

申请日：2018-12-17

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Christian Rivero ,  Pascal Fornara ,  Antonio Di-Giacomo ,  Brice Arrazat

IPC: H01H61/02 ,  B81B3/00 ,  H01H1/58 ,  H01H9/02

CPC classification number: H01H61/02 ,  B81B3/0021 ,  B81B2201/031 ,  B81B2203/053 ,  H01H1/58 ,  H01H9/02

Abstract: A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.

公开(公告)号：US20180321643A1

公开(公告)日：2018-11-08

申请号：US16023240

申请日：2018-06-29

Applicant: Seiko Epson Corporation

Inventor： Nozomu HIROKUBO

IPC: G05B11/14 ,  G02B26/00 ,  G01J3/26 ,  G02B5/28 ,  H02N1/00

CPC classification number: G05B11/14 ,  B81B2201/031 ,  G01J3/027 ,  G01J3/10 ,  G01J3/26 ,  G01J3/505 ,  G02B5/286 ,  G02B5/288 ,  G02B26/001 ,  H02N1/006

Abstract: An actuator apparatus includes a pair of substrates facing each other; a plurality of bias actuators that each vary a gap dimension of a gap between the pair of substrates; a gap detection portion that detects the gap dimension; and a voltage control unit that controls driving of each of the bias actuators on the basis of the detected gap dimension. The bias actuators are located asymmetric relative to a driving central axis and are mutually independently driven; and the voltage control unit derives driving parameters for use in driving the bias actuators, on the basis of voltages and gap dimensions obtained by sequentially switching and driving the bias actuators on by one.

公开(公告)号：US20180066636A1

公开(公告)日：2018-03-08

申请号：US15256197

申请日：2016-09-02

Applicant: IMMERSION CORPORATION

Inventor： Vahid Khoshkava ,  Juan Manuel Cruz Hernandez ,  Vincent Levesque

IPC: F03G7/06

CPC classification number: F03G7/065 ,  B06B1/0688 ,  B81B3/0024 ,  B81B2201/031 ,  B81B2201/032 ,  C22F1/006 ,  G06F3/016

Abstract: A haptic actuator device includes a surface with a mechanical property responsive to localized temperature changes. The surface can include a layer or sheet comprising a shape-memory material. The haptic actuator device can further include an actuator configured to selectively deform a plurality of regions in the sheet; and a temperature controller adapted to control the temperatures of the plurality of regions. A method of localized actuation includes selectively controlling the temperatures of the plurality of regions to be above a shape-memory transition temperature of the shape-memory material; selectively deforming at least one of the regions; while maintaining the deformation of the at least one region, lowering the temperature of the at least one region to below the shape-memory transition temperature; subsequently withdrawing the applied stress; and thereafter heating the at least one region to above the shape-memory transition temperature, causing the region to return to its pre-deformation shape.

公开(公告)号：US20180029879A1

公开(公告)日：2018-02-01

申请号：US15728435

申请日：2017-10-09

Applicant: DigitalOptics Corporation MEMS

Inventor： Ankur JAIN ,  Roman C. GUTIERREZ ,  Shi-Sheng LEE ,  Robert J. CALVET ,  Xiaolei LIU

IPC: B81B7/00 ,  G03B3/10 ,  B81C1/00

CPC classification number: B81B7/0077 ,  B81B2201/031 ,  B81B2203/033 ,  B81C1/00571 ,  G03B3/10 ,  G03B2205/0061

Abstract: A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.

公开(公告)号：US09621105B2

公开(公告)日：2017-04-11

申请号：US14961252

申请日：2015-12-07

Applicant: NATIONAL TSING HUA UNIVERSITY

Inventor： Sheng-Shian Li ,  Kuan-Hsien Lee ,  Cheng-Chi Chen

IPC: H03B5/30 ,  H03H9/02 ,  B81B3/00 ,  H03H9/24

CPC classification number: H03B5/30 ,  B81B3/0081 ,  B81B2201/031 ,  B81B2203/0109 ,  B81B2203/0163 ,  H03B5/04 ,  H03H9/02259 ,  H03H9/2463 ,  H03H2009/02291 ,  H03H2009/02307 ,  H03H2009/02322

Abstract: An ultra low power thermally-actuated oscillator and driving circuit thereof are provided. The ultra low power thermally-actuated oscillator includes proof masses, thermally-actuated element and a plurality of driving elements. The proof masses is symmetrically disposed and suspended from a substrate by spring structure. The thermally-actuated element is a line structure to effectively reduce the motional impedance and direct current power. Wherein, the thermally-actuated element is connected to the proof masses or the spring structure. The plurality of driving elements are respectively disposed on both sides of the thermally-actuated element to provide a driving current. When the driving current flows through the thermally-actuated element, the thermally-actuated element will be deformed and thus the proof masses will be driven to produce a harmonic oscillation.

公开(公告)号：US08933596B2

公开(公告)日：2015-01-13

申请号：US13448039

申请日：2012-04-16

Applicant: Harold Stalford

Inventor： Harold Stalford

IPC: B02C19/00 ,  B01F7/00 ,  H02N10/00 ,  B81B3/00 ,  H02N1/00 ,  H02N11/00 ,  H02K7/00

CPC classification number: H02N10/00 ,  B81B3/0024 ,  B81B2201/031 ,  B81B2201/034 ,  B81B2201/037 ,  B81B2201/051 ,  H02K7/00 ,  H02N1/002 ,  H02N11/006

Abstract: A micro rotary machine may include a micro actuator and a micro shaft coupled to the micro actuator. The micro shaft comprises a horizontal shaft and is operable to be rotated by the micro actuator. A micro tool is coupled to the micro shaft and is operable to perform work in response to motion of the micro shaft.

Abstract translation: 微型旋转机器可以包括微型致动器和耦合到微型致动器的微型轴。 微型轴包括水平轴，并且可由微型致动器旋转。 微型工具联接到微型轴，并且可操作以响应于微型轴的运动而执行工作。

公开(公告)号：US08623222B2

公开(公告)日：2014-01-07

申请号：US13652851

申请日：2012-10-16

Applicant: Yu Sun ,  Keekyoung Kim

Inventor： Yu Sun ,  Keekyoung Kim

IPC: C23F1/00

CPC classification number: B81C99/002 ,  B25J9/104 ,  B81B2201/0292 ,  B81B2201/031 ,  B81B2201/033

Abstract: The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sizes and two-axis force sensing capabilities. Gripping motion is produced by one or more electrothermal actuators. Integrated force sensors along x and y directions enable the measurement of gripping forces as well as the forces applied at the end of microgripper arms along the normal direction, both with a resolution down to nanoNewton. The microfabrication method enables monolithic integration of the actuators and the force sensors.

Abstract translation: 本发明涉及一种微抓爪的设计和微细加工方法，其能够抓住大范围尺寸和双轴力感测能力的微型和纳米物体。 夹持运动由一个或多个电热致动器产生。 沿x和y方向的集成力传感器可以测量夹紧力以及沿着法向方向施加在微夹臂末端的力，并且分辨率低至纳摩顿。 微加工方法可实现致动器和力传感器的整体集成。

公开(公告)号：US08287943B2

公开(公告)日：2012-10-16

申请号：US12160179

申请日：2007-01-05

Applicant: Claude Lucat ,  Francis Menil ,  Hélène Debeda-Hickel ,  Patrick Ginet

Inventor： Claude Lucat ,  Francis Menil ,  Hélène Debeda-Hickel ,  Patrick Ginet

IPC: B05D5/12 ,  H01L41/22 ,  H01L21/00 ,  H01L41/00 ,  B32B3/00

CPC classification number: B81C99/0095 ,  B81B2201/0271 ,  B81B2201/031 ,  B81B2203/0109 ,  B81B2203/0118 ,  H01L41/107 ,  H01L41/27 ,  H01L41/29 ,  H01L41/314 ,  Y10T29/42 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: The invention relates to the preparation of multilayer microcomponents which comprise one or more films, each consisting of a material M selected from metals, metal alloys, glasses, ceramics and glass-ceramics.The method consists in depositing on a substrate one or more films of an ink P, and one or more films of an ink M, each film being deposited in a predefined pattern selected according to the structure of the microcomponent, each film of ink P and each film of ink M being at least partially consolidated before deposition of the next film; effecting a total consolidation of the films of ink M partially consolidated after their deposition, to convert them to films of material M; totally or partially removing the material of each of the films of ink P. An ink P consists of a thermoset resin containing a mineral filler or a mixture comprising a mineral filler and an organic binder. An ink M consists of a mineral material precursor of the material M and an organic binder. The inks are deposited by pouring or by extrusion.

Abstract translation: 本发明涉及多层微组件的制备，其包括一种或多种膜，每个膜由选自金属，金属合金，玻璃，陶瓷和玻璃陶瓷的材料M组成。 该方法包括在基材上沉积一个或多个油墨P的膜，以及一个或多个油墨M膜，每个膜以按照微组件的结构选择的预定图案沉积，每个油墨P和 油墨M的每个薄膜在沉积下一个薄膜之前被至少部分固结; 在沉积后进行部分固化的墨水M的总体固结，将其转化成材料M的膜; 完全或部分地去除油墨P的每个薄膜的材料。油墨P由含有矿物填料或包含矿物填料和有机粘合剂的混合物的热固性树脂组成。 油墨M由材料M的矿物材料前体和有机粘合剂组成。 油墨通过倾倒或挤压沉积。

公开(公告)号：US08154378B2

公开(公告)日：2012-04-10

申请号：US11836860

申请日：2007-08-10

Applicant: Validmir Anatolyevich Aksyuk ,  Flavio Pardo ,  Maria Elina Simon

Inventor： Validmir Anatolyevich Aksyuk ,  Flavio Pardo ,  Maria Elina Simon

IPC: H01H61/00 ,  H01H71/16 ,  H01H71/18 ,  H01H61/02 ,  F01B29/10 ,  F02G1/04

CPC classification number: H01H61/02 ,  B81B3/0024 ,  B81B2201/014 ,  B81B2201/031 ,  H01H2061/008

Abstract: A representative embodiment of the invention provides a thermal actuator for a MEMS-based relay switch. The thermal actuator has an “active” arm that is movably mounted on a substrate. The “active” arm has (i) a thermal expansion layer and (ii) a resistive heater that is electrically isolated from the thermal expansion layer. The thermal expansion layer is adapted to expand in response to a temperature change induced by a control current flowing through the resistive heater, thereby bending the “active” arm and moving that arm with respect to the substrate. Due to the fact that mechanical and electrical characteristics of the “active” arm are primarily controlled by the thermal expansion layer and the resistive heater, respectively, those characteristics can be optimized independently to obtain better operating characteristics for MEMS-based relay switches of the invention compared to those attained in the prior art.

Abstract translation: 本发明的代表性实施例提供了一种用于基于MEMS的继电器开关的热致动器。 热致动器具有可移动地安装在基板上的“主动”臂。 “主动”臂具有（i）热膨胀层和（ii）与热膨胀层电隔离的电阻加热器。 热膨胀层适应于由流过电阻加热器的控制电流引起的温度变化而膨胀，从而弯曲“主动”臂并相对于基板移动该臂。 由于“主动”臂的机械和电气特性分别主要由热膨胀层和电阻加热器控制，可以独立地优化这些特性以获得本发明的基于MEMS的继电器开关更好的工作特性 与现有技术中获得的相比。