公开(公告)号：US08602593B2

公开(公告)日：2013-12-10

申请号：US12579946

申请日：2009-10-15

Applicant: Joshua Josiah Markle ,  Robert Edward Higley

Inventor： Joshua Josiah Markle ,  Robert Edward Higley

IPC: F21V21/00

CPC classification number: F21K9/00 ,  F21V19/0055 ,  F21V29/76 ,  F21V29/763 ,  F21V29/85 ,  H01L25/0753 ,  H01L2224/48227 ,  H01L2924/19107 ,  H05K1/021 ,  H05K3/0058 ,  H05K3/32 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09163 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10409

Abstract: Lamp assemblies and methods of making the same are provided. Such a lamp assembly can include a heat sink and a light-emitting diode package that can be mounted to the heat sink. The light-emitting diode package can include a substrate with a top surface and bottom surface, a lens, and electrical contacts on the surface of the substrate. The lamp assembly can also include a printed circuit board with a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface. The printed circuit board can have electrical contacts thereon for electrical connection with the electrical contacts of the light-emitting diode package. The substrate of the light-emitting diode package can engage the opening of the printed circuit board to mechanically couple the light-emitting diode package to the printed circuit board. When assembled, a bottom surface of the substrate can be flush and aligned with a rear surface of the printed circuit board.

Abstract translation: 提供灯组件及其制造方法。 这种灯组件可以包括可以安装到散热器的散热器和发光二极管封装。 发光二极管封装可以包括具有顶表面和底表面的基板，透镜以及在基板表面上的电触点。 灯组件还可以包括具有面表面的印刷电路板，与表面相对的后表面和从表面延伸到后表面的开口。 印刷电路板可以在其上具有电接触以与发光二极管封装的电触点电连接。 发光二极管封装的基板可以接合印刷电路板的开口以将发光二极管封装机械耦合到印刷电路板。 当组装时，衬底的底表面可以与印刷电路板的后表面齐平并对齐。

公开(公告)号：US08587485B2

公开(公告)日：2013-11-19

申请号：US12797421

申请日：2010-06-09

Applicant: Ui-Soo Tahk ,  Kyoung-Hwa Kim

Inventor： Ui-Soo Tahk ,  Kyoung-Hwa Kim

IPC: H01Q1/24

CPC classification number: H05K3/366 ,  H01Q1/243 ,  H01Q1/38 ,  H01R13/2442 ,  H01R2201/02 ,  H04M1/236 ,  H05K1/141 ,  H05K1/182 ,  H05K3/325 ,  H05K3/403 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10446 ,  Y02P70/611

Abstract: A portable terminal includes a circuit board having edge and component mounting surfaces. The edge surface includes a first contact terminal and an antenna includes a second contact terminal. The component mounting surface is at least substantially parallel with a display screen of the terminal and the edge surface is at least substantially perpendicular to the display screen. The first and second contact terminals are coupled together to establish an electrical connection between the circuit board and antenna when the antenna and edge surface are mounted in parallel to one another within a housing of the terminal.

Abstract translation: 便携式终端包括具有边缘和部件安装表面的电路板。 边缘表面包括第一接触端子，天线包括第二接触端子。 元件安装表面至少基本上与端子的显示屏平行，并且边缘表面至少基本上垂直于显示屏。 当天线和边缘表面在端子的壳体内彼此平行地安装时，第一和第二接触端子耦合在一起以在电路板和天线之间建立电连接。

公开(公告)号：US08567050B2

公开(公告)日：2013-10-29

申请号：US13274188

申请日：2011-10-14

Applicant: Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

Inventor： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

IPC: H05K3/34

CPC classification number: G06F1/1632 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01R12/57 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/326 ,  H05K3/4046 ,  H05K5/0278 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2203/1316 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/53209 ,  H01L2224/85 ,  H01L2924/00014

Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device 101 includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. A single-shot molding process is used to form both an upper housing portion on the upper PCB surface that includes ribs extending between adjacent contact pads, and a lower molded housing portion that is formed over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs.

Abstract translation: 双重个性扩展USB（EUSB）系统支持使用扩展的9针EUSB插座的USB和EUSB存储卡。 每个EUSB装置101包括PCBA，PCBA具有布置在PCB的上侧上的四个标准USB金属接触垫，以及延伸通过PCB中限定的开口的多个扩展用途接触弹簧。 使用单次成型工艺来形成上PCB表面上的上壳体部分，其包括在相邻接触垫之间延伸的肋，以及形成在无源部件上的下模制壳体部分和设置在下PCB表面上的IC管芯 。 使用SMT方法安装无源部件，并使用COB方法安装IC管芯。 扩展的9针EUSB插座包括通过标准USB金属触点和接触弹簧与PCBA通信的标准USB触点和扩展使用触点。

公开(公告)号：US08531821B2

公开(公告)日：2013-09-10

申请号：US13016701

申请日：2011-01-28

Applicant: Eli Holzman ,  Paul Brian Hafeli ,  Robert Michael Sterns

Inventor： Eli Holzman ,  Paul Brian Hafeli ,  Robert Michael Sterns

IPC: H05K7/10 ,  H05K7/12

CPC classification number: H05K3/3436 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/52 ,  H05K2201/0311 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

Abstract: In accordance with the teaching of the present invention, a system and method for securing a ball grid array to a printed wire board is provided. In a particular embodiment, a ball grid array comprises one or more balls configured to attach to a spring comprising one or more turns. In addition, there is a spacer plate configured to align and separate the springs, a soldering aid configured to align solder on the printed wire board and a printed wire board configured with conductive pads to attach to the ball grid array via the springs.

Abstract translation: 根据本发明的教导，提供了一种用于将球栅阵列固定到印刷线板的系统和方法。 在特定实施例中，球栅阵列包括一个或多个球，其被配置为附接到包括一个或多个匝的弹簧。 此外，存在配置成对准和分离弹簧的间隔板，配置成将印刷线路板上的焊料对准的焊接辅助板和配置有导电焊盘的印刷线路板，以经由弹簧附接到球栅阵列。

公开(公告)号：US20130196471A1

公开(公告)日：2013-08-01

申请号：US13799168

申请日：2013-03-13

Applicant: Palo Alto Research Center Incorporated

Inventor： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

IPC: H01L21/50

CPC classification number: H01L21/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05599 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13005 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81903 ,  H01L2224/83193 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/0132 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/4015 ,  H05K2201/0311 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2924/01015 ,  H01L2924/01049 ,  H01L2924/01031 ,  H01L2224/13599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.

Abstract translation: 一种方法包括提供具有接触焊盘的焊盘芯片，提供具有微弹簧的弹簧芯片，将化学活化剂施加到衬垫芯片或弹簧芯片中的一个上，在衬垫的另一个上施加响应于化学活化剂的粘合剂 芯片或弹簧芯片，将焊盘芯片对准弹簧芯片，使得微弹簧将接触接触焊盘，并将焊盘芯片和弹簧芯片压在一起，使得化学活化器至少部分地固化粘合剂。

公开(公告)号：US20130194752A1

公开(公告)日：2013-08-01

申请号：US13361742

申请日：2012-01-30

Applicant: Carlo Baterna Marbella ,  Ganesh Vetrivel Periasamy ,  Kok Kiat Koo ,  Ai Min Tan

Inventor： Carlo Baterna Marbella ,  Ganesh Vetrivel Periasamy ,  Kok Kiat Koo ,  Ai Min Tan

IPC: H05K7/20 ,  H01L21/52 ,  H01L23/373

CPC classification number: H01L23/34 ,  H01L23/3121 ,  H01L23/49562 ,  H01L23/62 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/29101 ,  H01L2224/29116 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0201 ,  H05K2201/0311 ,  H05K2201/10166 ,  H05K2203/176 ,  H01L2224/45099 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In accordance with an embodiment, a semiconductor package includes a first surface configured to be mounted on a circuit board, and a region of thermally expandable material configured to push the first surface of the semiconductor package away from the circuit board when a temperature of the thermally expandable material exceeds a first temperature.

Abstract translation: 根据实施例，半导体封装包括被配置为安装在电路板上的第一表面和可热膨胀材料的区域，该区域被构造成当热电阻的温度推动半导体封装的第一表面远离电路板时 可膨胀材料超过第一温度。

公开(公告)号：US08451616B2

公开(公告)日：2013-05-28

申请号：US13093650

申请日：2011-04-25

Applicant: Takahiro Sugai

Inventor： Takahiro Sugai

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K3/325 ,  G06F1/169 ,  G06F3/03547 ,  H05K3/1241 ,  H05K7/1076 ,  H05K2201/0311 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0999 ,  H05K2201/10409

Abstract: According to one embodiment, an electronic apparatus includes a housing, a wiring pattern, a recess, a pad portion, and an electronic component. The wiring pattern is formed on an inner surface of the housing from an electrically conductive adhesive. The recess is in the inner surface of the housing. The pad portion is formed in the recess from the conductive adhesive and connected to an end portion of the wiring pattern. The electronic component includes a terminal which contacts the pad portion.

Abstract translation: 根据一个实施例，电子设备包括壳体，布线图案，凹部，垫部分和电子部件。 布线图案由导电粘合剂形成在外壳的内表面上。 凹槽位于壳体的内表面。 焊盘部分从导电粘合剂形成在凹部中并连接到布线图案的端部。 电子部件包括接触焊盘部分的端子。

公开(公告)号：US08409461B2

公开(公告)日：2013-04-02

申请号：US11566847

申请日：2006-12-05

Applicant: Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

Inventor： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC: C03C15/00 ,  C03C25/68 ,  H05K3/00

CPC classification number: H05K3/4092 ,  H05K2201/0311 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: The present invention is to provide a method of manufacturing a printed wiring board with a component mounting pin to connect a printed wiring board and an electronic component. A method of manufacturing a printed wiring board (1) with a component mounting pin (18) at a stage to form a component mounting surface after layers of a predetermined number were formed includes the steps of forming a conductive land (11) on the component mounting surface, covering the component mounting surface with an insulating layer (12) except the conductive land (11) of the component mounting surface, partly forming near the conductive land (11) of the upper surface of the insulating layer (12) a sacrificial layer (14) which can be removed in the subsequent process, forming conductive layers (16, 17) on the upper surfaces of the conductive land (11) and the sacrificial layer (14) with a plating process to pattern the conductive layers (16, 17), forming the component mounting pin (18) elongated from the conductive land (11) by partly removing the sacrificial layer (14) located under the patterned conductive layers (16, 17) and erecting the component mounting pin (18).

Abstract translation: 本发明提供一种制造印刷电路板的方法，该印刷电路板具有用于连接印刷电路板和电子部件的元件安装销。 在形成预定数量的层之后形成部件安装表面的阶段，制造具有部件安装销（18）的印刷电路板（1）的方法包括以下步骤：在部件上形成导电焊盘（11） 在绝缘层（12）的上表面附近形成靠近绝缘层（12）的导电焊盘（11）附近的除了元件安装表面的导电焊盘（11）之外的绝缘层（12）覆盖部件安装表面， （14），其可以在随后的工艺中去除，在导电焊盘（11）和牺牲层（14）的上表面上形成导电层（16,17），用电镀工艺对导电层（16）进行图案化 ，17），通过部分去除位于图案化导电层（16,17）下方的牺牲层（14）并竖立元件安装销（18），形成从导电焊盘（11）延伸的部件安装销（18）。

公开(公告)号：US20130063906A1

公开(公告)日：2013-03-14

申请号：US13474804

申请日：2012-05-18

Applicant: Yong-Nian CHEN ,  Li-Fu XU ,  Yue-Yong LI ,  Jin-Wen OU

Inventor： Yong-Nian CHEN ,  Li-Fu XU ,  Yue-Yong LI ,  Jin-Wen OU

IPC: H05K7/00 ,  H05K1/02

CPC classification number: H05K9/0039 ,  H05K1/0215 ,  H05K3/4015 ,  H05K2201/0311

Abstract: An electronic device includes a chassis, a circuit board and the resilient piece. The chassis includes a bottom panel. The circuit board has a ground plane. The resilient piece includes a soldering portion and a resisting portion. The soldering portion is in electrical connection with the ground plane, and the resisting piece abuts the bottom panel to prevent the electromagnetic interference (EMI) from the circuit board.

Abstract translation: 电子设备包括底盘，电路板和弹性片。 底盘包括底板。 电路板有一个接地层。 弹性件包括焊接部分和电阻部分。 焊接部分与接地平面电连接，并且电阻件邻接底板以防止电路板的电磁干扰（EMI）。

公开(公告)号：US08376787B2

公开(公告)日：2013-02-19

申请号：US13123029

申请日：2009-10-07

Applicant: Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

Inventor： Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

IPC: H01R24/00

CPC classification number: H04Q1/136 ,  H01R4/2433 ,  H01R13/2421 ,  H01R13/4538 ,  H01R13/465 ,  H01R13/6473 ,  H01R13/6616 ,  H01R13/6625 ,  H01R24/64 ,  H01R2201/04 ,  H04L41/12 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09445 ,  H05K2201/10189

Abstract: A termination unit (144) for use with a system that permits the monitoring of a computer network to perform network inventories. The termination unit takes the form of a cap that engages the termination face of a network jack and has a sensing circuit (246) integrated therewith so that, once engaged with the jack, the sensing circuit is connected to two terminals of the jack. The sensing circuit may include a resistor, capacitor or inductor, any of which provide a known sensing value that is different than a sensed value of an end-user device used on the network, but less than infinity so that the system senses when an end-user device is connected to or disconnected from the network.

Abstract translation: 一种与允许监视计算机网络执行网络清单的系统一起使用的终端单元（144）。 终端单元采用与网络插座的端接面接合的帽的形式，并且具有与其一体化的感测电路（246），使得一旦与插座接合，感测电路连接到插座的两个端子。 感测电路可以包括电阻器，电容器或电感器，其中任一个提供与网络上使用的终端用户设备的感测值不同但已经小于无穷远的已知感测值，使得系统感测何时结束 用户设备连接到网络或与网络断开连接。