公开(公告)号：US6094357A

公开(公告)日：2000-07-25

申请号：US198932

申请日：1998-11-24

Applicant: Hans Deubler ,  Karl Hintermann ,  Walter Planegger ,  Peter Schaller

Inventor： Hans Deubler ,  Karl Hintermann ,  Walter Planegger ,  Peter Schaller

IPC: H05K1/18 ,  H01M2/10 ,  H05K1/00 ,  H05K3/30

CPC classification number: H05K3/301 ,  H01M2/1055 ,  H05K1/0293 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/175 ,  H05K2203/176

Abstract: In a product including a printed circuit board which comprises a printed-circuit part and a terminal part and including a rechargeable battery having two terminals, and including retaining device for mechanically retaining the battery, the retaining device and the printed circuit board are arranged and constructed so as to be mechanically separate from one another, in such a manner that the printed circuit board does not form part of the retaining device, and each of the two terminals of the battery is connected to a terminal zone on the terminal part of the printed circuit board in an electrically conductive manner via a mechanically flexible and electrically conductive connecting device.

Abstract translation: 在包括印刷电路部分和端子部分并且包括具有两个端子的可再充电电池的印刷电路板的产品中，并且包括用于机械地保持电池的保持装置，保持装置和印刷电路板被布置和构造 以使得印刷电路板不形成保持装置的一部分，并且电池的两个端子中的每一个连接到印刷的端子部分上的端子区域上，以便彼此机械地分离 电路板通过机械柔性和导电的连接装置以导电方式。

公开(公告)号：US5702254A

公开(公告)日：1997-12-30

申请号：US783839

申请日：1997-01-13

Applicant: Duane Eugene Whitson ,  Michael Joseph O'Connor ,  Curtis Allen Stapert

Inventor： Duane Eugene Whitson ,  Michael Joseph O'Connor ,  Curtis Allen Stapert

IPC: H01R12/55 ,  H01R33/46 ,  H05K1/00 ,  H05K1/11 ,  H01R9/09

CPC classification number: H05K1/116 ,  H01R33/465 ,  H05K1/0293 ,  H05K1/0295 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09954 ,  H05K2201/10113 ,  H05K2203/175 ,  H05K2203/176

Abstract: A circuit board has a socket opening for a twist-in lamp bordered by a pair of arcuate conductors. The circuit board is configured to define a socket for a bi-pin lamp located concentrically within the opening and supported by bridges across the opening. The bridges carry conductors for the bi-pin lamp. The bridges are frangible to allow the socket for the bi-pin lamp to be removed. When a bi-pin lamp fails in service it is removed along with its socket and a twist-in lamp is installed in the remaining socket.

Abstract translation: 电路板具有用于由一对弓形导体接合的扭转灯的插座开口。 电路板被配置为限定用于双针灯的插座，其同心地位于开口内并由穿过开口的桥支撑。 桥接器承载双针灯的导体。 桥梁是易碎的，以允许双针灯的插座被移除。 当双针灯不工作时，它将与其插座一起拆下，并在其他插座中安装一个扭转灯。

公开(公告)号：US5599747A

公开(公告)日：1997-02-04

申请号：US495248

申请日：1995-06-27

Applicant: Ashwinkumar C. Bhatt ,  Thomas P. Duffy ,  David E. Houser ,  Gerald W. Jones ,  Jeffrey McKeveny ,  Kenneth L. Potter

Inventor： Ashwinkumar C. Bhatt ,  Thomas P. Duffy ,  David E. Houser ,  Gerald W. Jones ,  Jeffrey McKeveny ,  Kenneth L. Potter

IPC: H01L23/12 ,  H01L23/14 ,  H01L23/367 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/00 ,  H05K7/02 ,  H01L21/60

CPC classification number: H05K1/021 ,  H01L23/145 ,  H01L23/3677 ,  H01L23/49822 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K1/182 ,  H05K2201/09127 ,  H05K2201/09981 ,  H05K2203/049 ,  H05K3/0061 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and partially routing this member to define a temporary support portion therein. Metallization and circuitization may then occur, following which the temporary support portion is removed. This temporary support thus assures effective support for the photoresist used as part of the circuitization process. Thus, the photoresist is capable of being applied in sheetlike form for spanning the relatively small openings of the dielectric without sagging, bowing, etc., which may adversely impact subsequent processing steps.

Abstract translation: 制造可用作芯片载体结构的电路化衬底的方法。 该方法包括提供电介质构件并部分地布置该构件以在其中限定临时支撑部分的步骤。 然后可以发生金属化和电路化，随后移除临时支撑部分。 因此，这种临时支撑物确保了作为电路化过程的一部分使用的光致抗蚀剂的有效支撑。 因此，光致抗蚀剂能够以片状形式施加以跨越电介质的相对小的开口而不会下垂，弯曲等，这可能不利地影响随后的处理步骤。

公开(公告)号：US5359168A

公开(公告)日：1994-10-25

申请号：US174754

申请日：1993-12-29

Applicant: Peter R. Cunningham

Inventor： Peter R. Cunningham

IPC: G01K3/04 ,  G07C11/00 ,  H01H3/00 ,  H05K1/00 ,  H05K5/02 ,  H01H85/00

CPC classification number: H05K5/0208 ,  G01K3/04 ,  G07C11/00 ,  H01H3/00 ,  H05K1/0293 ,  H05K1/029 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/175

Abstract: In FIG. 1, an electrical circuit on a circuit board 9 can be controlled by operation of switches 2B, 3B, 4B. These are operated by removing portions of the board 9, effected by the snapping off of respective corresponding cover member portions 2A, 3A and 4A.When used as a thermal log this control can respectively activate, deactivate and display the thermal data but avoid any tampering.

Abstract translation: 在图 如图1所示，可以通过开关2B，3B，4B的操作来控制电路板9上的电路。 这些通过移除相应的相应的盖构件部分2A，3A和4A的扣合而移除板9的部分来操作。 当用作热记录时，该控件可以分别激活，停用和显示热数据，但是避免任何篡改。

公开(公告)号：US5112230A

公开(公告)日：1992-05-12

申请号：US728460

申请日：1991-07-11

Applicant: Michael J. DeSimone

Inventor： Michael J. DeSimone

IPC: H05K1/00

CPC classification number: H05K1/0293 ,  H05K1/029 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/0195 ,  H05K2203/175 ,  Y10T29/49156

Abstract: A reconfigurable substrate is provided for supporting electrical elements. A conductive strip is disposed on the substrate for linking at least two electrical elements. The substrate has a portion has a portion proximate to the strip for permitting subsequent removal thereof, thereby severing the conductive strip. Thus, a connection of electrical elements may be selectively varied as a function of specification of options which become operative by subsequent removal of a portion of the substrate proximate to the conductive strip.

Abstract translation: 提供了用于支撑电气元件的可重新配置的基板。 导电带设置在基板上用于连接至少两个电气元件。 衬底具有一部分靠近条带的部分，以允许随后的去除，从而切断导电条。 因此，电气元件的连接可以根据选项的规格的选择而有选择地变化，这些选项通过随后移除靠近导电带的基板的一部分而变得有效。

公开(公告)号：US4985808A

公开(公告)日：1991-01-15

申请号：US266140

申请日：1988-11-02

Applicant: Jeffrey P. Zernov

Inventor： Jeffrey P. Zernov

IPC: H01C17/23 ,  H05K1/00 ,  H05K1/16

CPC classification number: H01C17/23 ,  H05K1/0293 ,  H05K1/029 ,  H05K1/167 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/171 ,  H05K2203/175

Abstract: A printed circuit or printed wire board has a resistor network thereon, wired through conductors that are arranged so that individual circuit paths for different resistor combinations pass onto one of a plurality of peripheral tabs on the printed circuit board. The tabs are joined to the main portion of the circuit board through a frangible connection which permits breaking off the tabs. The main circuit into which the board is to be connected is tested to determine the needed circuit characteristics, and all but one of the tabs on the board are removed to provide the required circuit connections for matching the printed wire board circuit to the main circuit. The breakaway tabs permit selecting a particular circuit impedance so that the board is matched to the main circuit in which it is connected. The board is primarily used for compensation of a communications network where the loop loss of a telephone system is set to the right value.

Abstract translation: 印刷电路板或印刷线路板上具有电阻网络，布线通过导体布置成使得用于不同电阻器组合的各个电路路径通过印刷电路板上的多个外围接片中的一个。 突片通过允许断开突片的易碎连接而连接到电路板的主要部分。 测试电路板连接的主电路以确定所需的电路特性，除去电路板上的所有突出部分之外的所有电路，以提供所需的电路连接，以将印刷线路板电路与主电路匹配。 分离片允许选择特定的电路阻抗，使得电路板与其连接的主电路匹配。 电路板主要用于对电话系统的环路损耗设置为正确值的通信网络的补偿。

公开(公告)号：US4918573A

公开(公告)日：1990-04-17

申请号：US393154

申请日：1989-08-14

Applicant: Dean J. Stavraka ,  John W. Swann

Inventor： Dean J. Stavraka ,  John W. Swann

IPC: H05K3/30

CPC classification number: H05K3/306 ,  H05K2201/09127 ,  H05K2201/09954 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K3/301

Abstract: A component spacer is disposed in an electrical circuit between a circuit component such as a resistor having two leads and a printed circuit board to which the resistor leads are connected to maintain a gap between them. The component spacer has a generally flat partition with vertically extending projections for contacting the printed circuit board. An elongated slot defined by a bifurcated section and a spaced aperture extend through the partition for receiving the resistor leads.

Abstract translation: 组件间隔件设置在诸如具有两个引线的电阻器的电路部件和连接有电阻器引线的印刷电路板之间的电路中，以在它们之间保持间隙。 部件间隔件具有大致平坦的隔板，其具有用于接触印刷电路板的垂直延伸的突起。 由分叉部分和间隔开的孔限定的细长槽延伸穿过隔板以接收电阻器引线。

公开(公告)号：US20180257364A1

公开(公告)日：2018-09-13

申请号：US15980864

申请日：2018-05-16

Applicant: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

Inventor： Gerald Weidinger ,  Gunther Weichslberger ,  Markus Leitgeb ,  Johannes Stahr

IPC: B32B37/26 ,  C08L91/06 ,  H05K3/46 ,  H05K1/18

CPC classification number: B32B37/26 ,  C08L91/06 ,  H05K1/183 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  Y10T156/1064 ,  Y10T156/1153 ,  Y10T156/1195 ,  Y10T428/24802 ,  Y10T428/265

Abstract: The invention relates to a nonstick material for use during removal of a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least on further, substantially planar material layer (9). According to the invention, the nonstick material (8) has a different polarity than the adjoining, substantially planar material layers (2, 9). The invention also relates to a method for removing a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least one further, substantially planar material layer (9), to a multilayer structure which consists of at least two substantially planar material layers (2, 9) to be interconnected, and to a use of the same, especially in a multilayer printed circuit board.

公开(公告)号：US20180242456A1

公开(公告)日：2018-08-23

申请号：US15748100

申请日：2016-08-10

Applicant: Schweizer Electronic AG

Inventor： Thomas GOTTWALD ,  Christian RÖSSLE

IPC: H05K1/18 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H01Q1/38

CPC classification number: H05K1/186 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4694 ,  H05K3/4697 ,  H05K2201/015 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/09936 ,  H05K2201/10098 ,  H05K2201/10378 ,  H05K2203/0285 ,  H05K2203/063 ,  H05K2203/166

Abstract: Method for producing a conductor structural element with a layer sequence having an internal layer substrate, including the steps: providing a rigid carrier having an underside and a top side; defining a cut-out section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the cut-out section is exposed; placing an internal layer substrate above the cut-out section with formation of a cavity between the rigid carrier and the internal layer substrate; aligning and fixing the internal layer substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the internal layer substrate with the cavity being left free; producing a cut-out by cutting the cut-out section out of the rigid carrier from the outer underside of the rigid carrier.

公开(公告)号：US10054300B2

公开(公告)日：2018-08-21

申请号：US15097946

申请日：2016-04-13

Applicant: Hubbell Incorporated

Inventor： Derek B. Baker ,  Cory A. Passerello ,  Thomas Clawson

IPC: F21V23/00 ,  F21V23/06 ,  F21S8/04 ,  H05K1/02 ,  F21Y103/10 ,  F21Y115/10

CPC classification number: F21V23/003 ,  F21S8/04 ,  F21V23/009 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0286 ,  H05K2201/09063 ,  H05K2201/09127 ,  H05K2201/10106

Abstract: A light board for a light fixture includes a first portion and a second portion. The first portion includes at least one light emitting element, and the second portion includes at least one light emitting element. A first state is defined by the second portion being coupled to the first portion and a second state is defined by the second portion being detached from the first portion. In the first state, the light emitting elements of the first portion and the second portion are configured to provide an evenly distributed light output along at least the combined length of the first portion and the second portion. In the second state, the at least one light emitting element of the first portion is configured to provide an evenly distributed light output along at least the length of the first portion.