公开(公告)号：US06418030B1

公开(公告)日：2002-07-09

申请号：US09636714

申请日：2000-08-11

Applicant: Masayoshi Yamaguchi ,  Mitsutoshi Sawano ,  Kazutoshi Hohki

Inventor： Masayoshi Yamaguchi ,  Mitsutoshi Sawano ,  Kazutoshi Hohki

IPC: H05K706

CPC classification number: H01L25/50 ,  H01L23/24 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/147 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/4614 ,  H05K3/4623 ,  H05K2201/09181 ,  H05K2201/09536 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A multi-chip module includes bare IC chips mounted on respective areas of a printed wiring board. Outer electrode pads on the peripheries of the board are soldered to another printed wiring board such as a motherboard. Lead pads and the outer electrode pads are interconnected through a circuit pattern, through holes, and interstitial via holes. The circuit pattern is disposed on a die bonding surface of the bare IC chips for which insulation is not necessary.

Abstract translation: 多芯片模块包括安装在印刷电路板的相应区域上的裸IC芯片。 板外围的外电极焊盘焊接到另一印刷电路板如母板上。 引线焊盘和外部电极焊盘通过电路图案，通孔和间隙通孔互连。 电路图案设置在不需要绝缘的裸IC芯片的芯片接合表面上。

公开(公告)号：US06399893B1

公开(公告)日：2002-06-04

申请号：US09301503

申请日：1999-04-28

Applicant: Kiminori Terashima

Inventor： Kiminori Terashima

IPC: H05K116

CPC classification number: H05K9/0028 ,  H05K3/3405 ,  H05K3/3447 ,  H05K7/02 ,  H05K2201/09181 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: In the electronic device of the present invention, leg portions of a frame are projected downward from the underside of a printed circuit board, so the positioning of the electronic device can be done by inserting the leg portions into holes formed in a mother printed circuit board. Thus, when the electronic device is surface-mounted to the mother board, there is no fear of its dislocation even under vibration or shock. Accordingly, the electronic device is not deteriorated at all in its quality.

Abstract translation: 在本发明的电子设备中，框架的脚部从印刷电路板的下侧向下突出，因此电子设备的定位可以通过将脚部插入母版印刷电路板中形成的孔中 。 因此，当将电子装置表面安装到母板时，即使在振动或冲击下也不会发生其位错的担心。 因此，电子设备的质量根本不劣化。

公开(公告)号：US06380826B1

公开(公告)日：2002-04-30

申请号：US09533268

申请日：2000-03-20

Applicant: Raymond W. Palinkas

Inventor： Raymond W. Palinkas

IPC: H03H701

CPC classification number: H01R24/42 ,  H01R2103/00 ,  H05K1/0233 ,  H05K1/117 ,  H05K1/165 ,  H05K2201/09181

Abstract: A filter assembly includes a printed circuit board having a filtering circuit and a ground plane. A body receives the printed circuit board. The printed circuit board has at least one tab, and the body has a respective slot for receiving each tab, aligning the printed circuit board with the body. The body is shaped so as to provide a first cable connector at one end. The ground plane of the printed circuit board is connected to an inner wall of the body by solder. A nut fits on an end of the body opposite the cable connector of the body. The nut provides a second cable connector at an end opposite the first cable connector. The nut is connected to the body by solder along a periphery of the nut to form a water tight seal. The solder joining the nut to the body is continuous with the solder connecting the ground plane to the body. A pair of terminals are electrically connected at opposite ends of the printed circuit board. Each of the terminals has a slot sized to receive a respective end of the printed circuit board and may form a friction fit between the printed circuit board and the terminals.

公开(公告)号：US06380619B2

公开(公告)日：2002-04-30

申请号：US09282415

申请日：1999-03-31

Applicant: Taisuke Ahiko ,  Takaya Ishigaki ,  Hiroki Sato ,  Kamiya Takashi ,  Masanori Yamamoto

Inventor： Taisuke Ahiko ,  Takaya Ishigaki ,  Hiroki Sato ,  Kamiya Takashi ,  Masanori Yamamoto

IPC: H01G412

CPC classification number: H01G4/012 ,  H01G4/232 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A ceramic substrate having two side surfaces in a lengthwise direction and two side surfaces in a widthwise direction intersecting each other. The ceramic substrate also includes at least one flat surface in a thicknesswise direction. Internal electrode films are embedded in the ceramic substrate with film surfaces thereof extending roughly parallel to the flat surface of the ceramic substrate. External electrodes are each provided on the flat surface of the ceramic substrate toward one of the two ends of the ceramic substrate in the lengthwise direction, are electrically continuous with the internal electrode films and are formed over distances and from the two side surfaces in the widthwise direction.

Abstract translation: 陶瓷基板具有长度方向的两个侧面和宽度方向的两个侧面相交。 陶瓷基板还包括沿厚度方向的至少一个平坦表面。 内部电极膜嵌入陶瓷基板中，其膜表面大致平行于陶瓷基板的平坦表面延伸。 外部电极分别设置在陶瓷基板的平坦表面上朝向长度方向的陶瓷基板的两端之一，与内部电极膜电连接，并且形成在距离宽度方向上的两个侧面 方向。

公开(公告)号：US06369335B1

公开(公告)日：2002-04-09

申请号：US09525075

申请日：2000-03-14

Applicant: Masaya Wajima

Inventor： Masaya Wajima

IPC: H01N909

CPC classification number: H05K3/403 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10068 ,  Y10T29/49137 ,  H01L2924/00

Abstract: A method for manufacturing substrate elements includes providing a mother substrate, forming at least one elongated through-hole on the mother substrate such that an entire longitudinal end surface of the first substrate element and a portion of a lateral surface of the second substrate element are exposed, forming an electrode pattern on the inner surface of the at least one elongated through-hole, and cutting the mother substrate along lines extending in the vicinity of the longitudinal ends of the at least one elongated through-hole and in a direction that is substantially perpendicular to the longitudinal axis of the elongated through-hole.

Abstract translation: 一种用于制造衬底元件的方法包括：提供母体衬底，在母体衬底上形成至少一个细长的通孔，使得第一衬底元件的整个纵向端表面和第二衬底元件的侧表面的一部分露出 在所述至少一个细长通孔的内表面上形成电极图案，并且沿着在所述至少一个细长通孔的纵向端部附近延伸的线沿着基本上 垂直于细长通孔的纵向轴线。

公开(公告)号：US6149050A

公开(公告)日：2000-11-21

申请号：US238229

申请日：1999-01-27

Applicant: Kwok Fai Lai ,  Siu-wai Wan ,  Siu-keung Tse ,  Jack Xiong Zhenpeng

Inventor： Kwok Fai Lai ,  Siu-wai Wan ,  Siu-keung Tse ,  Jack Xiong Zhenpeng

IPC: B23K1/08 ,  H01R4/02 ,  H05K3/02 ,  H05K3/34 ,  H05K3/40 ,  B23K31/02 ,  B23K31/00 ,  B23K1/00 ,  B23K5/00

CPC classification number: B23K1/08 ,  H05K3/3405 ,  B23K2201/40 ,  H05K2201/09181 ,  H05K2201/1003 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K3/3468 ,  H05K3/403

Abstract: A method and apparatus for soldering wires of components on PC boards to a lead frame. Wires from the electronic components on a PC board supported by a fixture are led through respective pathways and particularly plated grooves on each side of the PC board. The wires within the pathways are held there by being adhered to a temporary fixture beneath the board until the wires are later affixed in their grooves by dipping the sides of the PC board in a solder pool. The excess wire tails are cut away. The PC board is then mounted on a lead frame, and the leads of the lead frame are aligned with respective pathways of the PC board. The PC board and lead frame are then dipped in solder which electrically connects the wires in their respective pathways to the leads of the lead frame.

Abstract translation: 一种用于将PC板上的部件的焊丝焊接到引线框架的方法和装置。 由固定装置支撑的PC板上的电子部件的导线通过各个通路引导，特别是在PC板的每一侧的电镀槽。 路径内的电线通过粘附在板下方的临时固定件而保持在该位置，直到电线稍后通过将PC板的侧面浸入焊池中而固定在其沟槽中。 多余的线尾被切掉。 然后将PC板安装在引线框架上，引线框架的引线与PC板的相应路径对齐。 然后将PC板和引线框架浸入焊料中，焊料将其各自通路中的导线电连接到引线框架的引线。

公开(公告)号：US6147876A

公开(公告)日：2000-11-14

申请号：US617843

申请日：1996-06-13

Applicant: Masayoshi Yamaguchi ,  Mitsutoshi Sawano ,  Kazutoshi Hohki

Inventor： Masayoshi Yamaguchi ,  Mitsutoshi Sawano ,  Kazutoshi Hohki

IPC: H01L25/18 ,  H01L21/98 ,  H01L23/24 ,  H01L23/538 ,  H01L25/04 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46 ,  H05K1/16

CPC classification number: H01L25/50 ,  H01L23/24 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/16 ,  H05K1/141 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H05K1/147 ,  H05K2201/09181 ,  H05K2201/09536 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/4614 ,  H05K3/4623

Abstract: Bare IC chips (201 through 203) are mounted on respective areas (101 through 103) of a printed wiring board (100). The outer electrode pads (105) on the peripheries of the board (100) are soldered to another printed wiring board (1) such as a mother board. Lead pads (107) and the outer electrode pads (105) are interconnected through a circuit pattern (109), through holes (111) and interstitial via holes (112). The circuit pattern (109) is disposed on a die bonding surface of the bare IC chips (201 and 202) for which insulation is not necessary. A multi-chip module is thus completed.

Abstract translation: PCT No.PCT / JP94 / 01517 Sec。 371日期：1996年6月13日 102（e）1996年6月13日PCT 1994年9月14日PCT PCT。 公开号WO95 / 08189 日期1995年3月23日将IC芯片（201〜203）安装在印刷电路板（100）的各个区域（101〜103）上。 板（100）周围的外电极焊盘（105）焊接到诸如母板的另一印刷电路板（1）。 引线焊盘（107）和外部电极焊盘（105）通过电路图案（109），通孔（111）和间隙通孔（112）互连。 电路图案（109）设置在不需要绝缘的裸IC芯片（201和202）的芯片接合表面上。 因此，完成了多芯片模块。

公开(公告)号：US6129555A

公开(公告)日：2000-10-10

申请号：US185512

申请日：1998-11-04

Applicant: Osamu Daikuhara ,  Tadashi Kumamoto ,  Junichi Akama

Inventor： Osamu Daikuhara ,  Tadashi Kumamoto ,  Junichi Akama

IPC: H01R13/648 ,  H05K1/02 ,  H05K1/11 ,  H01R9/09

CPC classification number: H05K1/0219 ,  H01R12/721 ,  H01R23/688 ,  H05K1/117 ,  H05K2201/09181 ,  H05K2201/10189

Abstract: A connector assembly used for balanced transmission includes a jack connector and a card-edge plug connector. The jack connector includes a plurality of pairs of jack-type signal contact elements arranged parallel to each other in an array, a plurality of jack-type ground plate elements arranged alternately with said plurality of pairs of jack-type signal contact elements in said array, a jack-type insulating body made of an electrically insulating material and jack-type ground contact element. The card-edge plug connector includes a plurality of pairs of plug-type signal pads, a plurality of slits arranged alternately with said plurality of pairs of plug-type signal pads, at least one plug-type ground layer and a plurality of signal patterns each extending from a respective one of said plug-type signal pads. The connector assembly has a strip-line structure. Also, virtual ground planes are created at a region between each pair of the plurality of pairs of plug-type signal pads.

Abstract translation: 用于平衡传输的连接器组件包括插座连接器和卡缘插头连接器。 千斤顶连接器包括以阵列彼此平行布置的多对插座式信号接触元件，多个插座式接地板元件与所述阵列中的所述多对插座式信号接触元件交替布置 由电绝缘材料和插座型接地元件制成的插座型绝缘体。 卡边插头连接器包括多对插头式信号焊盘，与所述多对插头式信号焊盘交替布置的多个狭缝，至少一个插头式接地层和多个信号模式 每个从所述插头型信号垫中的相应一个延伸。 连接器组件具有带状结构。 而且，虚拟接地平面是在多对插塞式信号焊盘对之间的区域中产生的。

公开(公告)号：US6034571A

公开(公告)日：2000-03-07

申请号：US149482

申请日：1998-09-08

Applicant: Masao Uno

Inventor： Masao Uno

IPC: H03B1/00 ,  H03B1/04 ,  H03B5/02 ,  H05K1/02 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42 ,  H05K5/00 ,  H05K9/00 ,  H05K7/06

CPC classification number: H05K5/0095 ,  H05K3/403 ,  H05K9/0022 ,  H05K1/0243 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10075 ,  H05K2201/10371 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/42

Abstract: An oscillator includes a multi-layered base. Circuit patterns are formed on a first main surface and the inside of the multi-layered base. Holes through which wiring patterns of the individual layers of the base are connected are formed within the multi-layered base. Electronic components are mounted on the first main surface of the multi-layered base. First and second reverse electrodes, which serve as external terminals to be connected to an external source, are formed on a second main surface of the multi-layered base. The first reverse electrode serves as a ground electrode, and the second reverse electrodes serve as terminal electrodes. The reverse electrodes are electrically connected to the circuit patterns via the holes. The reverse electrodes are located farther inward than the lateral surfaces of the multi-layered base. A shield cover is placed to tightly cover the first main surface of the multi-layered base. It is thus possible to provide a miniaturized, less expensive, and easy-to-mount oscillator module in which unwanted radiation characteristics are improved.

Abstract translation: 振荡器包括多层基座。 电路图案形成在第一主表面和多层基底的内部。 在多层基体内形成基底的各层的布线图案连接的孔。 电子部件安装在多层基体的第一主表面上。 用作连接到外部源的外部端子的第一和第二反向电极形成在多层基底的第二主表面上。 第一反向电极用作接地电极，第二反向电极用作端子电极。 反向电极经由孔电连接到电路图案。 反向电极位于比多层基底的侧表面更靠内侧。 放置一个屏蔽罩以紧密地覆盖多层底座的第一主表面。 因此，可以提供小型化，便宜且易于安装的振荡器模块，其中改善了不需要的辐射特性。

公开(公告)号：US6031728A

公开(公告)日：2000-02-29

申请号：US204502

申请日：1998-12-04

Applicant: Jean-Philippe Bedos ,  Gerard Sune

Inventor： Jean-Philippe Bedos ,  Gerard Sune

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42

CPC classification number: H05K1/141 ,  H05K3/403 ,  H05K1/111 ,  H05K2201/049 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/10689 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/42

Abstract: The present invention relates to the interconnection of two electronic devices (2 and 3) by means of an interconnection device (1).According to the invention, the interconnection device (1) has metallized grooves (17, 18) in its edge, each in electrical connection with one of its lower contacts (15). Portions of solder (20), partially accommodated in the grooves (17, 18), fasten the interconnection device (1) on the electronic device (3) and make the electrical connections between the devices (1 and 3).

Abstract translation: 本发明涉及通过互连设备（1）互连两个电子设备（2和3）。 根据本发明，互连装置（1）在其边缘具有金属化的凹槽（17,18），每个与其下触点之一电连接。 部分地容纳在凹槽（17,18）中的部分焊料（20）将电子设备（3）上的互连装置（1）紧固并在设备（1和3）之间进行电连接。