公开(公告)号：US08405812B2

公开(公告)日：2013-03-26

申请号：US12861853

申请日：2010-08-24

Applicant: Youichirou Kamon ,  Hiroshi Haga ,  Tetsuroh Asakura

Inventor： Youichirou Kamon ,  Hiroshi Haga ,  Tetsuroh Asakura

IPC: G02F1/1345 ,  H05K1/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: G02F1/13458 ,  G02F1/1345 ,  G02F1/13452 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K3/361 ,  H05K3/368 ,  H05K3/4046 ,  H05K2201/0382 ,  H05K2201/09845 ,  H05K2201/10136 ,  H05K2201/1028

Abstract: A connecting structure of the present invention includes a first substrate, a second substrate on which the first substrate is laminated, and a sheet like connection body having one end connected to one principal surface of the first substrate and another end connected to one principal surface of the second substrate, wherein a lengthwise direction of the sheet like connection body is parallel to a perimeter part of the first substrate, and the sheet like connection body has a slit part extending from one of end portions thereof to a part thereof along the lengthwise direction, and has a first end and a second end divided by the slit part at one of end portions, the first end is connected to a principal surface of the first substrate in vicinity of a peripheral part of the first substrate, and the second end is connected to a principal surface of the second substrate in vicinity of a peripheral part of the first substrate.

Abstract translation: 本发明的连接结构包括第一基板，层叠有第一基板的第二基板以及与第一基板的一个主面连接的一端的片状连接体， 第二基板，其中片状连接体的长度方向平行于第一基板的周边部分，并且片状连接体具有从其一个端部沿其长度方向延伸到其一部分的狭缝部分 并且具有在一个端部处被狭缝部分分割的第一端和第二端，所述第一端在所述第一基板的周边部分附近与所述第一基板的主表面连接，并且所述第二端是 在第一基板的周边部分附近与第二基板的主表面连接。

公开(公告)号：US08354594B2

公开(公告)日：2013-01-15

申请号：US11814425

申请日：2006-01-24

Applicant: Markus Wolfel

Inventor： Markus Wolfel

IPC: H05K1/00

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: The invention relates to a wire-printed circuit board or card (1) comprising etched strip conductors (2) and wire conductors (6), which wire conductors run on and/or in the circuit board or card (1) between connection points (4). At least one of the wire conductors (6) has an essentially rectangular, for example, a square, cross-section.

Abstract translation: 本发明涉及一种包括蚀刻带状导体（2）和导线导体（6）的线印刷电路板或卡（1），其中导线在连接点之间和/或电路板或卡（1）之间延伸， 4）。 电线导体（6）中的至少一个具有基本上矩形的，例如正方形的横截面。

公开(公告)号：US20130005163A1

公开(公告)日：2013-01-03

申请号：US13579687

申请日：2011-03-03

Applicant: Dieter Holste ,  Ulrich Rosemeyer

Inventor： Dieter Holste ,  Ulrich Rosemeyer

IPC: H01R12/00

CPC classification number: H05K3/3405 ,  H05K3/4015 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/1034 ,  H05K2201/2072 ,  H05K2203/0455 ,  H05K2203/1178 ,  Y02P70/611

Abstract: The invention relates to an electrical contact arrangement of a spring contact element (10) on a printed circuit board (12) with a soldering area (16) arranged on a surface of the printed circuit board (12) and a planar contact area (18) arranged on the soldering area (16), wherein the spring contact element (10) can be arranged on the contact area (18).

Abstract translation: 本发明涉及一种弹性接触元件（10）在印刷电路板（12）上的电接触布置，其中布置在印刷电路板（12）的表面上的焊接区域（16）和平面接触区域（18） ）布置在焊接区域（16）上，其中弹簧接触元件（10）可以布置在接触区域（18）上。

公开(公告)号：US20120291273A1

公开(公告)日：2012-11-22

申请号：US13565057

申请日：2012-08-02

Applicant: Peter A. Hochstein

Inventor： Peter A. Hochstein

IPC: H05K3/30

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21V23/00 ,  F21V29/89 ,  G09F9/33 ,  H05K1/0203 ,  H05K1/053 ,  H05K1/056 ,  H05K3/202 ,  H05K3/305 ,  H05K2201/10106 ,  H05K2201/1028 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169

Abstract: An L.E.D. lamp assembly (20) includes an electrically insulative coating (24) disposed on a thermally conductive substrate (22). A plurality of light emitting diodes (26) are secured to the coating (24) and a circuit (40) is adhesively secured to the coating (24) in predetermined spaced lengths (42) along the coating (24) to establish discrete and electrically conductive spaced lengths (42) with the light emitting diodes (26) disposed between the spaced lengths (42). LED electrical leads (32) are secured to the spaced lengths (42) of the circuit (40) to electrically interconnect the light emitting diodes (26). The circuit (40) includes a foil tape (46) having an electrically conductive tape portion (48) and a coupling portion (50) disposed on the tape portion (48) for securing the foil tape (46) to the insulated substrate (22). Heat generated by the light emitting diodes (26) is transferred through the insulative coating (24) to the electrically and thermally conductive substrate (22) for dissipating the heat.

Abstract translation: 一个L.E.D. 灯组件（20）包括设置在导热基板（22）上的电绝缘涂层（24）。 多个发光二极管（26）固定到涂层（24）上，并且电路（40）沿着涂层（24）以预定间隔的长度（42）以固定方式固定到涂层（24）上，以建立离散和电气 导电间隔的长度（42），其中发光二极管（26）设置在间隔开的长度（42）之间。 LED电引线（32）固定到电路（40）的间隔长度（42）以电连接发光二极管（26）。 电路（40）包括具有导电带部分（48）和设置在带部分（48）上的耦合部分（50）的箔带（46），用于将箔带（46）固定到绝缘基底（22） ）。 由发光二极管（26）产生的热量通过绝缘涂层（24）传递到导电和导热基板（22）以散热。

公开(公告)号：US08274181B2

公开(公告)日：2012-09-25

申请号：US12418764

申请日：2009-04-06

Applicant: Shao-Feng Lu

Inventor： Shao-Feng Lu

IPC: H01B7/30 ,  H01B11/02 ,  H02B1/20 ,  H02G5/06

CPC classification number: H05K7/1432 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/142 ,  H05K3/366 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10333 ,  H05K2201/10409

Abstract: A structure for transmission in a power supply, particularly to a power structure for transmission for bearing large DC current, wherein the power supply includes a power input port for connecting to DC input power and a DC/DC conversion circuit for converting the DC input power into DC output power. The architecture including at least one power transmission board for disposing the power input port, wherein the power transmission board is electrically connected to the power process board with the DC/DC conversion circuit mounted thereon by at least one power conduction element. Therefore, through the power conduction elements replacing the conventional connecting wires with large diameter to connect the power input port and the power process board without disobeying the safety regulation, not only the space occupied by the bent connection wires can be reduced, but the collisions and damage to other components caused therefrom also can be avoided.

Abstract translation: 一种用于在电源中传输的结构，特别是用于承载大直流电流的用于传输的电力结构，其中电源包括用于连接到DC输入电力的电力输入端口和用于转换DC输入电力的DC / DC转换电路 进入直流输出电源。 所述架构包括至少一个用于布置所述电力输入端口的电力传输板，其中所述电力传输板通过至少一个电力传导元件安装在其上的DC / DC转换电路电连接到所述电力处理板。 因此，通过代替大直径的常规连接线的电力传导元件来连接电力输入端口和电源处理板，而不违背安全规定，不仅可以减少弯曲的连接线所占据的空间，而且可以减少碰撞和 也可以避免对其引起的其他成分的损害。

公开(公告)号：US08222089B2

公开(公告)日：2012-07-17

申请号：US13033307

申请日：2011-02-23

Applicant: Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

Inventor： Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

IPC: H01J9/00

CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H05K1/0203 ,  H05K1/189 ,  H05K2201/09109 ,  H05K2201/1028 ,  H05K2201/10674 ,  H05K2203/1581 ,  H01L2924/00

Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

Abstract translation: 公开了一种片上胶片（COF）型半导体封装以及使用其的器件。 COF型半导体封装可以包括包括顶表面和底表面的绝缘衬底，绝缘衬底的顶表面上的半导体器件，绝缘衬底的底表面上的散热部件，以及绝缘衬底的至少一个空间 绝缘基板的底表面和散热部件的顶表面。

公开(公告)号：US20110213443A1

公开(公告)日：2011-09-01

申请号：US12861729

申请日：2010-08-23

Applicant: Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC: A61F9/08

CPC classification number: A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20110155425A1

公开(公告)日：2011-06-30

申请号：US13041007

申请日：2011-03-04

Applicant: Keiji Matsumoto

Inventor： Keiji Matsumoto

IPC: H05K1/00

CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/1028 ,  H05K2201/10575 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00

Abstract: An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the underfill, and together with the underfill, constitutes the underfill film. The device may include solder bumps affixing the component to the circuit board, the underfill film having holes within which the solder bumps are aligned. There may be solder bumps on the underside of the circuit board promoting heat dissipation. There may be heat sinks on the circuit board to which the thermally conductive sheet is affixed promoting heat dissipation. The thermally conductive sheet may be affixed to a chassis promoting heat dissipation. The thermally conductive sheet thus promotes heat dissipation from the component to at least the circuit board.

公开(公告)号：US20110073355A1

公开(公告)日：2011-03-31

申请号：US12884701

申请日：2010-09-17

Applicant: Akira TAMURA

Inventor： Akira TAMURA

IPC: H05K1/02

CPC classification number: H05K3/32 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13011 ,  H01L2224/13014 ,  H01L2224/1316 ,  H01L2224/14131 ,  H01L2224/81101 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/14 ,  H05K2201/0314 ,  H05K2201/09681 ,  H05K2201/09854 ,  H05K2201/1028 ,  H05K2201/10348 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/01024 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: An interposer for connecting a semiconductor and a circuit board includes an insulating material sheet, a through hole which is formed in the insulating material sheet and an elastic conductive contact which is formed from an elastic conductive sheet and provided in the through hole.

Abstract translation: 用于连接半导体和电路板的插入件包括绝缘材料片，形成在绝缘材料片中的通孔和由弹性导电片形成并设置在通孔中的弹性导电接触。

公开(公告)号：US07813796B2

公开(公告)日：2010-10-12

申请号：US11455028

申请日：2006-07-24

Applicant: Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC: A61N1/00

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。