公开(公告)号：US5998228A

公开(公告)日：1999-12-07

申请号：US839759

申请日：1997-04-15

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K1/00 ,  B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R12/00 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  G01R31/26

CPC classification number: H05K7/1069 ,  B23K1/0008 ,  B23K20/004 ,  C23C18/1605 ,  C23C18/165 ,  C25D7/12 ,  G01R1/07342 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/72 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  B23K2201/40 ,  C25D21/02 ,  C25D5/08 ,  C25D5/22 ,  G01R31/2856 ,  G01R31/2863 ,  G01R31/2886 ,  H01L2223/54453 ,  H01L2224/02311 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0558 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/13022 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45572 ,  H01L2224/45599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L23/544 ,  H01L24/45 ,  H01L24/49 ,  H01L24/83 ,  H01L24/90 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613 ,  Y10S977/712 ,  Y10S977/723 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4922 ,  Y10T29/49812 ,  Y10T428/12396 ,  Y10T428/12528

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.

Abstract translation: 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。 这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。 接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。 使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

公开(公告)号：US5984697A

公开(公告)日：1999-11-16

申请号：US984443

申请日：1997-12-03

Applicant: Sean A. Moran ,  Roger W. Berg

Inventor： Sean A. Moran ,  Roger W. Berg

IPC: H01R12/52 ,  H01R13/24 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/14 ,  H05K9/00 ,  H01R4/66

CPC classification number: H01R13/2457 ,  H01R12/52 ,  H01R13/24 ,  H05K3/368 ,  H05K3/4015 ,  H05K7/142 ,  H05K9/0016 ,  H05K1/0215 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10962 ,  H05K2201/2036 ,  H05K2201/209 ,  H05K3/341 ,  H05K3/3447 ,  Y02P70/611

Abstract: A ground clip apparatus is designed to make ground contact between two circuit boards as they are mated together. A standoff member is mounted on one of the boards and a spring clip member is mounted on the other board facing the standoff member. The spring clip member has spring arms which are biased against the standoff member when the boards are mated together to make a reliable ground contact. At the same time, the standoff member resists deflection of either board towards the other board.

Abstract translation: 接地夹设备被设计成在两个电路板配合在一起时使接地。 支架构件安装在其中一个板上，并且弹簧夹构件安装在另一个板上，面向支座构件。 弹簧夹构件具有当板被配合在一起以使得可靠的接地接触时偏压抵靠构件的弹簧臂。 同时，支座构件抵抗任一板向另一板的挠曲。

公开(公告)号：US5839189A

公开(公告)日：1998-11-24

申请号：US415714

申请日：1995-04-03

Applicant: Michael R. Pomeroy ,  Eugene E. Segerson

Inventor： Michael R. Pomeroy ,  Eugene E. Segerson

IPC: H01R12/57 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H07R9/09

CPC classification number: H05K3/366 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/1031 ,  H05K2201/10946 ,  H05K2201/10962 ,  H05K3/301 ,  H05K3/3421 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: A bracket assembly and method for attaching pin-in-hole components and daughter boards to a surface mount printed circuit board which alleviates the problem of the limited peel strength of the interconnect patterns on the surface of surface mount boards and also prevents these components from being subjected to the heat of soldering techniques such as reflow soldering.

Abstract translation: 一种用于将销孔组件和子板附接到表面安装印刷电路板的支架组件和方法，其减轻了表面安装板表面上的互连图案的有限的剥离强度的问题，并且还防止这些部件 受到诸如回流焊接的焊接技术的热。

公开(公告)号：US5774353A

公开(公告)日：1998-06-30

申请号：US802145

申请日：1997-02-19

Applicant: Christopher J. Wieloch

Inventor： Christopher J. Wieloch

IPC: H01L25/07 ,  H02M7/00 ,  H02P27/08 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K5/00 ,  H05K7/14 ,  H02M1/00

CPC classification number: H02P27/08 ,  H01L25/072 ,  H01R12/718 ,  H02M7/003 ,  H05K3/303 ,  H05K7/1432 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/13055 ,  H01L2924/19107 ,  H01R12/515 ,  H05K1/144 ,  H05K2201/1031 ,  H05K2201/10424 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49128

Abstract: A fixture is provided for facilitating the fabrication of a motor controller of the type including a power substrate module and a control circuit board mounted to and electrically coupled to the power substrate module via a plurality of conductors. The fixture is preferably a ring-like structure made of epoxy-fiberglass laminate. Apertures for engaging and holding the conductors are provided in the fixture at locations corresponding to conducting pads on the power substrate module. For fabrication, the power substrate module and the fixture are preformed and solder is disposed on the conducting pads of the module. During fabrication, the conductors are inserted into the apertures in the fixture and the fixture and conductors are positioned over the preformed power substrate module to bring the conductors into contact with the conducting pads. The fixture and power substrate module are then passed through a reflow oven to melt the solder and complete the connection of the conductors to the module. The fixture is left in place and connections to the conductors, such as by installing a control circuit board, may be completed in subsequent process or assembly steps.

Abstract translation: 提供了一种用于便于制造电动机控制器的固定装置，该电动机控制器包括经由多个导体安装到电耦合到电力基板模块并电耦合到电力基板模块的电源基板模块和控制电路板。 固定装置优选为由环氧玻璃纤维层压板制成的环状结构。 用于接合和保持导体的孔设置在固定装置中对应于电源基板模块上的导电焊盘的位置处。 为了制造，功率基板模块和夹具被预成型，并且焊料设置在模块的导电垫上。 在制造期间，导体插入固定装置中的孔中，并且固定装置和导体被定位在预先形成的功率基板模块上，以使导体与导电垫接触。 然后将夹具和电源基板模块通过回流炉以熔化焊料并完成导体与模块的连接。 固定装置留在原处，并且可以在随后的过程或组装步骤中完成与导体的连接，例如通过安装控制电路板。

公开(公告)号：US5773780A

公开(公告)日：1998-06-30

申请号：US797023

申请日：1996-02-07

Applicant: Benjamin N. Eldridge ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gaetan L. Mathieu

IPC: B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: B23K20/004 ,  C25D7/12 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/24 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  H05K7/1069 ,  B23K2201/40 ,  C25D21/02 ,  C25D5/08 ,  C25D5/22 ,  G01R3/00 ,  G01R31/2884 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/4569 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613

Abstract: The efficacy of electrical discharges for severing bond wires and/or for forming balls at the ends of bond wires (including bond wires already severed by alternative mechanisms) is improved by performing the electrical discharges in the presence of ultraviolet light. A "spark gap" is formed between an EFO electrode and the wire, one of which serves as the cathode of the spark gap. Preferably, the ultraviolet light is directed at the element serving as the cathode of the spark gap. Providing photoemission at the cathode element of the spark gap stabilizes arc/plasma formation and produces more reliable and predictable results. This technique may be used in conjunction with negative EFO systems or with positive EFO systems, and may benefit from either direct or field-assisted photoemission.

Abstract translation: 通过在紫外光的存在下进行放电，提高了在接合线（包括已被替代机构切断的接合线）的端部切断接合线和/或形成球的放电功效。 在EFO电极和导线之间形成“火花隙”，其中一个用作火花隙的阴极。 优选地，紫外线指向用作火花隙的阴极的元件。 在火花间隙的阴极元件处提供光电发射使电弧/等离子体形成稳定，并产生更可靠和可预测的结果。 这种技术可以与负EFO系统或正EFO系统结合使用，并可从直接或场辅助光电发射中受益。

公开(公告)号：US5772451A

公开(公告)日：1998-06-30

申请号：US533584

申请日：1995-10-18

Applicant: Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R9/09

CPC classification number: B23K20/004 ,  G01R1/0483 ,  G01R1/07314 ,  G01R1/07357 ,  G01R1/07378 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  H05K7/1069 ,  B23K2201/40 ,  C25D21/02 ,  C25D5/08 ,  C25D5/22 ,  G01R1/06711 ,  G01R3/00 ,  G01R31/2886 ,  H01L21/76897 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613

Abstract: Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Resilient contact structures extend from a top surface of a support substrate, and solder-ball (or other suitable) contact structures are disposed on a bottom surface of the support substrate. Composite interconnection elements are used as the resilient contact structures disposed atop the support substrate. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate. In an embodiment intended to receive a LGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate. In an embodiment intended to receive a BGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally parallel to the top surface of the support substrate.

Abstract translation: 表面贴装焊接插座允许诸如半导体封装的电子部件可拆卸地安装到电路板上。 弹性接触结构从支撑基板的顶表面延伸，并且焊球（或其它合适的）接触结构设置在支撑基板的底表面上。 复合互连元件用作设置在支撑基板上的弹性接触结构。 以任何合适的方式，通过支撑衬底将支撑衬底上的弹性接触结构中的选定的接触结构连接到支撑衬底的底表面上的相应接触结构。 在旨在接收LGA型半导体封装的实施例中，在弹性接触结构和半导体封装的外部连接点之间，以大体垂直于支撑衬底顶表面的接触力进行压力接触。 在旨在接收BGA型半导体封装的实施例中，在弹性接触结构和半导体封装的外部连接点之间以大体平行于支撑衬底的顶表面的接触力进行压力接触。

公开(公告)号：US5133673A

公开(公告)日：1992-07-28

申请号：US687058

申请日：1991-04-18

Applicant: Frank J. J. Dijkshoorn

Inventor： Frank J. J. Dijkshoorn

IPC: H01R4/24 ,  H01R43/16 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/326 ,  H01R4/2495 ,  H01R43/16 ,  H05K2201/0397 ,  H05K2201/1031 ,  H05K2201/1059 ,  H05K3/306 ,  H05K3/4092 ,  Y02P70/611

Abstract: A connecting element comprising a base plate, having contact teeth formed from the base plate by through cuts. Each of the through cuts adjoins two further through cuts to prevent tearing of the base plate. A punch is provided for both cutting the base plate and folding the contact teeth.

公开(公告)号：US4422128A

公开(公告)日：1983-12-20

申请号：US290692

申请日：1981-08-06

Applicant: Donald B. Zurlinden ,  Reginald C. Heltmach, Jr.

Inventor： Donald B. Zurlinden ,  Reginald C. Heltmach, Jr.

IPC: H05K3/32 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/3447 ,  H05K2201/09063 ,  H05K2201/1031 ,  H05K2201/10916 ,  H05K2201/10962 ,  H05K3/325 ,  H05K3/34 ,  Y02P70/611

Abstract: The lead of a T03 style transistor extends through a hole in a printed circuit board. A resilient connector is provided for connecting the transistor lead to a printed circuit conductor in a manner to allow dip soldering but avoiding stress on the lead which might break the glass seal on the transistor package. The connector is a spring clip having a U-shaped portion with a pair of aligned holes in the legs to grip the transistor lead, one of the legs extending into another U-shaped portion which resiliently engages the circuit board conductor when assembled to the transistor lead. The connections are secured by dip soldering to complete the assembly.

Abstract translation: T03型晶体管的引线延伸穿过印刷电路板中的一个孔。 提供弹性连接器，用于将晶体管引线连接到印刷电路导体，以允许浸焊，但避免引线上的应力，这可能会破坏晶体管封装上的玻璃密封。 连接器是具有U形部分的弹簧夹，其中在腿中具有一对对齐的孔以夹持晶体管引线，其中一个腿延伸到另一个U形部分中，该U形部分在组装到晶体管时弹性地接合电路板导体 铅。 连接通过浸焊固定，以完成组装。

公开(公告)号：US3529212A

公开(公告)日：1970-09-15

申请号：US3529212D

申请日：1967-12-26

Applicant: CORNING GLASS WORKS

Inventor： BALLARD ROBERT A

IPC: H05K1/18

CPC classification number: H05K1/184 ,  H05K2201/0397 ,  H05K2201/09981 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10583 ,  H05K2201/10636 ,  Y02P70/611

公开(公告)号：US3299393A

公开(公告)日：1967-01-17

申请号：US34566864

申请日：1964-02-18

Applicant: Q T CIRCUITS CO

Inventor： KELLEY GEORGE F ,  TEDFORD CLOIS W

IPC: H01R9/28 ,  H05K1/00 ,  H05K3/32 ,  H05K7/02

CPC classification number: H05K7/02 ,  H01R9/28 ,  H05K1/0286 ,  H05K3/325 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10325 ,  Y02P70/611