公开(公告)号：US20170241604A1

公开(公告)日：2017-08-24

申请号：US15181897

申请日：2016-06-14

Applicant: Hyundai Motor Company ,  Kia Motors Corporation

Inventor： Seung Woo Choi ,  Ho Sub Kim ,  Young Do Kim ,  Cheol Ho Kim

IPC: F21S8/10 ,  H05K1/03 ,  H05K3/00 ,  H05K1/09

CPC classification number: F21S41/141 ,  C08J2379/08 ,  F21S48/115 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/0014 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/05 ,  H05K2201/10106 ,  H05K2201/10113

Abstract: A flexible copper-clad laminate for a vehicle LED lamp is provided and includes a copper-clad layer and a composite layer that are laminated. The composite layer includes a polyimide layer and thermoplastic polyimide layers. An outermost layer of the composite layer is formed as a thermoplastic polyimide layer. A total thickness of the thermoplastic polyimide layers and an entire thickness of the polyimide layer with respect to a total thickness of the composite layer is about 10 to 50% and 50 to 90%, respectively. The total thickness of the thermoplastic polyimide layers and the entire thickness of the polyimide layer with respect to the thickness of the composite layer is about 20 to 40% and 60 to 80%, respectively. A thickness of the copper-clad layer is about 30 to 80 μm, and the total thickness of the composite layer is about 10 to 15 μm.

公开(公告)号：US20170208753A1

公开(公告)日：2017-07-27

申请号：US15480542

申请日：2017-04-06

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： JOSEPH HENDRIK ANNA MARIA JACOBS

IPC: A01G9/22 ,  D03D1/00 ,  D03D15/00 ,  H05K1/18 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  A01G9/20 ,  F41H3/02

CPC classification number: A01G9/26 ,  A01G9/20 ,  A01G9/22 ,  D03D1/0047 ,  D03D1/007 ,  D03D1/0088 ,  D03D15/00 ,  D03D15/0011 ,  D03D15/0066 ,  D03D15/0088 ,  D10B2101/06 ,  D10B2101/08 ,  D10B2101/20 ,  D10B2321/041 ,  D10B2321/10 ,  D10B2401/16 ,  D10B2401/22 ,  D10B2505/18 ,  F41H3/02 ,  H05K1/0274 ,  H05K1/038 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10113 ,  Y02A40/258 ,  Y02A40/274

Abstract: The invention relates to a shading device (10) for a greenhouse (15), with a shading element (20) and at least one lighting element (50,50′), wherein the shading element (20) comprises an outer side (21) and an inner side (22), the shading element (20) is formed from interwoven electrically conductive first thread elements (30,30′) and electrically insulating second thread elements (40), the first thread element (30,30′) comprises a reflective mean (33), reflecting an ambient light (60), the lighting element (50,50′) is arranged at the inner side (22) of the shading element (20) and connected with the first thread element (30,30′), and the lighting element (50,50′) is driven by an electrical current, conducted by the first thread element (30,30′), resulting in the emission of an artificial light (51), illuminating a plant (80) growing in the greenhouse (15).

公开(公告)号：US09706646B2

公开(公告)日：2017-07-11

申请号：US14761209

申请日：2014-01-15

Applicant: Hanqing Jiang ,  Hongyu Yu ,  Goran Konjevod ,  Yong Xu

Inventor： Hanqing Jiang ,  Hongyu Yu ,  Goran Konjevod ,  Yong Xu

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H01M2/20 ,  H01M10/04 ,  H01M10/0525 ,  H01M10/0583 ,  H01M10/0585 ,  H01M10/42 ,  H01M6/40 ,  H01M6/42 ,  H01G11/78

CPC classification number: H05K1/028 ,  H01G11/78 ,  H01M2/204 ,  H01M6/40 ,  H01M6/42 ,  H01M10/0436 ,  H01M10/0525 ,  H01M10/0583 ,  H01M10/0585 ,  H01M10/425 ,  H05K1/0272 ,  H05K1/0278 ,  H05K1/0281 ,  H05K1/0283 ,  H05K1/148 ,  H05K1/181 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/09036 ,  H05K2201/10015 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10113 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2203/085 ,  H05K2203/087 ,  H05K2203/09 ,  H05K2203/1184 ,  H05K2203/302

Abstract: An origami enabled manufacturing system. The system uses origami design principles to create functional materials, structures, devices and/or systems having an adjustable size and/or shape. An operational device can be coupled to a planar substrate shaped and sized to correspond to a desired origami shape of an origami pattern. A plurality of planar substrates can be coupled together by a plurality of connection members that corresponds to one or more crease of the origami pattern. An array of planar substrates can be formed that convert into a three dimensional structure with origami shape. The resulting three-dimensional structure provides smaller projection area, higher portability and deformability.

公开(公告)号：US09648755B2

公开(公告)日：2017-05-09

申请号：US14772888

申请日：2014-12-17

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Adrianus Johannes Stephanus Maria De Vaan ,  Wilhelmus Gerardus Maria Peels ,  Josephus Paulus Augustinus Deeben

IPC: H05K3/02 ,  H05K3/32 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/12 ,  H05K3/44 ,  H05K1/05

CPC classification number: H05K3/32 ,  H05K1/0284 ,  H05K1/056 ,  H05K1/092 ,  H05K3/0014 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/321 ,  H05K3/44 ,  H05K2201/0129 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2203/1461

Abstract: A method for manufacturing a non-planar printed circuit board assembly (1) is disclosed. The method comprises providing a planar formable substrate (2) for supporting a conductive material (3) and at least one electronic component (4), printing a circuit pattern of an uncured conductive material (3) on the planar substrate (2), forming the substrate (2) and the uncured conductive material (3) into a non-planar shape, and curing the conductive material (3), wherein the substrate (2) comprises a metal sheet and an electrically insulating coating (2b) arranged between the metal sheet and the conductive material (3).

公开(公告)号：US09642316B2

公开(公告)日：2017-05-09

申请号：US12599341

申请日：2008-05-07

Applicant: Joseph Hendrik Anna Maria Jacobs

Inventor： Joseph Hendrik Anna Maria Jacobs

IPC: A01G9/22 ,  A01G9/26 ,  D03D1/00 ,  D03D15/00 ,  F41H3/02 ,  H05K1/02 ,  H05K1/03

CPC classification number: A01G9/26 ,  A01G9/20 ,  A01G9/22 ,  D03D1/0047 ,  D03D1/007 ,  D03D1/0088 ,  D03D15/00 ,  D03D15/0011 ,  D03D15/0066 ,  D03D15/0088 ,  D10B2101/06 ,  D10B2101/08 ,  D10B2101/20 ,  D10B2321/041 ,  D10B2321/10 ,  D10B2401/16 ,  D10B2401/22 ,  D10B2505/18 ,  F41H3/02 ,  H05K1/0274 ,  H05K1/038 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10113 ,  Y02A40/258 ,  Y02A40/274

Abstract: A shading device for a greenhouse includes a shading element and at least one lighting element, wherein the shading element comprises an outer side and an inner side. The shading element is formed from interwoven electrically conductive first thread elements and electrically insulating second thread elements. The first and/or second thread elements each may be adapted for reflecting an ambient light. The lighting element(s) may be arranged at the inner side of the shading element and connected with the first thread elements, and the lighting element(s) may be driven by an electrical current, conducted by the first thread elements, resulting in the emission of an artificial light, which may illuminate a plant growing in the greenhouse.

公开(公告)号：US20160316570A1

公开(公告)日：2016-10-27

申请号：US14772888

申请日：2014-12-17

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： ADRIANUS JOHANNES STEPHANUS MARIA DE VAAN ,  WILHELMUS GERARDUS MARIA PEELS ,  JOSEPHUS PAULUS AUGUSTINUS DEEBEN

IPC: H05K3/32 ,  H05K3/12 ,  H05K3/00 ,  H05K3/44

CPC classification number: H05K3/32 ,  H05K1/0284 ,  H05K1/056 ,  H05K1/092 ,  H05K3/0014 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/321 ,  H05K3/44 ,  H05K2201/0129 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2203/1461

Abstract: A method for manufacturing a non-planar printed circuit board assembly (1) is disclosed. The method comprises providing a planar formable substrate (2) for supporting a conductive material (3) and at least one electronic component (4), printing a circuit pattern of an uncured conductive material (3) on the planar substrate (2), forming the substrate (2) and the uncured conductive material (3) into a non-planar shape, and curing the conductive material (3), wherein the substrate (2) comprises a metal sheet and an electrically insulating coating (2b) arranged between the metal sheet and the conductive material (3).

Abstract translation: 公开了一种用于制造非平面印刷电路板组件（1）的方法。 该方法包括提供用于支撑导电材料（3）和至少一个电子部件（4）的平面可成形基底（2），在平面基底（2）上印刷未固化的导电材料（3）的电路图案，形成 所述基板（2）和所述未固化的导电材料（3）成为非平面形状，并且固化所述导电材料（3），其中所述基板（2）包括金属片和布置在所述导电材料（3）之间的电绝缘涂层 金属片和导电材料（3）。

公开(公告)号：US20160270223A1

公开(公告)日：2016-09-15

申请号：US15032044

申请日：2014-11-05

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： KUNIGUNDE HADELINDE CHERENACK ,  JACOBUS PETRUS JOHANNES VAN OS ,  ROLAND MARINUS SCHUURBIERS

IPC: H05K1/03 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/038 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/181 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0281 ,  H05K2201/10113 ,  H05K2201/10151

Abstract: A device comprising a first and a second electrically conductive textile portion is provided, wherein the first and second textile portions are electrically isolated from each other. The device also comprises an electrical element having a first contact pad which is electrically connected to the first textile portion and a second contact pad which is electrically connected to the second textile portion, wherein the first and second textile portions are adapted to supply the electrical element with electrical power. An improved textile device is thereby provided, which is capable of supplying an electrical element with electrical power.

Abstract translation: 提供了包括第一和第二导电织物部分的装置，其中第一和第二织物部分彼此电隔离。 该装置还包括具有电连接到第一织物部分的第一接触焊盘和电连接到第二织物部分的第二接触焊盘的电气元件，其中第一和第二织物部分适于提供电气元件 具有电力。 由此提供了一种能够向电气元件供电的改进的纺织装置。

公开(公告)号：US20150373832A1

公开(公告)日：2015-12-24

申请号：US14744469

申请日：2015-06-19

Applicant: Taiwan Green Point Enterprises Co., Ltd.

Inventor： Pen-Yi LIAO ,  Hung-San PAN ,  Yu-Cheng CHEN ,  Hui-Ching CHUANG ,  Wen-Chia TSAI

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K3/0061 ,  H05K1/0203 ,  H05K1/0284 ,  H05K3/185 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2203/0709 ,  Y10T29/49156

Abstract: A circuit-and-heat-dissipation assembly includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer.

Abstract translation: 电路和散热组件包括：散热器，其包括吸热基座和散热元件，所述吸热基座具有电路形成表面和元件形成表面，所述散热元件从所述元件突出 形成表面，用于将从吸热基底传导到周围环境的热量散发; 形成在电路形成表面上的绝缘体层; 以及形成在绝缘体层上的图案电路。

公开(公告)号：US20150131300A1

公开(公告)日：2015-05-14

申请号：US14478327

申请日：2014-09-05

Applicant: Molex Incorporated

Inventor： Yi-Tse HO

IPC: F21V29/83 ,  F21K99/00 ,  F21V21/00

CPC classification number: F21V29/83 ,  F21K9/232 ,  F21V3/00 ,  F21V19/0055 ,  F21V29/77 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/182 ,  H05K3/381 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/09154 ,  H05K2201/09645 ,  H05K2201/09781 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10287 ,  H05K2201/10409 ,  H05K2203/107

Abstract: An illumination device comprises a holder, a plurality of light emitting elements, a translucent cover and a lamp cap structure. The holder comprises a heat dissipating base body and a carrying unit. The carrying unit is connected to a top portion of the heat dissipating base body and comprises a carrying base body, a circuit pattern and a heat dissipating pattern, the circuit pattern and the heat dissipating pattern are directly formed to a surface of the carrying base body, the circuit pattern has a plurality of mounting positions, the heat dissipating pattern at least extends from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body. The plurality of light emitting elements are respectively provided at the plurality of the mounting positions and establish an electrical connection with the circuit pattern.

Abstract translation: 照明装置包括保持器，多个发光元件，半透明盖和灯帽结构。 支架包括散热基体和承载单元。 承载单元连接到散热基体的顶部，并且包括承载基体，电路图案和散热图案，电路图案和散热图案直接形成在承载基体的表面上 电路图案具有多个安装位置，散热图案至少从靠近安装位置的区域延伸到散热图案可以与散热基体接触的区域。 多个发光元件分别设置在多个安装位置并与电路图形建立电连接。

公开(公告)号：US20150129899A1

公开(公告)日：2015-05-14

申请号：US14075122

申请日：2013-11-08

Applicant: Richard Speer

Inventor： Richard Speer

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/60 ,  H01L27/15

CPC classification number: H01L33/62 ,  H01L27/15 ,  H01L33/005 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K1/189 ,  H05K3/202 ,  H05K3/281 ,  H05K3/303 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2203/063 ,  Y02P70/613 ,  H01L2924/00

Abstract: Techniques are disclosed for integrating the LED lead frame into the LED circuit fabrication process. The LED packages within the lead frame may be spaced according to the final spacing of the LED packages on the finished circuit board, such that multiple LED packages may be attached to a circuit board at a time by applying the lead frame to circuit board and then removing portions of the lead frame, leaving the LED packages attached to the board. The LED packages may be attached using solder or conductive epoxy, in some embodiments. Alternatively, part of the lead frame may include conductive wires forming one or more strings of LED packages. An entire string of LED packages may then be removed from the lead frame in a single motion and placement may be performed for a string of LED packages all at once rather than for individual LED packages.

Abstract translation: 公开了将LED引线框架集成到LED电路制造工艺中的技术。 引线框架内的LED封装可以根据成品电路板上的LED封装件的最终间距间隔开，以便通过将引线框架施加到电路板上而将多个LED封装件一次连接到电路板，然后 去除引线框架的部分，留下附接到板的LED封装。 在一些实施例中，LED封装可以使用焊料或导电环氧树脂附着。 或者，引线框架的一部分可以包括形成一个或多个LED封装串的导线。 然后可以以单个运动从引线框架中移除整串LED封装，并且可以一次性地对一串LED封装执行放置，而不是针对各个LED封装。