公开(公告)号：US07002362B2

公开(公告)日：2006-02-21

申请号：US10832483

申请日：2004-04-26

Applicant: Warren M. Farnworth ,  Salman Akram

Inventor： Warren M. Farnworth ,  Salman Akram

IPC: G01R31/02 ,  G01R31/26

CPC classification number: H05K3/326 ,  G01R1/0466 ,  G01R31/2853 ,  H05K1/118 ,  H05K3/4092 ,  H05K2201/0373 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/09081 ,  H05K2201/10734 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An interconnect for testing semiconductor components includes a substrate, and contacts on the substrate for making temporary electrical connections with bumped contacts on the components. Each contact includes a recess and a pattern of leads cantilevered over the recess configured to electrically engage a bumped contact. The leads are adapted to move in a z-direction within the recess to accommodate variations in the height and planarity of the bumped contacts. In addition, the leads can include projections for penetrating the bumped contacts, a non-bonding outer layer for preventing bonding to the bumped contacts, and a curved shape which matches a topography of the bumped contacts. The leads can be formed by forming a patterned metal layer on the substrate, by attaching a polymer substrate with the leads thereon to the substrate, or be etching the substrate to form conductive beams.

Abstract translation: 用于测试半导体部件的互连件包括基板和基板上的触点，用于与部件上的凸起触点进行临时电连接。 每个接触件包括一个凹部和悬在该凹部上的引线图案，其构造成电接合凸起的触点。 引线适于在凹部内在z方向上移动以适应凸起接触件的高度和平面度的变化。 此外，引线可以包括用于穿透凸起的触点的突起，用于防止与凸起的触点接合的非结合外层以及与凸起的触点的形状相匹配的弯曲形状。 可以通过在基板上形成图案化的金属层，通过将聚合物基板与其上的引线附接到基板上，或者蚀刻基板以形成导电梁来形成引线。

公开(公告)号：US20050272276A1

公开(公告)日：2005-12-08

申请号：US11135511

申请日：2005-05-24

Applicant: Yasunari Ooyabu

Inventor： Yasunari Ooyabu

IPC: H05K1/11 ,  H01R33/00 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36

CPC classification number: H05K1/142 ,  H01R12/61 ,  H05K3/0058 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/0969 ,  H05K2201/2009

Abstract: In order to provide a wired circuit board in which electrical continuity inspection can be omitted and a connection structure of the wired circuit board, in connection between a first wired circuit board 1 and a second wired circuit board 2, a first connection terminal 13 and a second connection terminal 14 are abutted against each other in the direction in which they are opposed along the respective longitudinal direction of the wired circuit boards, and are arranged in line with each other, and a solder bump 15 is provided so as to continuously extend over surfaces of the first connection terminal 13 and the second connection terminal 14. Consequently, the solder bump 15 is not interposed between opposed surfaces of the first connection terminal 13 and the second connection terminal 14, thereby allowing electrical connection by the solder bump 15 between the first connection terminal 13 and the second connection terminal 14 to be confirmed from the appearance by visual observation.

Abstract translation: 为了提供可以省略电连续性检查的布线电路板和布线电路板的连接结构，在第一布线电路板1和第二布线电路板2之间连接第一连接端子13和 第二连接端子14沿着与布线电路板的纵向方向相对的方向彼此抵接，并且彼此排成一列，并且设置焊料凸块15，以连续地延伸越过 第一连接端子13和第二连接端子14的表面。 因此，焊料凸块15不插入在第一连接端子13和第二连接端子14的相对的表面之间，从而允许由第一连接端子13和第二连接端子14之间的焊料凸块15进行电连接以从 通过目视观察外观。

公开(公告)号：US20050239342A1

公开(公告)日：2005-10-27

申请号：US10506019

申请日：2003-10-24

Applicant: Hideo Moriyama ,  Munehiko Yanagita ,  Koichi Yanagita

Inventor： Hideo Moriyama ,  Munehiko Yanagita ,  Koichi Yanagita

IPC: H01L33/48 ,  H05K1/00 ,  H05K3/20 ,  H05K3/32 ,  H01R24/00

CPC classification number: H05K3/202 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0287 ,  H05K1/0393 ,  H05K3/326 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10106 ,  Y10S362/80

Abstract: The present invention provides a light emitting module, comprising: a plurality of thin plate-shaped conductors (2) spaced apart from each other in a first direction; at least one light source (4) connected between at least one pair of adjoining ones of said conductors; and at least one insulating joint member (4) for mechanically joining said plurality of conductors, wherein said at least one insulating joint member exposes both sides of at least a portion of said conductors where said light source is mounted.

Abstract translation: 本发明提供了一种发光模块，包括：在第一方向上彼此间隔开的多个薄板状导体（2）; 至少一个光源（4），连接在至少一对相邻的所述导体之间; 以及用于机械地连接所述多个导体的至少一个绝缘接合构件（4），其中所述至少一个绝缘接合构件暴露所述导体的至少一部分的所述光源安装的两侧。

公开(公告)号：US20050221680A1

公开(公告)日：2005-10-06

申请号：US11093266

申请日：2005-03-28

Applicant: Gary Yasumura ,  Joseph Fjelstad ,  Kevin Grundy ,  William Wiedemann ,  Matthew Stepovich

Inventor： Gary Yasumura ,  Joseph Fjelstad ,  Kevin Grundy ,  William Wiedemann ,  Matthew Stepovich

IPC: H01R4/58 ,  H01R12/16 ,  H01R12/24 ,  H01R13/24 ,  H01R24/00 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/326 ,  H01R12/714 ,  H01R12/79 ,  H01R13/2407 ,  H01R13/658 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/0979

Abstract: An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.

Abstract translation: 一种电互连装置，用于在要配合的两个导电元件的端部之间建立冗余触点，产生不具有电容短截线的电互连。

公开(公告)号：US06923919B2

公开(公告)日：2005-08-02

申请号：US09947082

申请日：2001-09-04

Applicant: Rui Yang ,  Guoping Mao

Inventor： Rui Yang ,  Guoping Mao

IPC: C08J7/12 ,  C09K13/02 ,  H01L21/60 ,  H05K3/00 ,  H05K3/38 ,  C30B33/00

CPC classification number: C09K13/02 ,  C08J7/12 ,  H05K3/002 ,  H05K3/381 ,  H05K2201/0141 ,  H05K2201/0397 ,  H05K2203/0786

Abstract: A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer as an etchant composition for the liquid crystal polymer substrate. Further treatment of the etched liquid crystal polymer substrate involves depositing an adherent metal layer on the etched liquid crystal polymer substrate. An adherent metal layer may be deposited using either electroless metal plating or vacuum deposition of metal such as by sputtering.When using electroless metal plating, a tin(II) solution applied to the liquid crystal polymer provides a treated liquid crystal polymer substrate to which the application of a palladium(II) solution provides the metal-seeded liquid crystal polymer. The etchant composition comprises a solution in water of from 35 wt. % to 55 wt. % of an alkali metal salt, and from 10 wt. % to 35 wt. % of a solubilizer dissolved in the solution to provide the etchant composition suitable for etching the liquid crystal polymer at a temperature from 50° C. to 120° C. A flexible circuit comprising a liquid crystal polymer film having through-holes and related shaped voids may be formed using etchant compositions as previously described.

Abstract translation: 一种提供金属种子液晶聚合物的方法，包括以下步骤：通过施加包含碱金属氢氧化物和增溶剂的水溶液作为液晶聚合物基材的蚀刻剂组合物来提供待处理的液晶聚合物基材。 蚀刻的液晶聚合物基板的进一步处理包括在蚀刻的液晶聚合物基板上沉积粘附金属层。 可以使用化学镀金属或真空沉积金属例如溅射来沉积粘附金属层。 当使用化学镀金属时，施加到液晶聚合物上的锡（II）溶液提供处理过的液晶聚合物基质，其中施加钯（II）溶液提供金属种子液晶聚合物。 蚀刻剂组合物包含在35重量％的水中的溶液。 ％至55重量％ ％的碱金属盐和10wt。 ％〜35重量％ 溶解在溶液中的％的增溶剂以提供适于在50℃至120℃的温度下蚀刻液晶聚合物的蚀刻剂组合物。包括具有通孔和相关形状空隙的液晶聚合物膜的柔性电路 可以使用如前所述的蚀刻剂组合物形成。

公开(公告)号：US20050155957A1

公开(公告)日：2005-07-21

申请号：US11070561

申请日：2005-03-02

Applicant: John Gregory

Inventor： John Gregory

IPC: B23K26/00 ,  B23K26/14 ,  B23K26/16 ,  B23K26/18 ,  H01L23/34 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K3/4084 ,  H01L2924/0002 ,  H05K1/184 ,  H05K3/0032 ,  H05K2201/0397 ,  H05K2201/09063 ,  Y10T29/49135 ,  H01L2924/00

Abstract: A method of forming an opening or cavity in a substrate, for receiving an electronic component, consists of or includes providing a patterned opaque masking layer on or adjacent a first major surface of the substrate, the masking layer having an opening overlying the position where the cavity is to be made, removing material from the substrate by laser ablation through the opening thereby forming an opening or cavity of a suitable size for receiving said electronic component.

公开(公告)号：US20050109631A1

公开(公告)日：2005-05-26

申请号：US11023162

申请日：2004-12-28

Applicant: Soon Kwon ,  Sang Lee ,  Yang Moon ,  Ki Hong ,  Yoon Cho

Inventor： Soon Kwon ,  Sang Lee ,  Yang Moon ,  Ki Hong ,  Yoon Cho

IPC: C23C28/00 ,  B32B15/08 ,  H01L21/60 ,  H01L23/495 ,  H05K1/00 ,  H05K1/02 ,  H05K3/24 ,  H05K3/28 ,  H01B13/00

CPC classification number: H05K3/244 ,  H01L23/49572 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T428/24917 ,  Y10T428/325 ,  H01L2924/00

Abstract: A tape substrate including an insulating film, a copper foil pattern formed on the insulating film at one side of the insulating film, and provided with a connecting area where an electronic element is to be mounted, a barrier layer plated on the copper foil pattern at the connecting area, and formed with a plurality of pores, and a tin layer plated on the barrier layer, and alloyed with a portion of the copper foil pattern corresponding to the connecting area, through the pores. A method for fabricating the tape substrate is also disclosed. In accordance with the invention, it is possible to reduce the time taken for the copper foil pattern to come into contact with the electroless tin plating solution used in the tin plating process, thereby preventing the copper component of the copper foil pattern from being eluted. Accordingly, there is no open-circuit fault caused by formation of pores. The barrier layer makes it possible to obtain an improved plating efficiency and to reduce the thickness of the alloy layer. In addition, the barrier layer serves to reduce internal stress generated at the interface between the tin layer and the copper foil pattern, thereby suppressing formation of voids. Accordingly, there is an effect of preventing a short circuit caused by the growth of whiskers.

Abstract translation: 一种带状基板，包括绝缘膜，在绝缘膜的一侧上的绝缘膜上形成的铜箔图案，并且设置有要安装电子元件的连接区域，镀在铜箔图案上的阻挡层 连接区域，并且形成有多个孔，以及镀在阻挡层上的锡层，并且与对应于连接区域的铜箔图案的一部分合金化。 还公开了一种用于制造带基材的方法。 根据本发明，可以减少铜箔图案与镀锡工艺中使用的化学镀锡溶液接触所花费的时间，从而防止铜箔图案的铜成分被洗脱。 因此，没有由孔形成引起的开路故障。 阻挡层可以获得提高的电镀效率并减小合金层的厚度。 此外，阻挡层用于减少在锡层和铜箔图案之间的界面处产生的内应力，从而抑制空隙的形成。 因此，存在防止晶须生长引起的短路的效果。

公开(公告)号：US06879465B2

公开(公告)日：2005-04-12

申请号：US10459343

申请日：2003-06-11

Applicant: Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

Inventor： Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  H05K1/18 ,  H05K3/34 ,  G11B21/22 ,  G11B5/54 ,  H05K1/11

CPC classification number: G11B5/4853 ,  G11B5/484 ,  G11B5/486 ,  H01L2224/742 ,  H05K1/189 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2203/041 ,  H05K2203/107 ,  H05K2203/159 ,  Y02P70/613 ,  Y10T29/49025 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/49046 ,  Y10T29/49144 ,  Y10T29/49179

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

公开(公告)号：US06870272B2

公开(公告)日：2005-03-22

申请号：US10123547

申请日：2002-04-16

Applicant: Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

Inventor： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

Abstract: An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

公开(公告)号：US20050035347A1

公开(公告)日：2005-02-17

申请号：US10889334

申请日：2004-07-12

Applicant: Igor Khandros ,  A. Sporck ,  Benjamin Eldridge

Inventor： Igor Khandros ,  A. Sporck ,  Benjamin Eldridge

IPC: B23K1/00 ,  B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01L23/58

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07364 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Abstract translation: 在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。 硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。 一个优选的主要接触是弹性弹簧接触。 空间变压器中的导电元件以更放松的间距被路由到第二触点。 在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。 硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。 可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。