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公开(公告)号：US20170273183A1
公开(公告)日：2017-09-21
申请号：US15610658
申请日：2017-06-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Koichiro KAWASAKI , Taku KIKUCHI , Takashi KITAHARA , Hiroki NOTO
CPC classification number: H05K1/18 , H01L23/00 , H01L23/28 , H01L23/34 , H01L41/047 , H01L2924/0002 , H03H3/08 , H03H9/02834 , H03H9/0542 , H03H9/059 , H03H9/1071 , H04B1/38 , H05K1/0203 , H05K1/0216 , H05K3/284 , H05K3/30 , H05K2201/0707 , H05K2201/10015 , H05K2201/1003 , H05K2201/10378 , H05K2201/10734 , H01L2924/00
Abstract: An electronic component includes an electronic component element including first and second main surfaces, a heat-dissipation accelerating member on the first main surface, a sealing resin layer sealing the electronic component element, and a shielding member provided on the sealing resin layer and electrically connected to the heat-dissipation accelerating member. The heat-dissipation accelerating member includes fourth and fifth main surfaces. The electronic component includes a connecting member disposed on the fifth main surface of the heat-dissipation accelerating member and electrically connecting at least one portion of the heat-dissipation accelerating member and the shielding member. The connecting member has a higher thermal conductivity than the sealing resin layer. The contact area between the heat-dissipation accelerating member and the connecting member is smaller than the area of the fifth main surface.
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公开(公告)号：US20170236049A1
公开(公告)日：2017-08-17
申请号：US15587425
申请日：2017-05-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru KATO , Satoshi ISHINO , Takeshi KATAYA , Ikuhei KIMURA , Nobuo IKEMOTO , Yuya DOKAI
IPC: G06K19/077 , H01L23/498 , H01Q1/36 , H05K1/18 , H05K1/02 , H01Q7/00 , H01L23/66 , H01L23/552
CPC classification number: G06K19/07749 , G06K19/06187 , G06K19/0723 , G06K19/07756 , G06K19/07773 , G06K19/07779 , G06K19/07783 , G06K19/07784 , G06K19/07786 , H01L23/49838 , H01L23/552 , H01L23/66 , H01L2223/6655 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/36 , H01Q1/38 , H01Q1/42 , H01Q1/44 , H01Q7/00 , H01Q9/16 , H01Q9/30 , H01Q13/10 , H05K1/0216 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/16 , H05K1/181 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10098 , H05K2201/10371 , H05K2201/10522 , H01L2924/00014 , H01L2924/00
Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
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公开(公告)号：US20170208677A1
公开(公告)日：2017-07-20
申请号：US15474146
申请日：2017-03-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takeshi Kogure , Atsushi Ono , Hiroyuki Nagamori , Takanori Uejima
IPC: H05K1/02 , H05K1/11 , H05K1/18 , H05K3/40 , H01L23/367 , H01L21/48 , H05K3/46 , H05K1/03 , H01L23/498
CPC classification number: H05K1/0206 , H01L21/4857 , H01L21/486 , H01L23/15 , H01L23/367 , H01L23/3735 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L2924/0002 , H05K1/0306 , H05K1/113 , H05K1/181 , H05K3/4038 , H05K3/4629 , H05K3/4644 , H05K2201/096 , H05K2201/0979 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10734 , H01L2924/00
Abstract: A multilayer substrate includes a component mounting electrode, an external mounting electrode, and a heat dissipating unit. The component mounting electrode is connected to an electronic component that is connected to an external structure. The heat dissipating unit is constituted by a plurality of via-conductors partially superposed each other in a stacking direction of the multilayer substrate and disposed continuously between the component mounting electrode and the external mounting electrode. The heat dissipating unit includes communicating portions, each in which one via-conductor is disposed per ceramic layer, and a branching portion in which a plurality of via-conductors are disposed continuously between the communicating portions per ceramic layer. Where the via-conductors of the branching portion and the via-conductor of the communicating portion are adjacent to each other, the positions of the centers of the adjacent via-conductors are separated from each other as viewed from the stacking direction.
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公开(公告)号：US20170196091A1
公开(公告)日：2017-07-06
申请号：US15259308
申请日：2016-09-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hae Jong LEE
CPC classification number: H05K1/181 , H01F27/255 , H01F27/2804 , H01F27/292 , H01F27/323 , H01F27/367 , H01F2027/2809 , H05K2201/1003 , Y02P70/611
Abstract: A coil electronic component includes: a magnetic body including first and second coil parts spaced apart from each other, wherein the coil parts each include first and second coil conductors respectively disposed on first and second surfaces of a substrate, and a non-magnetic film disposed between the first and second coil parts.
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公开(公告)号：US20170160299A1
公开(公告)日：2017-06-08
申请号：US15436051
申请日：2017-02-17
Applicant: Roche Diagnostics Operations, Inc.
Inventor： Hans Schneider , Christian Riether
CPC classification number: G01N35/04 , B65G54/02 , G01N2035/0477 , H01F5/04 , H01F7/206 , H05K3/325 , H05K2201/1003 , H05K2201/10189 , H05K2201/10424 , H05K2201/10962
Abstract: A laboratory sample distribution system and to a laboratory automation system comprising a printed circuit board arrangement and a coil are presented. The printed circuit board arrangement and the coil are configured such that assembly and maintenance of the laboratory automation system are greatly simplified.
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Patent Agency Ranking
公开(公告)号：US20170150606A1
公开(公告)日：2017-05-25
申请号：US15229354
申请日：2016-08-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chan YOON , Dong Hwan LEE , Young Ghyu AHN
CPC classification number: H05K1/181 , H01F17/0013 , H01F17/0033 , H01F27/085 , H01F27/292 , H05K3/3442 , H05K2201/1003 , H05K2201/10636 , Y02P70/611
Abstract: A coil component includes: an internal coil; a magnetic body having the internal coil embedded therein, and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and external electrodes connected to the internal coil and disposed on outer surfaces of the magnetic body. 0
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公开(公告)号：US20170149222A1
公开(公告)日：2017-05-25
申请号：US15309978
申请日：2015-04-21
Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
Inventor： Takehito Kobayashi , Yoshikazu Sasaki , Shigeki Yamane , Yukinori Kita , Tomohiro Ooi
CPC classification number: H02G3/16 , H02G3/081 , H05K1/0203 , H05K1/0263 , H05K1/115 , H05K1/181 , H05K1/182 , H05K3/0061 , H05K7/026 , H05K7/1427 , H05K2201/10022 , H05K2201/1003 , H05K2201/10166 , H05K2201/10272
Abstract: Provided is a circuit assembly that includes a circuit board that has an opening, a plurality of busbars that are laid on one surface side of the circuit board, a coil that has a main portion 16 and a plurality of lead terminals, the lead terminals being connected to the plurality of busbars that are exposed through the opening, and a heatsink that is laid, via an adhesive agent, on surfaces of the plurality of busbars that are opposite to the circuit board. Cut-out portions for evacuating the adhesive agent are formed at edges of the plurality of busbars that are opposite to each other in the opening.
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公开(公告)号：US20170141695A1
公开(公告)日：2017-05-18
申请号：US15344765
申请日：2016-11-07
Applicant: Delta Electronics (Shanghai) CO., LTD
Inventor： Jianhong ZENG , Xiaoni XIN
IPC: H02M7/00 , H05K7/06 , H05K1/02 , H01F27/24 , H05K1/18 , H05K1/11 , H05K7/02 , H01F27/28 , H02M7/04 , H05K1/14
CPC classification number: H02M7/003 , H01F27/24 , H01F27/28 , H01F27/2804 , H01F27/306 , H01F27/40 , H01F2027/408 , H02M3/33576 , H02M7/04 , H02M2001/0048 , H05K1/0203 , H05K1/0254 , H05K1/111 , H05K1/115 , H05K1/142 , H05K1/145 , H05K1/165 , H05K1/181 , H05K1/182 , H05K7/026 , H05K7/06 , H05K2201/086 , H05K2201/10015 , H05K2201/1003 , H05K2201/10166 , H05K2201/10174 , Y02B70/1491
Abstract: A converter module includes: a system board; and an isolated rectifier unit connected with the system board via at least one pin, the isolated rectifier unit including: a magnetic core including at least one core column parallel to the system board and two cover plates provided at both ends of the core column; and multiple carrier board units provided between the two cover plates and perpendicular to the system board, wherein the carrier board unit includes at least one via hole, at least one primary winding and at least one secondary winding; and wherein the at least one core column passes through the via hole of the carrier board unit, the pin is provided at one side of at least one of the carrier board units close to the system board and configured to connect the carrier board units with the system board.
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公开(公告)号：US09648746B2
公开(公告)日：2017-05-09
申请号：US14663445
申请日：2015-03-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Kil Park , Sang Soo Park
CPC classification number: H05K1/181 , H05K1/0233 , H05K3/3442 , H05K2201/10015 , H05K2201/1003 , H05K2201/10515 , H05K2201/1053 , Y02P70/611 , Y02P70/613
Abstract: There is provided a composite electronic component and a board having the same, and the composite electronic component may include: an interposer board, and first and second electronic components mounted on upper and lower surfaces of the interposer board, respectively, and first and second electronic components are electrically connected to each other by an electrical connection part provided on the interposer board.
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公开(公告)号：US20170127524A1
公开(公告)日：2017-05-04
申请号：US15375578
申请日：2016-12-12
Applicant: Schweizer Electronic AG
Inventor： Thomas GOTTWALD , Christian RÖSSLE
CPC classification number: H05K1/185 , H01G2/065 , H01L23/645 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/32 , H01L2224/16225 , H01L2224/2105 , H01L2224/211 , H01L2224/32237 , H01L2224/73267 , H01L2924/1431 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19106 , H02K9/22 , H02K11/30 , H02K11/33 , H05K1/0204 , H05K1/0271 , H05K1/18 , H05K1/184 , H05K3/0044 , H05K3/0061 , H05K3/30 , H05K3/3442 , H05K3/40 , H05K3/4038 , H05K3/4092 , H05K3/4602 , H05K2201/0397 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2203/0228 , H01L2924/00
Abstract: An electronic assembly group comprising a printed circuit board structure in a multilayer configuration that has at least two electrically conductive layers. The electronic assembly group also comprises an additional passive component that is connected to the two electrically conductive layers, each of which has at least one segment that extends beyond the multilayer structure to form connection regions, the passive component making contact directly at the connection regions.
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