Abstract:
A flexible circuit board (15) has one end portion (15a) soldered to a connection terminal row of a side surface (13e) of an ink-jet recording head (13), and extends upwardly from the ink jet recording head (13). The flexible circuit board (15) is bent at a midpoint at substantially right angles in the longitudinal direction of the flexible circuit board (15) to form a crease portion (15c). A forward end of the board (15) extends leftward, and is then folded back by 180 degrees to form a crease portion (15d). The forward end thereof extends rightward, and the forward end portion (15b) is soldered to a terminal row disposed on the back side of a COB substrate (24). A sheet-like double-faced tape having a drum-like cut-out shape is affixed to the crease portion (15c) in advance. When the flexible circuit board is folded along a crease line, the base material of the flexible printed wiring board at the cut-out part is adhered to the doubled-faced tape.
Abstract:
The present invention provides a system and method for combining a leaded package IC and a semiconductor die using a flex circuitry to reduce footprint for the combination. A leaded IC package is disposed along the obverse side of a flex circuit. In a preferred embodiment, leads of the leaded IC package are configured to allow the lower surface of the body of the leaded IC package to contact the surface of the flex circuitry either directly or indirectly through an adhesive. A semiconductor die is connected to the reverse side of the flex circuit. In one embodiment, the semiconductor die is disposed on the reverse side of the flex while, in an alternative embodiment, the semiconductor die is disposed into a window in the flex circuit to rest directly or indirectly upon the body of the leaded IC package. Module contacts are provided in a variety of configurations. In a preferred embodiment, the leaded IC package is a flash memory and the semiconductor die is a controller.
Abstract:
The present invention provides a system and method for combining a leaded package IC and a semiconductor die using a flex circuitry. The leaded packaged IC is disposed along one side of a flex circuit. The semiconductor die is disposed along the flex circuitry and preferably is between at least a part of the flex circuitry and the body of the leaded packaged IC. Preferably, the die is attached to a conductive layer of the flex circuitry. The flex circuitry preferably employs at least two conductive layers and the leaded packaged IC and die are preferably connected to one of the conductive layers of the flex circuitry. In preferred modules, the leaded packaged IC is preferably a flash memory device and the semiconductor die is preferably a controller.
Abstract:
A portable display panel includes a liquid crystal display panel for displaying images, a backlight assembly including a light source for supplying light to the liquid crystal display panel, a bottom chassis for receiving the backlight assembly, a first printed circuit board for controlling the liquid crystal display panel and the light source, a second printed circuit board connected to the first printed circuit board and an external drive circuit, and a protrusion extending from the first printed circuit board. The protrusion has copper film exposed on its end. The copper film of the protrusion is electrically connected to the bottom chassis.
Abstract:
An optical disk unit includes a tray for supporting an optical disk thereon, a body for receiving the tray therein, a first board provided at the body, a second board provided at the tray, and a wiring board (flexible board 3) electrically connecting the first board and the second board together. The wiring board (flexible board 3) has a number N of bent portions, the wiring board being bent at the number N of the bent portions of the wiring board, such that the wiring board is superposed in (N+1) layers where N is an integer equal to or greater than 1, and an area of the (N+1)-layer superposed portion is changed according to an amount of drawing-out of the tray.
Abstract:
A flexible board capable of being bent easily and precisely a plurality of times at desired positions has insulating layer exhibiting flexibility, a conductor layer and recessed angular portions situated in both side edges of the board so as to oppose each other. Three of more of these angular portions are disposed on each side edge of the board. More specifically, the flexible board has at least one constricted portion that reduces the width of the board. The constricted portion is situated on both side edges of the board in such a manner that the constricted portions oppose each other, and has at least one of a step portion having a step-like shape and a cut-out portion having a V- or U-like shape. Three or more step-like portions and cut-out portions are situated together on each side edge the board.
Abstract:
A touch panel device includes a wiring terminal, a flexible printed circuit film connected to the wiring terminal, an adhesion part corresponding to a location where the flexible printed circuit film is connected to the wiring terminal, and an adhesion-reinforcing part adjacent to the adhesion part for strengthening an adhesive bonding strength of the adhesion part.
Abstract:
A mobile communication terminal comprising a first unit comprising a circuit; a second unit comprising a rotating camera module; and a flexible printed circuit board connecting said circuit to said rotating camera module. The rotating camera module comprising a first peg forming a first turning point for said flexible circuit board to wind around in a first direction, wherein a wound path of said flexible circuit board around said first turning point virtually divides said flexible circuit board into a first region and a second region, said first region being defined by a first portion of said flexible circuit board extending from a connection point to said rotating camera module to said first peg, said second region being defined by a second portion of said flexible circuit board extending from said first peg to an area above said connection point.
Abstract:
An optical disc apparatus includes a pickup assembly, a first printed circuit board, a second printed circuit board, and a flexible printed circuit board. The pickup assembly is adapted to focus a laser beam through an objective lens onto an optical disc in order to retrieve data stored on the optical disc. The first printed circuit board is mounted on the pickup assembly and adapted to control an actuator for activating the objective lens. The second printed circuit board is mounted on the pickup assembly and adapted to instruct the first printed circuit board to activate the objective lens. The flexible printed circuit board is connected to each of the first and second printed circuit boards in order to establish electrical connection therebetween. The flexible printed circuit board is mounted in such a manner as to be twisted approximately in middle thereof.
Abstract:
A flexible circuit having improved tear resistance is provided. A flexible circuit, made of polyimide film, includes at least one extension which needs to be folded. To prevent tearing, an annular piece of metal, like an exposed copper pad for example, is placed at the apex of the bend angle. A second metal is then deposited atop the annular piece of metal, thereby reinforcing the annular piece of metal. The reinforced annular piece of metal helps to prevent the flexible circuit from tearing when shearing forces are applied to the extension. Experimental results have shown that the invention provides as much as a 285% increase in tear resistance when compared to prior art flexible circuits.