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    Power Module with Press-Fit Clamps
    81.
    发明申请
    Power Module with Press-Fit Clamps 有权
    带压合夹的功率模块

    公开(公告)号：US20120275121A1

    公开(公告)日：2012-11-01

    申请号：US13094695

    申请日：2011-04-26

    Applicant: Henning M. Hauenstein

    Inventor： Henning M. Hauenstein

    IPC: H05K7/00

    CPC classification number: H01L25/072 ,  H01L23/48 ,  H01L24/72 ,  H01L25/18 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01R12/721 ,  H01R12/778 ,  H05K1/117 ,  H05K2201/10386 ,  H01L2924/00

    Abstract: According to an exemplary embodiment, a bondwireless power module residing on a top surface of a substrate includes at least one input power pad providing power to the module and at least one output current pad providing output current from the module. At least one press-fit input power clamp engages a top side of the at least one input power pad, and engages a bottom surface of the substrate. Also, at least one press-fit output current clamp engages a top side of the at least one output current pad, and engages the bottom surface of the substrate. The at least one press-fit input power clamp can include at least one top prong and at least one bottom prong. Furthermore, the at least one bottom prong can press the input power pad into the at least one top prong.

    Abstract translation: 根据示例性实施例，驻留在衬底的顶表面上的接合无线电功率模块包括至少一个输入功率垫，为模块提供电力，以及至少一个输出电流焊盘提供来自模块的输出电流。 至少一个压入式输入功率夹与所述至少一个输入功率垫的顶侧接合，并接合所述衬底的底表面。 而且，至少一个按压配合输出电流夹具接合至少一个输出电流焊盘的顶侧，并接合衬底的底表面。 至少一个压入式输入功率夹具可以包括至少一个顶部插脚和至少一个底部插脚。 此外，至少一个底部插脚可以将输入功率垫按压到至少一个顶部插脚中。

    Flexible printed circuit board and liquid crystal display device including the same
    82.
    发明授权
    Flexible printed circuit board and liquid crystal display device including the same 失效
    柔性印刷电路板和包括其的液晶显示装置

    公开(公告)号：US08300199B2

    公开(公告)日：2012-10-30

    申请号：US12434909

    申请日：2009-05-04

    Applicant: Tae-Joon Kim

    Inventor： Tae-Joon Kim

    IPC: G02F1/1345 ,  H05K1/11

    CPC classification number: H05K1/118 ,  G02B6/0068 ,  G02B6/0083 ,  G02F1/133615 ,  H05K3/28 ,  H05K3/363 ,  H05K3/4046 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/10386

    Abstract: A flexible printed circuit board includes a base film made of an insulating material, a power application wiring disposed on a first surface of the base film, a bypass wiring disposed on a second surface, opposite the first surface, of the base film, a first connection wiring which electrically connects the power application wiring to the bypass wiring, a second connection wiring spaced apart from the first connection wiring and which electrically connects the power application wiring to the bypass wiring, and a first cover film disposed on the first surface of the base film to cover at least a first portion of the second connection wiring. At least a first portion of the first connection wiring is exposed through the first cover film.

    Abstract translation: 柔性印刷电路板包括由绝缘材料制成的基膜，设置在基膜的第一表面上的电力施加布线，设置在基膜的与第一表面相对的第二表面上的旁路布线，第一 连接布线，其将电力施加布线电连接到旁路布线;第二连接布线，与第一连接布线间隔开并且将电力施加布线电连接到旁路布线;以及第一覆盖膜，设置在第一表面上 基膜以覆盖第二连接布线的至少第一部分。 第一连接布线的至少第一部分通过第一覆盖膜露出。

    THERMALLY DECOUPLING FUSE HOLDER AND ASSEMBLY
    85.
    发明申请
    THERMALLY DECOUPLING FUSE HOLDER AND ASSEMBLY 审中-公开
    热绝缘保险丝座和组件

    公开(公告)号：US20100090792A1

    公开(公告)日：2010-04-15

    申请号：US12483754

    申请日：2009-06-12

    Applicant: Stephen J. Whitney ,  Gordon T. Dietsch ,  Vincent Minh-Tu Tran

    Inventor： Stephen J. Whitney ,  Gordon T. Dietsch ,  Vincent Minh-Tu Tran

    IPC: H01H85/22

    CPC classification number: H05K3/301 ,  H01H85/0418 ,  H01H85/202 ,  H01H2085/0414 ,  H01H2085/2085 ,  H05K3/3426 ,  H05K2201/062 ,  H05K2201/10181 ,  H05K2201/1031 ,  H05K2201/10386 ,  H05K2201/10636 ,  H05K2201/10757 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

    Abstract: In one aspect of the present invention, subminiature fuses are soldered to a PCB via clips attached to the fuse end caps. The clips are physically attached to the PCB pads, enabling the fuse to be replaced if needed and providing thermal decoupling between the fuse and the heating sinking solder/PCB pads. The fuse and clips can also be picked and placed in one operation. In another aspect, improved fuse clips are provided that include tabs that separate the housing portions of the clips from the heating sinking solder/PCB pads. Such improved clips further enhance thermal decoupling. In a further aspect, an improved fuse is provided, in which the thermal decoupling tabs just described are provided directly with the fuse. In yet a further aspect, a thermally insulative fuse body is provided to further decouple the fuse element from its surroundings.

    Abstract translation: 在本发明的一个方面，通过连接到保险丝端盖的夹子将超小型保险丝焊接到PCB。 夹子物理连接到PCB焊盘，使熔断器可以更换，如果需要，并提供保险丝和加热焊锡/ PCB焊盘之间的热解耦。 保险丝和夹子也可以被拾取并放置在一个操作中。 在另一方面，提供了改进的熔断器夹，其包括将夹子的壳体部分与加热凹陷焊料/ PCB焊盘分离的突片。 这种改进的夹子进一步增强了热解耦。 在另一方面，提供了一种改进的保险丝，其中刚刚描述的热去耦接头直接与保险丝一起提供。 在另一方面，提供了一种绝热熔丝体，以进一步使熔丝元件与其周围环路分离。

    Load detection apparatus
    86.
    发明申请
    Load detection apparatus 审中-公开
    负载检测装置

    公开(公告)号：US20090211375A1

    公开(公告)日：2009-08-27

    申请号：US12378787

    申请日：2009-02-19

    Applicant: Hajime Nakagawa

    Inventor： Hajime Nakagawa

    IPC: G01L1/22

    CPC classification number: G01L5/221 ,  G01L1/2281 ,  H05K1/181 ,  H05K2201/10151 ,  H05K2201/10386 ,  H05K2201/10689 ,  Y02P70/611

    Abstract: An apparatus for detecting a load is disclosed. The apparatus includes a printed circuit board having a wiring pattern. The apparatus further includes a load sensing element located on the printed circuit board and including a pressure-sensitive member. The pressure-sensitive member has an electric property that is changeable according to the load. The apparatus further includes a load detection circuit arranged on the printed circuit board, connected with the load sensing element through the wiring pattern of the printed circuit board, and configured to detect a detection result of the load based on a change in the electric property of the load sensing element.

    Abstract translation: 公开了一种用于检测负载的装置。 该装置包括具有布线图案的印刷电路板。 该装置还包括负载感测元件，其位于印刷电路板上并包括压敏元件。 压敏部件具有根据负载而变化的电气特性。 该装置还包括负载检测电路，其布置在印刷电路板上，通过印刷电路板的布线图案与负载感测元件连接，并且被配置为基于电特性的变化来检测负载的检测结果 载荷传感元件。

    One-piece PC board magnet wire terminal
    87.
    发明授权
    One-piece PC board magnet wire terminal 失效
    一体式PC板电磁线端子

    公开(公告)号：US07556543B2

    公开(公告)日：2009-07-07

    申请号：US11926657

    申请日：2007-10-29

    Applicant: Ronald Martin Weber

    Inventor： Ronald Martin Weber

    IPC: H01R11/22

    CPC classification number: H01R4/2454 ,  H01R4/4809 ,  H01R12/53 ,  H01R12/721 ,  H05K3/325 ,  H05K2201/09181 ,  H05K2201/10287 ,  H05K2201/10386 ,  H05K2201/1059 ,  H05K2201/10962

    Abstract: A system and method for terminating a wire to an electrical device, such as a printed circuit board, is disclosed. The system includes a terminal having slots configured to receive, secure and form an electrical connection with the wire. The terminal also has compliant electrical contact fingers that form a physical and electrical connection with the electrical device, thereby electrically connecting and physically securing the wire to the device. The compliant fingers exert a normal force on the electrical device to secure the terminal and wire to the electrical device.

    Abstract translation: 公开了一种用于将线材端接到例如印刷电路板的电气设备的系统和方法。 该系统包括具有被配置为接收，固定和形成与电线的电连接的槽的端子。 该终端还具有与电气设备形成物理和电气连接的顺应性电接触指，从而将电线电连接并物理地固定到设备上。 柔性手指在电气装置上施加法向力以将端子和线固定到电气装置。

    Configurations and methods for embedding electronics or light emitters in manufactured materials
    88.
    发明授权
    Configurations and methods for embedding electronics or light emitters in manufactured materials 有权
    将电子产品或发光体嵌入制造材料中的配置和方法

    公开(公告)号：US07543956B2

    公开(公告)日：2009-06-09

    申请号：US11364304

    申请日：2006-02-28

    Applicant: Colin Piepgras ,  Kevin J. Dowling

    Inventor： Colin Piepgras ,  Kevin J. Dowling

    IPC: F21S19/00 ,  F21S2/00

    CPC classification number: H05K3/284 ,  B29C39/10 ,  B29C39/12 ,  F21K9/00 ,  F21K9/90 ,  F21S4/20 ,  F21V31/04 ,  F21Y2115/10 ,  H05B33/0803 ,  H05B33/0815 ,  H05B33/0821 ,  H05B33/0863 ,  H05K1/0239 ,  H05K1/14 ,  H05K1/144 ,  H05K3/3405 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10295 ,  H05K2201/10333 ,  H05K2201/10386 ,  H05K2203/308 ,  Y10S362/80

    Abstract: Methods and means for embedding electronic components, such as LED-based light sources and associated control circuitry, into molded or continuously cast surface materials (e.g., material manufactured under the trademark CORIAN®). During the manufacture of the surface material, the components can be held in position using a scaffold or frame constructed of a sacrificial material, the same material as the finished surface material and/or another material used in the manufacture of the finished product. The embedded components can include control circuitry, e.g., printed circuit boards, for separately controlling each component, power conductors and data busses. Conductors and/or busses can be in the form of conductive rails, wire mesh or sheets. Access to the conductors in the finished product can be made by a number of methods, including but not limited to sanding, grinding, drilling into, screwing into, and/or inserting pins into the finished material.

    Abstract translation: 将诸如基于LED的光源和相关控制电路的电子部件嵌入到模制或连续铸造的表面材料（例如，以商标CORIAN制造的材料）中的方法和装置。 在制造表面材料期间，可以使用由牺牲材料构成的支架或框架，与成品表面材料相同的材料和/或用于制造成品的另一种材料来将部件保持就位。 嵌入式组件可以包括用于单独控制每个组件，电力导体和数据总线的控制电路，例如印刷电路板。 导体和/或母线可以是导电轨，丝网或片的形式。 通过多种方法可以访问成品中的导体，包括但不限于打磨，研磨，钻入，拧入和/或将销插入成品材料中。

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