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    EMBEDDED WIRING BOARD AND A MANUFACTURING METHOD THEREOF
    83.
    发明申请
    EMBEDDED WIRING BOARD AND A MANUFACTURING METHOD THEREOF 有权
    嵌入式接线板及其制造方法

    公开(公告)号：US20120231179A1

    公开(公告)日：2012-09-13

    申请号：US13474735

    申请日：2012-05-18

    Applicant: Cheng-Po Yu

    Inventor： Cheng-Po Yu

    IPC: H05K3/00 ,  C25D5/02 ,  B05D3/06

    CPC classification number: H05K3/0035 ,  H05K3/107 ,  H05K3/465 ,  H05K2201/0236 ,  H05K2201/0959 ,  H05K2201/09845 ,  H05K2203/1476 ,  Y10T29/49155

    Abstract: An embedded wiring board includes an upper wiring layer, a lower wiring layer, an insulation layer, a first conductive pillar and a second conductive pillar. The upper wiring layer contains an upper pad, the lower wiring layer contains a lower pad, and the insulation layer contains an upper surface and a lower surface opposite to the upper surface. The upper pad is embedded in the upper surface and the lower pad is embedded in the lower surface. The first conductive pillar is located in the insulation layer and includes an end surface which is exposed by the upper surface. A height of the first conductive pillar relative to the upper surface is larger than a depth of the upper pad relative to the upper surface. In addition, the second conductive pillar is located in the insulation layer and is connected between the first conductive pillar and the lower pad.

    Abstract translation: 嵌入布线板包括上布线层，下布线层，绝缘层，第一导电柱和第二导电柱。 上布线层包含上焊盘，下布线层包含下焊盘，绝缘层包含与上表面相对的上表面和下表面。 上垫片嵌入在上表面中，下垫片嵌入下表面。 第一导电柱位于绝缘层中，并且包括由上表面暴露的端面。 第一导电柱相对于上表面的高度大于上垫相对于上表面的深度。 此外，第二导电柱位于绝缘层中并连接在第一导电柱和下垫之间。

    EMBEDDED WIRING BOARD AND A MANUFACTURING METHOD THEREOF
    86.
    发明申请
    EMBEDDED WIRING BOARD AND A MANUFACTURING METHOD THEREOF 有权
    嵌入式接线板及其制造方法

    公开(公告)号：US20110048783A1

    公开(公告)日：2011-03-03

    申请号：US12613072

    申请日：2009-11-05

    Applicant: Cheng-Po YU

    Inventor： Cheng-Po YU

    IPC: H05K1/11 ,  H05K3/10

    CPC classification number: H05K3/0035 ,  H05K3/107 ,  H05K3/465 ,  H05K2201/0236 ,  H05K2201/0959 ,  H05K2201/09845 ,  H05K2203/1476 ,  Y10T29/49155

    Abstract: An embedded wiring board includes an upper wiring layer, a lower wiring layer, an insulation layer, a first conductive pillar and a second conductive pillar. The upper wiring layer contains an upper pad, the lower wiring layer contains a lower pad, and the insulation layer contains an upper surface and a lower surface opposite to the upper surface. The upper pad is embedded in the upper surface and the lower pad is embedded in the lower surface. The first conductive pillar is located in the insulation layer and includes an end surface which is exposed by the upper surface. A height of the first conductive pillar relative to the upper surface is larger than a depth of the upper pad relative to the upper surface. In addition, the second conductive pillar is located in the insulation layer and is connected between the first conductive pillar and the lower pad.

    Abstract translation: 嵌入布线板包括上布线层，下布线层，绝缘层，第一导电柱和第二导电柱。 上布线层包含上焊盘，下布线层包含下焊盘，绝缘层包含与上表面相对的上表面和下表面。 上垫片嵌入在上表面中，下垫片嵌入下表面。 第一导电柱位于绝缘层中，并且包括由上表面暴露的端面。 第一导电柱相对于上表面的高度大于上垫相对于上表面的深度。 此外，第二导电柱位于绝缘层中并连接在第一导电柱和下垫之间。

    High-current traces on plated molded interconnect device
    87.
    发明申请
    High-current traces on plated molded interconnect device 审中-公开
    电镀模制互连器件上的大电流迹线

    公开(公告)号：US20080171181A1

    公开(公告)日：2008-07-17

    申请号：US11652361

    申请日：2007-01-11

    Applicant: Victor Zaderej

    Inventor： Victor Zaderej

    IPC: B32B3/00 ,  B29C59/00 ,  B29C41/22 ,  B29D31/00 ,  B32B15/08

    CPC classification number: H05K1/0373 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09981 ,  H05K2203/107 ,  Y10T428/24802 ,  Y10T428/24917

    Abstract: A molded interconnect device with a high-current trace and methods of making a molded interconnect device with a high-current trace are described. The molded interconnect device comprises a substrate surface and an interconnect pattern. The interconnect pattern is at least one of a rib raised from the substrate surface and a channel protruding into the substrate surface. In a first embodiment, the molded interconnect device is molded from photosensitive plastic molded in a one-shot molding process. A trace is grown on the portion of the interconnect pattern where an interconnect path has been written, either by a laser or by photolithography. In a second embodiment, the molded interconnect device is molded of plastic and the trace is grown by at least one of a mask and print-and-plate process and a mask and print-and-etch process. The trace forms at least one of an angle and a curve in cross section.

    Abstract translation: 描述了具有高电流迹线的模制互连装置和制造具有高电流迹线的模制互连装置的方法。 模制的互连装置包括衬底表面和互连图案。 互连图案是从基板表面凸起的肋和突出到基板表面的通道中的至少一个。 在第一实施例中，模制的互连装置由在一次成型工艺中模制的光敏塑料模制而成。 通过激光或通过光刻法在互连图案的已经写入互连路径的部分上生长迹线。 在第二实施例中，模制的互连装置由塑料模制而成，并且通过掩模和印刷和印版工艺以及掩模和印刷和蚀刻工艺中的至少一种生长迹线。 轨迹形成截面中的角度和曲线中的至少一个。

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