公开(公告)号：US20090126983A1

公开(公告)日：2009-05-21

申请号：US11942061

申请日：2007-11-19

Applicant: Paul M. Harvey ,  Douglas O. Powell ,  Wolfgang Sauter ,  Yaping Zhou

Inventor： Paul M. Harvey ,  Douglas O. Powell ,  Wolfgang Sauter ,  Yaping Zhou

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K1/115 ,  H05K1/0233 ,  H05K1/112 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/086 ,  H05K2201/09536 ,  H05K2201/096

Abstract: A method, system and apparatus for coating plated through holes (PTHs) to reduce impedance discontinuity in electronic packages. PTH vias are imbedded in the core of a printed circuit board comprising a core layer, a plurality of buildup layers, a plurality of micro-vias, and a plurality of traces. Traces electrically interconnect each of the micro-vias to PTH vias, forming an electrically conductive path. PTHs are coated with a magnetic metal material, such as nickel, to increase the internal and external conductance of the PTHs, thereby providing decreased impedance discontinuity of the signals in electronic packages.

Abstract translation: 一种用于涂覆电镀通孔（PTH）的方法，系统和装置，以减少电子封装中的阻抗不连续性。 PTH通孔嵌入印刷电路板的芯中，该印刷电路板包括芯层，多个堆积层，多个微通孔和多个迹线。 迹线将每个微通孔电连接到PTH通孔，形成导电路径。 PTH用诸如镍的磁性金属材料涂覆以增加PTH的内部和外部电导，从而在电子封装中提供信号的阻抗不连续性。

公开(公告)号：US20090123716A1

公开(公告)日：2009-05-14

申请号：US11886910

申请日：2006-03-17

Applicant: Tadahiro Ohmi

Inventor： Tadahiro Ohmi

IPC: H01B3/00 ,  B05D5/00 ,  H05K1/03 ,  B32B5/16

CPC classification number: H05K1/0373 ,  H05K1/0233 ,  H05K2201/0215 ,  H05K2201/0266 ,  H05K2201/086 ,  Y10T428/2495

Abstract: To provide a magnetic substance-containing insulator that can achieve an effect of increasing the permeability without comparatively increasing the mixing concentration of a magnetic substance and, by applying the thus obtained magnetic substance-containing insulator to a circuit board, that can improve the characteristic impedance and achieve an effect of reducing the power consumption, and to provide a circuit board and an electronic component each using such a magnetic substance-containing insulator.A magnetic substance-containing insulator 10 includes plural magnetic substance particles 1a, 1b and an insulator 2 holding the plural magnetic substance particles 1a, 1b, wherein a group of the magnetic substance particles is composed of plural particle sizes.

Abstract translation: 为了提供一种含磁性物质的绝缘体，其可以实现增加磁导率的效果，而不增加磁性物质的混合浓度，并且通过将如此获得的含磁性物质的绝缘体涂覆到电路板上，可以改善特性阻抗 并且实现降低功耗的效果，并且提供使用这种含磁性物质的绝缘体的电路板和电子部件。 含有磁性物质的绝缘体10包括多个磁性体颗粒1a，1b和保持多个磁性体颗粒1a，1b的绝缘体2，其中一组磁性体颗粒由多个粒径组成。

公开(公告)号：US20090103272A1

公开(公告)日：2009-04-23

申请号：US12091601

申请日：2006-10-30

Applicant: Mitsuhiro Watanabe

Inventor： Mitsuhiro Watanabe

IPC: H05K1/18

CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F2017/002 ,  H01F2017/0066 ,  H01F2017/0086 ,  H01F2027/2809 ,  H01L23/645 ,  H01L2224/16225 ,  H01L2924/13091 ,  H01L2924/19103 ,  H01L2924/19105 ,  H02M3/00 ,  H02M3/155 ,  H05K1/0233 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/10015 ,  H01L2924/00

Abstract: A DC-DC converter comprising a soft-magnetic, multi-layer substrate provided with a laminated coil constituted by connecting pluralities of conductor lines, and a semiconductor integrated circuit device comprising a switching device and a control circuit, which are mounted on the soft-magnetic, multi-layer substrate; the semiconductor integrated circuit device comprising an input terminal, an output terminal, a first control terminal for controlling the ON/OFF of the switching device, a second control terminal for variably controlling output voltage, and pluralities of ground terminals; the soft-magnetic, multi-layer substrate comprising first external terminals formed on a first main surface, first connecting wires formed on the first main surface and/or on nearby layers, second connecting wires formed between the side surface of the multi-layer substrate and a periphery of the laminated coil, and second external terminals formed on a second main surface; and terminals of the semiconductor integrated circuit device being connected to the first external terminals on the multi-layer substrate, at least part of the first external terminals being electrically connected to the second external terminals through the first and second connecting wires, and the input or output terminal being connected to the second external terminals via the laminated coil.

Abstract translation: 一种DC-DC转换器，包括具有通过连接多条导体线构成的层叠线圈的软磁性多层基板和包括开关装置和控制电路的半导体集成电路装置， 磁性，多层基板; 该半导体集成电路器件包括输入端子，输出端子，用于控制开关器件的导通/截止的第一控制端子，用于可变地控制输出电压的第二控制端子和多个接地端子; 所述软磁性多层基板包括形成在第一主表面上的第一外部端子，形成在第一主表面上和/或附近层上的第一连接线，形成在多层基板的侧表面之间的第二连接线 和层叠线圈的周边，第二外部端子形成在第二主面上; 并且所述半导体集成电路器件的端子连接到所述多层衬底上的所述第一外部端子，所述第一外部端子的至少一部分通过所述第一和第二连接线电连接到所述第二外部端子，并且所述输入或 输出端子经由层叠线圈与第二外部端子连接。

公开(公告)号：US07515435B2

公开(公告)日：2009-04-07

申请号：US11646339

申请日：2006-12-28

Applicant: Uei-Ming Jow ,  Chang-Sheng Chen ,  Chin-Sun Shyu ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Ying-Jiunn Lai

Inventor： Uei-Ming Jow ,  Chang-Sheng Chen ,  Chin-Sun Shyu ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Ying-Jiunn Lai

IPC: H05K1/16

CPC classification number: H01L23/14 ,  H01F17/0006 ,  H01F41/046 ,  H01F2017/0066 ,  H01G4/30 ,  H01G4/40 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/086 ,  H05K2201/09672 ,  H01L2924/00

Abstract: A multi-functional composite substrate structure is provided. The first substrate with high dielectric constant and the second substrate with low dielectric constant and low loss tangent are interlaced above the third substrate. One or more permeance blocks may be formed above each substrate, so that one or more inductors may be fabricated thereon. One or more capacitors may be fabricated on the first substrate. Also, one or more signal transmission traces of the system impedance are formed on the second substrate of the outside layer. Therefore, the inductance of the inductor(s) is effectively enhanced. Moreover, the area of built-in components is reduced. Furthermore, it has shorter delay time, smaller dielectric loss, and better return loss for the transmission of high speed and high frequency signal.

Abstract translation: 提供了多功能复合基板结构。 具有高介电常数的第一衬底和具有低介电常数和低损耗角正切的第二衬底交错在第三衬底之上。 可以在每个衬底上方形成一个或多个磁导块，从而可以在其上制造一个或多个电感器。 可以在第一基板上制造一个或多个电容器。 此外，系统阻抗的一个或多个信号传输迹线形成在外层的第二基板上。 因此，有效地提高了电感器的电感。 此外，内置组件的面积减少。 此外，它具有更短的延迟时间，更小的介电损耗和更高的传输高速和高频信号的回波损耗。

公开(公告)号：US07514765B2

公开(公告)日：2009-04-07

申请号：US11410425

申请日：2006-04-25

Applicant: Wen-Hung Huang ,  Ming-Chu Kuo ,  Hsien Tsung Lin

Inventor： Wen-Hung Huang ,  Ming-Chu Kuo ,  Hsien Tsung Lin

IPC: H01L23/552

CPC classification number: H05K1/18 ,  H01L2924/0002 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10371 ,  Y10T29/4902 ,  H01L2924/00

Abstract: For improving efficiency of a power device having an exposed surface capable of radiating energy, a shielding layer is disposed in between the exposed surface and a conductive layer. The shielding layer causes at least a portion of the energy to be directed back into the power device, thereby substantially preventing the energy from inducing eddy currents in the conductive layer. The conductive layer is fabricated from a metal foil for compliance with electromagnetic energy leakage regulations.

Abstract translation: 为了提高具有能够辐射能量的暴露表面的功率器件的效率，在暴露表面和导电层之间设置屏蔽层。 屏蔽层使能量的至少一部分被引导回功率器件，从而基本上防止能量在导电层中引起涡流。 导电层由金属箔制成，以符合电磁能量泄漏规定。

公开(公告)号：US20090058558A1

公开(公告)日：2009-03-05

申请号：US12224133

申请日：2007-02-28

Applicant: Takashi Okano

Inventor： Takashi Okano

IPC: H03H2/00 ,  H05K7/06

CPC classification number: H05K1/0231 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H05K1/0216 ,  H05K1/0233 ,  H05K1/181 ,  H05K2201/086 ,  H05K2201/09281 ,  H05K2201/10522 ,  H05K2201/10689 ,  H01L2924/00012

Abstract: One end of a power-supply bus is connected to a power supply through a ferrite bead. The power-supply bus is connected to power-supply terminals. The power-supply terminals are connected at positions in such a manner that a terminal with a higher intensity is connected closer to the other end of the power-supply bus. Ground terminals are connected to ground. Capacitors are bypass capacitors or decoupling capacitors, for example, and connected between respective power-supply terminals and ground.

Abstract translation: 电源总线的一端通过铁氧体磁珠连接到电源。 电源总线连接到电源端子。 电源端子以这样的方式连接，使得具有较高强度的端子更靠近电源总线的另一端连接。 接地端子接地。 例如，电容器是旁路电容器或去耦电容器，并且连接在相应的电源端子和地之间。

公开(公告)号：US20090039286A1

公开(公告)日：2009-02-12

申请号：US12180745

申请日：2008-07-28

Applicant: Arthur Earl COLVIN,, JR. ,  Paul Samuel Zerwekh ,  Jeffrey C. Lesho ,  Robert William Lynn ,  Carrie R. Lorenz ,  Casey J. O'Connor ,  Steven J. Walters

Inventor： Arthur Earl COLVIN,, JR. ,  Paul Samuel Zerwekh ,  Jeffrey C. Lesho ,  Robert William Lynn ,  Carrie R. Lorenz ,  Casey J. O'Connor ,  Steven J. Walters

IPC: G01J1/58 ,  H01J40/14

CPC classification number: A61B5/14556 ,  A61B5/0031 ,  A61B5/14532 ,  A61B5/1459 ,  A61B5/681 ,  G01N21/6428 ,  G01N21/645 ,  G01N2201/1244 ,  H05K1/0306 ,  H05K1/165 ,  H05K3/403 ,  H05K2201/086 ,  H05K2201/09972 ,  H05K2201/10106

Abstract: The present invention provides systems and methods for attenuating the effect of ambient light on optical sensors and for measuring and compensating quantitatively for the ambient light.

Abstract translation: 本发明提供了用于衰减环境光对光学传感器的影响并用于量化和补偿环境光的系统和方法。

公开(公告)号：US07479862B2

公开(公告)日：2009-01-20

申请号：US11394359

申请日：2006-03-29

Applicant: Tsutomu Mikura ,  Kota Ikeda ,  Koichi Nakahara

Inventor： Tsutomu Mikura ,  Kota Ikeda ,  Koichi Nakahara

IPC: H01F5/00

CPC classification number: H01L23/49822 ,  B32B18/00 ,  C04B35/265 ,  C04B35/6261 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/36 ,  C04B2235/5445 ,  C04B2235/6025 ,  C04B2235/77 ,  H01F10/20 ,  H01F10/265 ,  H01F17/0006 ,  H01F41/046 ,  H01F2017/008 ,  H01L23/13 ,  H01L23/15 ,  H01L23/552 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/165 ,  H05K3/4626 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/086 ,  H01L2924/00

Abstract: A low-temperature firable ceramic substrate having formed in its inside a ferrite layer with a coil embedded therein is provided. The ferrite layer has a composition of 63 to 73% by mass of Fe2O3, 5 to 10% by mass of CuO, 5 to 12% by mass of NiO, and 10 to 23% by mass of ZnO. Even if firing is performed at a lower temperature than ever, it is possible to obtain a ferrite layer which is excellent in sintered density and magnetic permeability.

Abstract translation: 提供了一种在其内部形成有嵌入线圈的铁氧体层的低温可熔陶瓷基板。 铁氧体层的组成为Fe 2 O 3为63〜73质量％，CuO为5〜10质量％，NiO为5〜12质量％，ZnO为10〜23质量％。 即使在比以往更低的温度下进行烧制，也可以获得烧结密度和磁导率优异的铁氧体层。

公开(公告)号：US07460381B2

公开(公告)日：2008-12-02

申请号：US11403046

申请日：2006-04-12

Applicant: Thomas W. Lanni

Inventor： Thomas W. Lanni

IPC: H02M1/00

CPC classification number: H02M1/4258 ,  G06F1/26 ,  H01F2027/2819 ,  H01R13/24 ,  H01R13/6675 ,  H01R2201/16 ,  H01R2201/24 ,  H02J7/0008 ,  H02J7/0068 ,  H02J7/022 ,  H02M3/00 ,  H02M3/156 ,  H02M3/28 ,  H02M3/33507 ,  H02M3/33523 ,  H02M3/3372 ,  H02M3/3378 ,  H02M3/3382 ,  H02M3/3387 ,  H02M7/003 ,  H05K1/0203 ,  H05K1/0262 ,  H05K1/029 ,  H05K1/16 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/09063 ,  Y02B40/90 ,  Y02B70/126 ,  Y10T307/25 ,  Y10T307/406 ,  Y10T307/461

Abstract: A programmable power supply for providing a regulated DC output power is disclosed. The power supply provides the output power to any one of a plurality of electronic devices adapted for receiving the output power at an operational voltage or an operational current. The power supply receives a programming signal to maintain the output power at the operational voltage or operational current associated with a particular selected electronic device. Accordingly, by varying the programming signal, the power supply can be programmed to provide output power to any one of several electronic devices having differing input power requirements.

Abstract translation: 公开了一种用于提供稳定的直流输出功率的可编程电源。 电源将输出功率提供给适于在工作电压或工作电流下接收输出功率的多个电子设备中的任何一个。 电源接收编程信号以将输出功率维持在与特定选定的电子设备相关联的工作电压或工作电流。 因此，通过改变编程信号，可以将电源编程为向具有不同输入功率要求的多个电子设备中的任一个提供输出功率。

公开(公告)号：US07423884B2

公开(公告)日：2008-09-09

申请号：US11079373

申请日：2005-03-14

Applicant: Kouhei Enchi ,  Yoji Ueda

Inventor： Kouhei Enchi ,  Yoji Ueda

IPC: H05K1/18

CPC classification number: H05K1/165 ,  H01F17/0013 ,  H01F17/0033 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/10416

Abstract: A multilayer circuit board includes: two or more layers of electrical insulative base members; and two or more layers of conductive patterned layers. At least two of the conductive patterned layers include coil patterns that will be a part of a coil, through holes are provided at predetermined positions of the electrical insulative base members, the positions being sandwiched between the coil patterns, so as to enable communication between respective end portions of the coil patterns, and conductive paste charged in the through holes allows electrical connection to be established between the respective end portions. The coil is formed so as to be wound in a direction perpendicular to a thickness direction of the multilayer circuit board. With this configuration, a multilayer circuit board can be provided, which facilitates increasing the winding number of a coil and has excellent flexibility of circuit design.

Abstract translation: 多层电路板包括：两层或多层电绝缘基底构件; 和两层或多层导电图案层。 导电图案化层中的至少两个包括将是线圈的一部分的线圈图案，通孔设置在电绝缘基底构件的预定位置处，该位置被夹在线圈图案之间，以便使各个 线圈图案的端部，以及填充在通孔中的导电浆料允许在各个端部之间建立电连接。 线圈被形成为沿与多层电路板的厚度方向垂直的方向缠绕。 利用这种结构，可以提供多层电路板，这有助于增加线圈的绕组数，并且具有优异的电路设计灵活性。