公开(公告)号：US4886686A

公开(公告)日：1989-12-12

申请号：US267275

申请日：1988-11-04

Applicant: Helmut Muenstedt

Inventor： Helmut Muenstedt

IPC: H05K1/02 ,  H05K1/03 ,  H05K7/20 ,  B32B9/00

CPC classification number: H05K1/0373 ,  H05K1/0353 ,  H05K1/0203 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0215 ,  Y10S428/901 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/256 ,  Y10T428/2982 ,  Y10T428/31511 ,  Y10T428/31533 ,  Y10T428/31721 ,  Y10T428/31942

Abstract: A circuit board substrate of good thermal conductivity comprises a composite formed from(A) an electrically and thermally insulating plastic and(B) a plastic incorporating a thermally highly conductive filler.

Abstract translation: 具有良好导热性的电路板基底包括由（A）绝热塑料和（B）包含热高导电性填料的塑料形成的复合体。

公开(公告)号：USRE32942E

公开(公告)日：1989-06-06

申请号：US863655

申请日：1986-05-15

Applicant: Sheldon H. Butt

Inventor： Sheldon H. Butt

IPC: B22F1/00 ,  B32B15/01 ,  B32B15/16 ,  C04B26/02 ,  C22C32/00 ,  H01L23/373 ,  H05K1/03 ,  H05K1/05

CPC classification number: C22C32/00 ,  B22F1/0003 ,  B32B15/01 ,  B32B15/16 ,  C04B26/02 ,  H01L23/3733 ,  H05K1/0306 ,  H05K1/05 ,  C04B2111/00844 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/068 ,  Y10T428/12014 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/125 ,  Y10T428/12514 ,  Y10T428/12528 ,  Y10T428/24942 ,  Y10T428/31678

Abstract: A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C. Second material particles having a coefficient of thermal expansion in the range of about 100.times.10.sup.-7 to about 200.times.10.sup.-7 in/in/.degree.C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C.

公开(公告)号：US4643798A

公开(公告)日：1987-02-17

申请号：US721460

申请日：1985-04-09

Applicant: Mitsuyuki Takada ,  Yoshiyuki Morihiro ,  Hayato Takasago

Inventor： Mitsuyuki Takada ,  Yoshiyuki Morihiro ,  Hayato Takasago

IPC: H05K3/12 ,  H05K3/18 ,  H05K3/38 ,  B44C1/22 ,  C03C15/00

CPC classification number: C23C18/2006 ,  C23C18/22 ,  H05K3/185 ,  H05K3/387 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2203/0773 ,  H05K2203/107

Abstract: In manufacturing a composite having a conductive layer on the surface of a resin layer, first the resin layer of a mixture of a resin material and filler elements is formed on a substrate and the resin material of the surface of the resin layer is selectively etched with respect to the filler elements to expose a portion of the filler elements, and then the filler elements, as exposed on the selectively etched surface of the resin layer, are selectively etched with respect to the resin material to form unevenness. Then catalyst nuclei are formed for electroless plating on the selectively etched surface having the unevenness and then a conductive metallic layer is formed by an electroless plating process on the selectively etched surface having unevenness. As a result, a composite of the above described structure is provided.

Abstract translation: 在制造在树脂层的表面具有导电层的复合体时，首先在基板上形成树脂材料和填充材料的混合物的树脂层，并且用树脂层表面的树脂材料选择性地蚀刻具有树脂层表面的树脂材料 相对于填充元件暴露一部分填充元件，然后暴露在树脂层的选择性蚀刻表面上的填充元素相对于树脂材料被选择性地蚀刻以形成不均匀性。 然后在具有不平坦度的选择性蚀刻表面上形成催化剂核以进行化学镀，然后通过在具有凹凸的选择性蚀刻表面上的无电镀处理形成导电金属层。 结果，提供了上述结构的复合材料。

公开(公告)号：US4569692A

公开(公告)日：1986-02-11

申请号：US539449

申请日：1983-10-06

Applicant: Sheldon H. Butt

Inventor： Sheldon H. Butt

IPC: B22F1/00 ,  B32B15/01 ,  B32B15/16 ,  C04B26/02 ,  C22C32/00 ,  H01L23/15 ,  H01L23/373 ,  H05K1/03 ,  H05K1/05 ,  C22C29/12

CPC classification number: H05K1/05 ,  B22F1/0003 ,  B32B15/01 ,  B32B15/16 ,  C04B26/02 ,  C22C32/00 ,  H01L23/15 ,  H01L23/3733 ,  H01L23/3736 ,  H05K1/0306 ,  H05K1/0373 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/12014 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/125 ,  Y10T428/12514 ,  Y10T428/12528 ,  Y10T428/24942 ,  Y10T428/31678

Abstract: A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C. Second material particles having a coefficient of thermal expansion in the range of about 100.times.10.sup.-7 to about 200.times.10.sup.-7 in/in/.degree.C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C.

Abstract translation: 提供了一种适用于电子应用的基板的复合材料。 复合材料包括具有约-20×10 -7至约50×10 -7 in / in /℃范围内的热膨胀系数的第一材料颗粒。具有在约100×10-7范围内的热膨胀系数的第二材料颗粒 至约200×10 -7 in / in /℃与第一材料颗粒混合。 粘合剂将第一和第二材料颗粒粘附在约1×10 -7至约50×10 -7 in / in /℃范围内的热膨胀系数的粘结复合材料中。

公开(公告)号：US11849540B2

公开(公告)日：2023-12-19

申请号：US17728567

申请日：2022-04-25

Applicant: THE GOVERNORS OF THE UNIVERSITY OF ALBERTA

Inventor： Hyun-Joong Chung ,  Jana Rieger ,  Thanh-Giang La ,  Shide Qiu ,  Dylan Scott

IPC: H05K1/03 ,  H05K3/12 ,  H05K1/02 ,  A61B5/296 ,  A61B5/0205 ,  A61B5/00 ,  C09D11/10 ,  H05K1/09 ,  A61B5/291 ,  A61B5/297 ,  A61B5/28 ,  A61B5/0245 ,  A61B5/08 ,  C08K3/08

CPC classification number: H05K1/0283 ,  A61B5/02055 ,  A61B5/296 ,  A61B5/6804 ,  C09D11/10 ,  H05K1/095 ,  H05K3/125 ,  A61B5/0245 ,  A61B5/0816 ,  A61B5/28 ,  A61B5/291 ,  A61B5/297 ,  A61B2562/0209 ,  A61B2562/0247 ,  A61B2562/0261 ,  A61B2562/164 ,  A61B2562/166 ,  C08K3/08 ,  C08K2003/0806 ,  H05K1/038 ,  H05K2201/0116 ,  H05K2201/0215 ,  H05K2201/0245 ,  H05K2201/0278 ,  H05K2201/09263 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: The development of stretchable, mechanically and electrically robust interconnects by printing an elastic, silver-based composite ink onto stretchable fabric. Such interconnects can have conductivity of 3000-4000 S/cm and are durable under cyclic stretching. In serpentine shape, the fabric-based conductor is enhanced in electrical durability. Resistance increases only ˜5 times when cyclically stretched over a thousand times from zero to 30% strain at a rate of 4% strain per second due to the ink permeating the textile structure. The textile fibers are ‘wetted’ with composite ink to form a conductive, stretchable cladding of the silver particles. The e-textile can realize a fully printed, double-sided electronic system of sensor-textile-interconnect integration. The double-sided e-textile can be used for a surface electromyography (sEMG) system to monitor muscles activities, an electroencephalography (EEG) system to record brain waves, and the like.

公开(公告)号：US10010980B2

公开(公告)日：2018-07-03

申请号：US14697717

申请日：2015-04-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K35/02 ,  B23K1/00 ,  B23K35/26 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H01L23/00 ,  H05K3/34 ,  B23K35/36 ,  B23K35/362 ,  B23K101/40

CPC classification number: B23K35/025 ,  B23K1/00 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/362 ,  B23K2101/40 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/11332 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/81192 ,  H01L2224/81211 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83211 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  Y10T403/479 ,  Y10T428/31678 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, the second metal is one of (1) a Cu—Mn alloy in which a ratio of Mn to the second metal is 5 to 30% by weight and (2) a Cu—Ni alloy in which a ratio of Ni to the second metal is 5 to 20% by weight, and a ratio of the second metal to the metal component is 36.9% by volume or greater.

公开(公告)号：US09986636B2

公开(公告)日：2018-05-29

申请号：US15476235

申请日：2017-03-31

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler ,  Ralf Otremba

IPC: H05K3/02 ,  H05K1/03 ,  H05K1/02 ,  H05K3/40 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/036 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/0094 ,  H05K3/02 ,  H05K3/105 ,  H05K3/4038 ,  H05K3/4626 ,  H05K2201/0104 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0281 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10T29/49126 ,  Y10T428/24909

Abstract: A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer. The polymer includes at least one of a carbon layer structure and a carbon-like layer structure.

公开(公告)号：US09943930B2

公开(公告)日：2018-04-17

申请号：US14749703

申请日：2015-06-25

Applicant: Koninklijke Philips N.V. ,  Mat-Tech B.V.

Inventor： Nicolaas Johannes Antonius Van Veen ,  Mohammad Hossain Biglari

IPC: B23K1/20 ,  B23K35/26 ,  B23K35/24 ,  B23K35/28 ,  B23K35/02 ,  H05K3/34 ,  H01L23/00 ,  H05K1/14

CPC classification number: B23K35/262 ,  B23K35/0222 ,  B23K35/24 ,  B23K35/26 ,  B23K35/264 ,  B23K35/28 ,  B23K35/286 ,  H01L24/29 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/14 ,  H05K3/3484 ,  H05K2201/0215 ,  Y10T428/12028 ,  Y10T428/1216 ,  Y10T428/24826 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.

公开(公告)号：US20170188455A1

公开(公告)日：2017-06-29

申请号：US14998263

申请日：2015-12-26

Applicant: Intel Corporation

Inventor： Yoshihiro Tomita ,  Joshua D. Heppner ,  Shawna M. Liff ,  Pramod Malatkar

IPC: H05K1/03 ,  H05K1/18 ,  A41D13/00 ,  H05K3/00 ,  A41D1/00 ,  A43B3/00 ,  H05K1/11 ,  H05K3/32

CPC classification number: H05K1/0393 ,  A41D1/002 ,  A41D13/0015 ,  A43B1/0054 ,  A43B3/0005 ,  H05K1/03 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/007 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/0203 ,  H05K2201/0215 ,  H05K2201/08 ,  H05K2201/083 ,  H05K2203/0152 ,  H05K2203/104

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

公开(公告)号：US20160157343A1

公开(公告)日：2016-06-02

申请号：US14944338

申请日：2015-11-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKATOSHI ABE ,  TOMOAKI SAWADA ,  SHINGO YOSHIOKA

IPC: H05K1/03 ,  C09J171/00 ,  H05K1/02

CPC classification number: H05K1/0393 ,  C09J171/00 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/0373 ,  H05K1/189 ,  H05K3/0014 ,  H05K2201/0108 ,  H05K2201/0195 ,  H05K2201/0215 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/0278 ,  H05K2201/0281 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: A sheet-shaped stretchable structure used as an electronics element has a stretch of not less than 10% and includes a plurality of laminated stretchable resin sheet, and at least one hollow is provided between at least one of pairs of two adjacent ones of the laminated stretchable resin sheets.

Abstract translation: 作为电子元件使用的片状可拉伸结构具有10％以上的拉伸倍率，并且包括多个层叠的可拉伸树脂片，并且在层叠的两个相邻层叠体中的至少一对之间设置有至少一个中空部 伸缩性树脂片。