Abstract:
A method of making capacitive/resistive devices provides both resistive and capacitive functions. The capacitive/resistive devices may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive devices conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability.
Abstract:
One or more embodiments of the present disclosure relate to a circuit board having a substrate and a plurality of differential signal lines formed on the substrate and transmitting differential signals. The differential signal lines include a first signal line and a second signal line. The first signal line and the second signal line extend along at least two paths that are parallel to each other. The paths of the first signal line and the second signal line switch at path change portions, and the path change portions of neighboring differential signal lines are positioned at different distances away from an edge of the circuit board along the length direction of the differential signal line.
Abstract:
A printed wiring board includes a substrate member, terminals and wiring pattern. The terminals are formed in a specific shape on the substrate member and arranged to be aligned in a specific arrangement direction on the substrate member. The wiring pattern is formed on the opposite side across the substrate member from a terminal portion where the terminals are formed, and a plurality of slits are formed extending in a direction perpendicular to the specific arrangement direction.
Abstract:
A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers. Two ground parts are respectively arranged at opposite sides of each of the two differential traces.
Abstract:
A surface mountable transformer integratable into a printed circuit board. In one aspect, the transformer comprises two broadside vertically coupled transmission lines. In another aspect, the transformer may comprise two broadside vertically partially coupled transmission lines. The layout of the transformer is adaptable for use in microwave modules where transformers are integrated into the printed circuit board and the active components are mounted in the cavity. The layout preferably requires only two signal areas. In addition, an aspect of the present invention allows the differential or unbalanced ports to lie on the same surface as the balanced port.
Abstract:
A capacitor-embedded printed circuit board and a method of manufacturing the printed circuit board are disclosed. The capacitor-embedded printed circuit board includes: an insulation layer, a first electrode formed on one side of the insulation layer, a second electrode formed on one side of the first electrode, a dielectric layer formed on one side of the second electrode, and a third electrode formed on one side of the dielectric layer. By forming the electrodes of the capacitor in a dual structure, deviations in contact area may be minimized between the second electrode and the dielectric layer, so that ultimately, errors in capacitance may be reduced.
Abstract:
This invention discloses a fan-out wire structure for use in a display panel of a display device. The fan-out wire structure comprises a first metal layer, a first insulation layer, and a second metal layer. The first insulation layer is formed on the first metal layer and the second metal layer is formed on the first insulation layer, and the first metal layer and the second metal layer are electrically connected by a conductive material, so as to modulate the resistance of the fan-out wire structure by modulating the length of the second metal layer and the conductive material.
Abstract:
A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes PCB substrates made of materials having different dielectric frequency characteristics.
Abstract:
Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Some embodiments of resonant via arrays are mechanically balanced, which promotes improved manufacturability. Important applications include electromagnetic noise reduction in layered electronic devices such as circuit boards, ceramic modules, and semiconductor chips.
Abstract:
A multilayer balun comprises first and second transmission lines that constitute a half-wave transmission line are opposed in adjacent layers, with a dielectric substance therebetween, so that, during use, the current of the first transmission line and the current of the second transmission line flow in the same direction. Thus, magnetic shield is formed between the first and second transmission lines. This eliminates the need for a grounding electrode layer for preventing magnetic interference between the first and second transmission lines.