公开(公告)号：US20180174498A1

公开(公告)日：2018-06-21

申请号：US15885284

申请日：2018-01-31

Applicant: Ultravision Technologies, LLC

Inventor： William Y. Hall

IPC: G09F13/22 ,  H05K5/00 ,  G06F3/14 ,  F21V31/00 ,  H05K5/02 ,  G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  G06F1/26 ,  H05K1/18 ,  F21K9/20 ,  H01B11/02 ,  H01B9/00 ,  H01B7/282 ,  H05K7/20 ,  G09G5/14 ,  H05K7/14 ,  H05K5/03 ,  G09F9/302 ,  G06F3/147 ,  F21V23/02 ,  F21Y115/10 ,  F21Y101/00 ,  G09G3/32 ,  H04N7/00

CPC classification number: G09F13/22 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1423 ,  G06F3/1446 ,  G06F3/147 ,  G06T1/60 ,  G09F9/3023 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/003 ,  G09G5/14 ,  G09G2300/026 ,  G09G2300/04 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K999/99 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y02P70/611

Abstract: In one embodiment, modular light emitting diode (LED) display panel includes a plurality of LEDs is attached to a printed circuit board. A power supply is coupled to the plurality of LEDs and configured to receive direct current (DC) power. A scan controller is coupled to the plurality of LEDs, where the scan controller is configured to control operation of the plurality of LEDs in order to display received media. A housing is attached to the printed circuit board, and includes an outer major surface of the modular LED display panel and is configured to be exposed to an external environment without a protective cabinet. A waterproof integrated data and power connector is electrically coupled to the power supply, the scan controller, and to the plurality of LEDs. The modular LED display panel has an ingress protection rating of IP 65 or higher, and is cooled passively without fans.

公开(公告)号：US10004140B2

公开(公告)日：2018-06-19

申请号：US15518797

申请日：2015-10-02

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Mitsuru Kobayashi

IPC: H05K1/14 ,  H05K1/02 ,  G01V8/12 ,  G01S17/08

CPC classification number: H05K1/0284 ,  G01S17/08 ,  G01V8/12 ,  H01L2224/48091 ,  H01L2924/15153 ,  H01L2924/15159 ,  H05K1/119 ,  H05K1/141 ,  H05K1/183 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10378 ,  H01L2924/00014

Abstract: A three-dimensional circuit substrate according to the present disclosure includes a base body and a wiring pattern formed on an outer surface of the base body. Also, the outer surface of the base body includes a mounting surface which faces the substrate when the three-dimensional circuit substrate is mounted onto the substrate, and an installation surface which is different from the mounting surface and is a surface where an electronic component is installable. Further, a recess is formed on a side where the mounting surface is provided in the base body.

公开(公告)号：US09997375B2

公开(公告)日：2018-06-12

申请号：US14706292

申请日：2015-05-07

Applicant: KOITO MANUFACTURING CO., LTD.

Inventor： Takuya Serita ,  Atsushi Ozawa

IPC: H01L33/62 ,  H01L21/48 ,  H01L33/00 ,  H01L33/60 ,  F21K9/90 ,  H05K3/20 ,  F21Y115/10

CPC classification number: H01L21/48 ,  F21K9/90 ,  F21S41/192 ,  F21S43/14 ,  F21S43/145 ,  F21S43/195 ,  F21S45/47 ,  F21Y2115/10 ,  H01L23/495 ,  H01L33/005 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2933/0066 ,  H05K3/202 ,  H05K2201/10106 ,  H01L2924/014 ,  H01L2924/00

Abstract: An LED unit according to the invention has a resin housing which is detachably assembled to a vehicle lamp, a lead frame which has a terminal portion which is connected to an exterior terminal, an LED mounting portion and a control part mounting portion and lead frame which is provided integrally on the housing, an LED which is mounted on the LED mounting portion, and a control part which is mounted on the control part mounting portion for controlling the illumination of the LED. The lead frame has a support resin which is a resin material which holds the LED mounting portion in such a way as to surround the LED mounting portion. The lead frame is bent to a back side of the LED at areas outside the support resin, and the control part mounting portion and the terminal portion are formed respectively by the bent portions.

公开(公告)号：US20180159011A1

公开(公告)日：2018-06-07

申请号：US15711087

申请日：2017-09-21

Applicant: Roccor, LLLC

Inventor： William Francis ,  Michael Hulse

IPC: H01L33/64 ,  H05K3/00 ,  H01L33/62 ,  F21V29/00

CPC classification number: H01L33/648 ,  F21V29/00 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K3/0058 ,  H05K3/0061 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: Methods and systems for thermal management of one or more LEDs are disclosed. One or more LEDs may be coupled with an external layer of a thermal ground plane according to some embodiments described herein. For example, the one or more LEDs may be electrically coupled with a circuit carrier with one or more electrically conductive traces etched therein prior to coupling with the thermal ground plane. The thermal ground plane may be charged with a working fluid and/or hermetically sealed after being coupled with the LED.

公开(公告)号：US09991621B2

公开(公告)日：2018-06-05

申请号：US14896420

申请日：2014-05-15

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Konrad Wagner ,  Jürgen Holz

IPC: H05K7/00 ,  H01R13/405 ,  H05K1/14 ,  H01R4/24 ,  H01R12/71 ,  H01R24/58 ,  H05K1/03 ,  H05K1/18 ,  H05K7/02 ,  H05K1/05 ,  H05K3/36 ,  H05K3/32

CPC classification number: H01R13/405 ,  H01R4/2404 ,  H01R4/2479 ,  H01R12/718 ,  H01R24/58 ,  H05K1/0366 ,  H05K1/038 ,  H05K1/056 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/325 ,  H05K3/368 ,  H05K7/02 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/041 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10409

Abstract: An optoelectronic arrangement includes a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board, wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board, a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board, and the first circuit board and the second circuit board connect to one another such that the surface of the first circuit board faces toward the surface of the second circuit board, and the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface.

公开(公告)号：US09991423B2

公开(公告)日：2018-06-05

申请号：US14743940

申请日：2015-06-18

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L27/15 ,  H01L33/60 ,  H01L33/50 ,  H01L33/38 ,  G09G3/32 ,  H01L25/075 ,  H01L33/62 ,  H05B33/08 ,  G02B26/04 ,  G02F1/167 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  H01L33/20 ,  H01L33/40 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y113/13

CPC classification number: H01L33/385 ,  F21K9/50 ,  F21V9/08 ,  F21Y2101/025 ,  F21Y2105/003 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/20 ,  H01L33/36 ,  H01L33/38 ,  H01L33/405 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05B33/089 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US09989234B2

公开(公告)日：2018-06-05

申请号：US15080723

申请日：2016-03-25

Applicant: Goodrich Lighting Systems GmbH

Inventor： Robert Trinschek ,  Elmar Schrewe ,  Tomasz Kordecki

IPC: F21V29/00 ,  F21V29/10 ,  H05K1/02 ,  F21V29/70 ,  F21V29/89 ,  B64D11/00 ,  F21V23/00 ,  F21V23/02 ,  F21W101/06 ,  F21Y103/10 ,  F21Y115/10 ,  F21Y101/02

CPC classification number: F21V29/10 ,  B64D11/00 ,  B64D2011/0038 ,  B64D2203/00 ,  F21V23/005 ,  F21V23/02 ,  F21V29/70 ,  F21V29/89 ,  F21W2107/30 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0209 ,  H05K2201/09781 ,  H05K2201/10106

Abstract: An interior aircraft LED light unit includes at least one printed circuit board, on which a plurality of LEDs are connected to a power source, each one of the plurality of LEDs having a predetermined distance to the power source, and each one of the plurality of LEDs being associated with a respective thermal transfer member having a predetermined size, for transferring heat away from the respective LED, wherein, for at least some of the plurality of LEDs the predetermined size of the respective thermal transfer member varies with the predetermined distance of the LED to the power source.

公开(公告)号：US20180151096A1

公开(公告)日：2018-05-31

申请号：US15881524

申请日：2018-01-26

Applicant: Ultravision Technologies, LLC

Inventor： William Y. Hall

IPC: G09F13/22 ,  H05K5/00 ,  G06F3/14 ,  F21V31/00 ,  H05K5/02 ,  G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  G06F1/26 ,  H05K1/18 ,  F21K9/20 ,  H01B11/02 ,  H01B9/00 ,  H01B7/282 ,  H05K7/20 ,  G09G5/14 ,  H05K7/14 ,  H05K5/03 ,  G09F9/302 ,  G06F3/147 ,  F21V23/02 ,  F21Y115/10 ,  F21Y101/00 ,  G09G3/32 ,  H04N7/00

CPC classification number: G09G5/003 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1423 ,  G06F3/1446 ,  G06F3/147 ,  G06T1/60 ,  G09F9/3023 ,  G09F13/22 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/14 ,  G09G2300/026 ,  G09G2300/04 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K999/99 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y02P70/611

Abstract: A modular light emitting diode (LED) display sub-assembly includes a frame and a plurality of LED display panels. The plurality of LED display panels are attached to the frame. Each of the plurality of LED display panels includes a housing, a printed circuit board attached to the housing, and a plurality of LEDs. The housing includes plastic sidewalls and an outer surface of the modular LED display sub-assembly. The plurality of LEDs are attached to a front side of the printed circuit board. The modular LED sub-assembly further includes a data receiver box mounted directly to the frame. The data receiver box includes a power management unit and a signal processing unit. Each of the LED display panels and the data receiver box are sealed to be waterproof and are configured to be exposed to an external environment without a protective cabinet.

公开(公告)号：US20180149329A1

公开(公告)日：2018-05-31

申请号：US15735143

申请日：2016-06-02

Applicant: Lumileds Holding B.V.

Inventor： Coon Chow TAN ,  Su Ping TAN ,  Tomonari ISHIKAWA ,  Selvakumar PALANIANDY

IPC: F21S43/19 ,  B60Q1/00 ,  F21S43/236 ,  F21S43/14

CPC classification number: F21S43/195 ,  B60Q1/0088 ,  B60Q1/30 ,  B60Q1/44 ,  F21S4/24 ,  F21S43/14 ,  F21S43/236 ,  F21Y2107/70 ,  F21Y2115/10 ,  H05K1/0283 ,  H05K1/189 ,  H05K2201/10106

Abstract: Embodiments of the present disclosure relate to a lighting strip, comprising a flexible printed circuit strip which comprises a plurality of wiring portions and a plurality of respective carrying portions, the wiring portions are used to supply electrical power to electric elements disposed on the carrying portions, and the carrying portions protrude from the wiring portions and are adapted to be bent around the wiring portions; a plurality of solid-state lighting elements respectively mounted on the carrying portions; wherein the wiring portion is provided with at least one pitch adjusting portion for adjusting a pitch between two adjacent carrying portions. Embodiments of the present disclosure also relate to a lighting device. According to the lighting strip and lighting device of the present disclosure, the positions of the solid-state lighting elements on the carrying portions, particularly the positions relative to the lighting elements, can be conveniently and precisely adjusted, thereby achieving a desired three-dimensional illumination shaping.

公开(公告)号：US09984603B1

公开(公告)日：2018-05-29

申请号：US15881394

申请日：2018-01-26

Applicant: Ultravision Technologies, LLC

Inventor： William Y. Hall

IPC: G09F13/00 ,  G09F13/22 ,  F21V23/02 ,  F21V31/00 ,  H05K7/20 ,  H05K5/03 ,  H05K1/18 ,  G06F3/147 ,  G06F3/14 ,  G06F1/18 ,  G06F1/26 ,  H01B11/02 ,  H05K7/14 ,  G09G5/14 ,  F21K9/20 ,  G06F1/20 ,  H01B7/282 ,  G09F9/302 ,  H01B9/00 ,  G06F1/16 ,  H05K5/00 ,  H05K5/02 ,  H04N7/00 ,  G09G3/32 ,  F21Y115/10 ,  F21Y101/00

CPC classification number: G09F13/22 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1446 ,  G06F3/147 ,  G09F9/3023 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/14 ,  G09G2300/026 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y02P70/611

Abstract: Embodiments of the present invention relate to modular display panels. In one embodiment, a modular display panel includes a printed circuit board, a shell, a plurality of LEDs, a power supply, and a heat conducting structure. The LEDs are attached to a first side of the printed circuit board. The shell contacts an opposite second side of the printed circuit board. The shell includes a back surface that includes an outer back surface of the panel. A driver circuit is disposed in the shell. The sidewalls of the shell include plastic. The printed circuit board is disposed between the power supply and the LEDs. The power supply includes a power converter for converting alternating current (AC) power to direct current (DC) power. The heat conducting structure is disposed between the power supply and the back surface of the shell. The modular display panel is sealed to be waterproof.