公开(公告)号：US3990832A

公开(公告)日：1976-11-09

申请号：US617668

申请日：1975-09-29

Applicant: Robert L. Smialek ,  Mary S. Jaffe

Inventor： Robert L. Smialek ,  Mary S. Jaffe

IPC: G03B15/04 ,  H05K1/00 ,  F21K5/02

CPC classification number: G03B15/0457 ,  H05K1/0293 ,  H05K2201/0112 ,  H05K2203/173

Abstract: A multiple flashlamp array is designed having a plurality of lamps fired individually and in sequence and includes a plurality of static solid switching devices capable of being easily activated by radiant energy generated during flashing of the lamps. Initially, the switches have a high resistance ("off" condition) and after being activated by radiation, they undergo chemical conversion to a conductive state ("on" condition). The switches are prepared from compositions which impart improved shelf life under conditions of relatively high humidity at above normal ambient temperatures.

Abstract translation: 多个闪光灯阵列被设计成具有单独地并且顺序地发射的多个灯，并且包括多个静态固体开关装置，其能够被灯闪烁期间产生的辐射能容易地激活。 最初，开关具有高电阻（“关闭”状态），并且在被辐射激活之后，它们经历化学转化为导通状态（“接通”状态）。 开关由在高于正常环境温度的较高湿度条件下改善保质期的组合物制备。

公开(公告)号：US3717742A

公开(公告)日：1973-02-20

申请号：US3717742D

申请日：1970-06-26

Applicant: CIRCA TRAN INC

Inventor： FOTTLER S

IPC: B23K1/005 ,  H05K1/02 ,  H05K3/34 ,  H05K13/04 ,  B23K1/02

CPC classification number: H05K13/0465 ,  B23K1/0053 ,  H05K1/0212 ,  H05K3/3426 ,  H05K3/3473 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/09709 ,  H05K2201/10651 ,  H05K2203/043 ,  H05K2203/0485 ,  H05K2203/1581 ,  Y02P70/613

Abstract: The printed circuit board includes a base made of an infrared radiation transparent material and, on one side of the base, electrical conductors. Between the base and the electrical conductors is an infrared radiation-absorbing interface. The interface and the conductors are bonded to the base by pressure and heat or by heating the board with infrared radiation transmitted through the base and onto the interface which converts the infrared radiation to heat to complete the bonding cure cycle. Electronic components having leads shaped as supporting feet may be reflow soldered to the conductors by similarly transmitting infrared radiation through the base onto the interface. The heat required for soldering is then carried by the conductors from the interface to the solder by thermal conduction. The components are not exposed to the infrared radiation, and no shields or special solders are needed to solder the components to the printed circuit board.

Abstract translation: 印刷电路板包括由红外辐射透明材料制成的基座，并且在基座的一侧上是电导体。 在基底和电导体之间是红外辐射吸收界面。 界面和导体通过压力和热量被接合到基座上，或者通过红外辐射加热板，并将红外辐射传递到接口上，将红外辐射转换成热，从而完成粘合固化循环。 具有形状为支撑脚的引线的电子部件可以通过将红外辐射通过基底传输到界面上而被回流焊接到导体。 然后，焊接所需的热量由导体通过导热从界面承载到焊料。 这些部件不暴露于红外辐射，并且不需要屏蔽或特殊焊料来将部件焊接到印刷电路板。

公开(公告)号：US20240284599A1

公开(公告)日：2024-08-22

申请号：US18617514

申请日：2024-03-26

Applicant: LongKai LI

Inventor： LongKai LI

IPC: H05K3/00 ,  H05K1/05

CPC classification number: H05K3/0011 ,  H05K1/056 ,  H05K2201/0112 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2203/1581

Abstract: The present invention discloses a method for preparing a novel material layer structure of a circuit board, comprising the steps of: (1) combining a film with a copper layer to form an FCCL single-sided board; (2) applying a semi-cured functional material layer on a back side of the film of the FCCL single-sided board, wherein the semi-cured functional material layer is an MPI film, an LCP film, a TFP film, a PTFE film, a copper ion migration resistant film, an LDK high-frequency functional adhesive, a copper ion migration resistant adhesive, or a mixture of the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive to form a novel material layer structure for a circuit board. An article prepared by performing the above methods is also disclosed. The prepared novel material layer structure of the circuit board has high-frequency characteristics and/or copper ion migration resistance, and can be used as an integral structure. In the circuit board manufacturing process, it can be manufactured as the circuit board manufacturing material to be different circuit board structures, which brings great convenience for subsequent circuit board manufacturing and simplifies the manufacturing process.

公开(公告)号：US09985166B2

公开(公告)日：2018-05-29

申请号：US15609134

申请日：2017-05-31

Applicant: Raytheon Company

Inventor： Michael H. Robson ,  Michael T. Pace

IPC: H01L31/18 ,  H05K1/02

CPC classification number: H01L31/18 ,  H05K1/0286 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/10106 ,  Y02B20/346 ,  Y02P70/521

Abstract: A system to configure a conductive pathway and a method of forming a system of configurable conductivity pathways include a photosensitive layer that becomes conductive based on photoexcitation, and a light source layer deposited over the photosensitive layer, the light source layer selectively providing the photoexcitation to the photosensitive layer. The system further includes a controller to control the light source layer, the controller illuminating a portion of the light source layer corresponding with a user input image to photoexcite the photosensitive layer and configure the conductive pathway in the photosensitive layer according to the image.

公开(公告)号：US20160047766A1

公开(公告)日：2016-02-18

申请号：US14460578

申请日：2014-08-15

Applicant: John Andrew Lebens ,  Ronald Steven Cok ,  Yongcai Wang

Inventor： John Andrew Lebens ,  Ronald Steven Cok ,  Yongcai Wang

IPC: G01N27/12 ,  G01N27/07

CPC classification number: G01N27/126 ,  G01N27/07 ,  G02F1/13439 ,  G06F3/044 ,  G06F2203/04103 ,  H05K3/0014 ,  H05K3/1258 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/0257 ,  H05K2201/0269 ,  H05K2201/0272 ,  H05K2201/0338 ,  H05K2201/0376 ,  H05K2201/2054 ,  H05K2203/0108 ,  H05K2203/1131 ,  H05K2203/1476

Abstract: An imprinted electronic sensor structure on a substrate for sensing an environmental factor includes a cured layer having a layer surface located on the substrate. Spatially separated micro-channels extend from the layer surface into the cured layer. A multi-layer micro-wire is formed in each micro-channel. Each multi-layer micro-wire includes at least a conductive layer and a reactive layer. The reactive layer is exposed to the environmental factor. The conductive layer is a cured electrical conductor located only within the micro-channel and at least a portion of the reactive layer responds to the environmental factor.

Abstract translation: 用于感测环境因素的基板上的印刷电子传感器结构包括具有位于基板上的层表面的固化层。 空间分离的微通道从层表面延伸到固化层。 在每个微通道中形成多层微线。 每个多层微线包括至少一个导电层和一个反应层。 反应层暴露于环境因素。 导电层是仅位于微通道内的固化电导体，并且反应层的至少一部分响应于环境因素。

公开(公告)号：US08624156B2

公开(公告)日：2014-01-07

申请号：US11331674

申请日：2006-01-13

Applicant: Naoyuki Matsuo ,  Masakatsu Urairi ,  Atsushi Hino

Inventor： Naoyuki Matsuo ,  Masakatsu Urairi ,  Atsushi Hino

IPC: B23K26/00

CPC classification number: H05K3/0026 ,  B23K26/38 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/30 ,  B23K2103/34 ,  B23K2103/38 ,  B23K2103/40 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  H05K2201/0112 ,  H05K2203/1383

Abstract: Providing a method of manufacturing a laser processed part by using a protective sheet for laser processing capable of effectively suppressing contamination of surface of workpiece by decomposition product, and processing at high precision, when processing the workpiece by optical absorption ablation of laser beam. It is also an object to present a protective sheet for laser processing for use in the manufacturing method of laser processed part.

Abstract translation: 提供一种通过使用激光加工用保护片，通过激光束的光吸收烧蚀对工件进行加工时，能够有效地抑制由分解物产生的工件的表面的污染，以及高精度的加工来制造激光加工部件的方法。 本发明的目的还在于提供一种用于激光加工部件的制造方法的激光加工用保护片。

公开(公告)号：US20120266461A1

公开(公告)日：2012-10-25

申请号：US13273154

申请日：2011-10-13

Applicant: Andreas Nickut ,  Bernd Albrecht ,  Peter Kracht

Inventor： Andreas Nickut ,  Bernd Albrecht ,  Peter Kracht

IPC: H05K3/34

CPC classification number: H05K3/3494 ,  B23K1/0016 ,  B23K1/005 ,  B23K26/361 ,  B23K26/364 ,  B23K26/40 ,  B23K35/268 ,  B23K35/3602 ,  B23K2101/42 ,  B23K2103/172 ,  B23K2103/18 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  H01L24/81 ,  H01L2224/81192 ,  H01L2224/81224 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/0326 ,  H05K2201/10106 ,  H05K2203/107 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2224/81 ,  H01L2924/00

Abstract: The invention relates to a method to conductively connect an electrical component with at least one conductive layer, whereby the conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps: the electrical component or the conductive layer is provided with a soldering material in the area where the component is to be connected to the conductive layer; the soldering material is provided with energy supplied by an energy source, such that the soldering material melts and a non-detachable, material-bonded conductive connection between the electrical component and the conductive layer is established.

Abstract translation: 本发明涉及一种用于将电气部件与至少一个导电层导电连接的方法，由此将导电层施加到在可见光波长区域中基本上是透明的基底，包括以下步骤：电气部件或 导电层在组件要连接到导电层的区域中设置有焊接材料; 焊接材料设置有由能量源提供的能量，使得焊接材料熔化，并且建立电气部件和导电层之间的不可拆卸的材料键合的导电连接。

公开(公告)号：US20110302778A1

公开(公告)日：2011-12-15

申请号：US13214624

申请日：2011-08-22

Applicant: YUEH-LING LEE ,  SHANE FANG

Inventor： YUEH-LING LEE ,  SHANE FANG

IPC: H05K3/02

CPC classification number: B32B27/08 ,  B32B5/147 ,  B32B27/18 ,  B32B27/20 ,  B32B27/281 ,  B32B27/302 ,  B32B27/308 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2270/00 ,  B32B2307/206 ,  B32B2307/714 ,  B32B2457/00 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/184 ,  H05K3/185 ,  H05K2201/0112 ,  H05K2201/0236 ,  H05K2203/107 ,  Y10T29/49156 ,  Y10T428/26 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/3154 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31942

Abstract: The present invention is directed to non-lithographic patterning by laser (or similar-type energy beam) ablation, where the ablation system ultimately results in circuitry features that are relative free from debris induced over-plating defects (debris relating to the ablation process) and fully additive plating induced over-plating defects. Compositions of the invention include a circuit board precursor having an insulating substrate and a cover layer. The insulating substrate is made from a dielectric material and also a metal oxide activatable filler. The cover layer can be sacrificial or non-sacrificial and is used to remediate unwanted debris arising from the ablation process.

Abstract translation: 本发明涉及通过激光（或类似能量束）消融的非平版印刷图案，其中消融系统最终导致电路特征相对没有碎片诱导的过度电镀缺陷（与消融过程有关的碎片） 并且完全添加电镀引起的过度镀覆缺陷。 本发明的组合物包括具有绝缘基板和覆盖层的电路板前体。 绝缘基板由介电材料制成，也可由金属氧化物可活化填料制成。 覆盖层可以是牺牲的或非牺牲的，并且用于修复由消融过程产生的不想要的碎屑。

公开(公告)号：US08025953B2

公开(公告)日：2011-09-27

申请号：US12086613

申请日：2006-12-15

Applicant: Dong Wook Lee ,  In Seok Hwang ,  Seung Wook Kim ,  Hyun Seok Choi

Inventor： Dong Wook Lee ,  In Seok Hwang ,  Seung Wook Kim ,  Hyun Seok Choi

IPC: B32B9/00 ,  H05K3/00

CPC classification number: G02B5/204 ,  C23C22/58 ,  C23C22/68 ,  G02B1/11 ,  G02B5/208 ,  G02B5/223 ,  H05K1/02 ,  H05K9/0096 ,  H05K2201/0112 ,  H05K2203/0315 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: The present invention provides a method for preparing a conductive pattern, comprising a pattern forming step of forming a conductive pattern on a substrate; and a blackening processing step of blackening the surface of the conductive pattern by immersing the conductive pattern in an aqueous solution containing reducing metal ions to oxidize the surface of the conductive pattern, and a conductive pattern prepared therefrom.

Abstract translation: 本发明提供一种制备导电图案的方法，包括在基板上形成导电图案的图案形成步骤; 以及黑化处理步骤，通过将导电图案浸渍在含有还原金属离子的水溶液中以使导电图案的表面氧化，以及由其制备的导电图案，使导电图案的表面变黑。

公开(公告)号：US07836588B2

公开(公告)日：2010-11-23

申请号：US11772413

申请日：2007-07-02

Applicant: Mikhail Laksin ,  Subhankar Chatterjee

Inventor： Mikhail Laksin ,  Subhankar Chatterjee

IPC: H05K3/02

CPC classification number: H05K3/027 ,  H05K2201/0112 ,  H05K2203/1581 ,  Y10T29/49018 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49169

Abstract: The invention provides an article and process for producing electronic devices. More particularly the invention relates to an article and process for fabricating patterns of electrically conductive materials on non-electrically conductive substrates by laser ablation. Such an article and process find use in the production of RDIF devices, antennae, electrical circuits, microwave susceptors, contacts, leads, conductors, interactive displays, electrostatic shielding devices and the like. The process involves first providing an electrically conductive metal layer on an electrically non-conductive substrate. Then an electronic circuit is electrically connected to the electrically conductive metal layer. Thereafter a portion of the electrically conductive metal layer is ablated with infrared laser radiation to form a pattern of electrically conductive areas and electrically non-conductive areas on the substrate, wherein at least a portion of the electrically conductive areas are electrically connected to the electronic circuit.

Abstract translation: 本发明提供了一种用于制造电子设备的物品和方法。 更具体地，本发明涉及通过激光烧蚀在非导电基底上制造导电材料的图案的制品和工艺。 这样的制品和工艺可用于生产RDIF器件，天线，电路，微波感应器，触点，导线，导体，交互式显示器，静电屏蔽装置等。 该方法首先在不导电的基底上提供导电金属层。 然后电子电路电连接到导电金属层。 此后，用红外激光辐射消除导电金属层的一部分，以在衬底上形成导电区域和非导电区域的图案，其中至少一部分导电区域电连接到电子电路 。