Thermal barrier for a thermistor
    81.
    发明授权
    Thermal barrier for a thermistor 有权
    热敏电阻的热障

    公开(公告)号:US07145110B1

    公开(公告)日:2006-12-05

    申请号:US11254078

    申请日:2005-10-19

    Applicant: Howard Rosen

    Inventor: Howard Rosen

    Abstract: The present invention is a an effective thermal barrier between the thermistor and higher temperature solids or electrical components in a thermostat or its equivalent device. The invention thermal barrier substantially reduces or essentially eliminates undesired conductive heating of the thermistor from support means or other electrical components.

    Abstract translation: 本发明是热敏电阻和恒温器或其等效装置中的较高温度固体或电气部件之间的有效热障。 本发明的热障基本上减少或基本上消除了热敏电阻从支撑装置或其它电气部件的不期望的导电加热。

    Electrical connector with a solder ball locking structure
    82.
    发明授权
    Electrical connector with a solder ball locking structure 失效
    具有焊球锁定结构的电连接器

    公开(公告)号:US07128622B2

    公开(公告)日:2006-10-31

    申请号:US11252693

    申请日:2005-10-17

    Inventor: Chou Hsuan Tsai

    Abstract: An electrical connector includes a base, solder balls, terminals and locking members. The base is formed with terminal slots and solder ball slots. The terminal slots respectively communicate with the solder ball slots via channels. The solder balls are respectively disposed in the solder ball slots. Each solder ball has a bottom protruding beyond a bottom of the base. Each ball contacts a bottom surface of the solder ball slot disposed between the terminal slot and the solder ball. The terminals are respectively disposed in the terminal slots and electrically connected to the solder balls. The terminals have contacts extending in a direction toward tops of the terminal slots. The locking members are separated from the terminals and respectively inserted into the solder ball slots. Each locking member locks up at one side of the solder ball to prevent the solder ball from escaping out of the solder ball slot.

    Abstract translation: 电连接器包括基座,焊球,端子和锁定构件。 基座形成有端子槽和焊球槽。 端子槽分别经由通道与焊球槽连通。 焊球分别设置在焊球槽中。 每个焊球具有突出超过底部底部的底部。 每个球接触设置在端子槽和焊球之间的焊球槽的底表面。 端子分别设置在端子槽中并电连接到焊球。 端子具有沿朝向端子槽顶部的方向延伸的触点。 锁定构件与端子分离并分别插入到焊球槽中。 每个锁定构件锁定在焊球的一侧,以防止焊球从焊球槽中逸出。

    Electrical connector with a solder ball locking structure
    83.
    发明申请
    Electrical connector with a solder ball locking structure 失效
    具有焊球锁定结构的电连接器

    公开(公告)号:US20060084328A1

    公开(公告)日:2006-04-20

    申请号:US11252693

    申请日:2005-10-17

    Applicant: Chou Tsai

    Inventor: Chou Tsai

    Abstract: An electrical connector includes a base, solder balls, terminals and locking members. The base is formed with terminal slots and solder ball slots. The terminal slots respectively communicate with the solder ball slots via channels. The solder balls are respectively disposed in the solder ball slots. Each solder ball has a bottom protruding over a bottom of the base. The terminals are respectively disposed in the terminal slots and electrically connected to the solder balls. The terminals have contacts extending in a direction toward tops of the terminal slots. The locking members are respectively inserted into the solder ball slots. Each locking member locks up at one side of the solder ball to prevent the solder ball from escaping out of the solder ball slot.

    Abstract translation: 电连接器包括基座,焊球,端子和锁定构件。 基座形成有端子槽和焊球槽。 端子槽分别经由通道与焊球槽连通。 焊球分别设置在焊球槽中。 每个焊球具有在基座的底部上方突出的底部。 端子分别设置在端子槽中并电连接到焊球。 端子具有沿朝向端子槽顶部的方向延伸的触点。 锁定构件分别插入到焊球槽中。 每个锁定构件锁定在焊球的一侧,以防止焊球从焊球槽中逸出。

    Manufacturing method for legless electronics parts
    84.
    发明申请
    Manufacturing method for legless electronics parts 审中-公开
    无腿电子零件的制造方法

    公开(公告)号:US20030079335A1

    公开(公告)日:2003-05-01

    申请号:US09983828

    申请日:2001-10-26

    Inventor: Yao-Tsung Chi

    Abstract: A manufacturing method for legless electronic parts used in a surface mounting type printing circuit board is disclosed. The legless electronic parts are made from leg type electronic elements. The method comprises the steps of: manufacturing a leg type electronic part and painting; cutting legs of a leg type parts to become legless electronic parts; pressing metal caps into two ends of the legless parts for replacing the legs; testing the resistance of a legless parts for determining the resistance, error and fault ratio; removing unqualified parts; and packing the tested parts.

    Abstract translation: 公开了一种用于表面安装型印刷电路板中的无腿电子部件的制造方法。 无腿电子部件由腿型电子元件制成。 该方法包括以下步骤:制造腿型电子部件和喷漆; 切割腿部腿部成为无腿电子部件; 将金属盖压入无腿部分的两端,以更换腿部; 测试无腿部件的电阻,以确定电阻,误差和故障率; 清除不合格的零件; 并包装测试部件。

    Surface mounted holes for printed circuit boards
    85.
    发明授权
    Surface mounted holes for printed circuit boards 失效
    用于印刷电路板的表面安装孔

    公开(公告)号:US5607313A

    公开(公告)日:1997-03-04

    申请号:US394831

    申请日:1995-02-27

    Applicant: Bengt E. Nyman

    Inventor: Bengt E. Nyman

    Abstract: A method and device for improved assembly to hole-free PCBs of high aspect ratio components or any other components that are not easily assembled to a hole-free PCB by standard surface-mount technology (SMT), such as pins, lugs, tabs, and test points. A metal or other electrically conductive member having one or more holes ("holed component") is mounted to the PCB, typically on a solder pad on the PCB. The said electrically conductive member, will have a low aspect ratio. The hole, which may be round, rectangular, or threaded, is sized to provide an interference fit with the male projection of the component which will be inserted within the hole. The holed component, like other low aspect ratio SMT components, may be delivered on tape and reel and conventional surface mount or pick and place equipment is used to surface mount the holed component on the hole-free PCB, following which the holed component is soldered in place. Then, the male projections of the components can be press-fitted into the holes of one or more of such soldered holed components in the same manner as such components were previously interference fitted into the holes of PCBs, using high speed inserter machines.

    Abstract translation: 一种方法和装置,用于通过标准表面贴装技术(SMT)例如针,凸耳,凸片等将高纵横比部件或其他不能轻易组装到无孔PCB的组件的无孔PCB组装改进, 和测试点。 具有一个或多个孔(“孔组件”)的金属或其它导电构件通常安装在PCB上,PCB上的焊盘上。 所述导电构件将具有低纵横比。 该孔可以是圆形的,矩形的或螺纹的,其尺寸被设计成提供与插入孔内的部件的阳突出物的过盈配合。 与其他低纵横比的SMT组件一样,孔组件可以在磁带和卷轴上传送,并且常规的表面贴装或拾取和放置设备用于将无孔PCB上的孔组件表面安装,然后将孔组件焊接 到位。 然后,使用高速插入机,将这些部件的凸形突起可以按照相同的方式压配合到一个或多个这样的焊接孔部件的孔中,这些部件预先被干涉地装配到PCB的孔中。

    Hybrid integrated circuit device
    86.
    发明授权
    Hybrid integrated circuit device 失效
    混合集成电路器件

    公开(公告)号:US5495223A

    公开(公告)日:1996-02-27

    申请号:US168184

    申请日:1993-12-17

    Abstract: A hybrid integrated circuit device includes a circuit board having at least two electrical conductors; a chip resistor bridgingly disposed across two of the electrical conductors of the circuit board; and solder electrically connecting the chip resistor to the two electrical conductors. The chip resistor has an electrically insulating substrate, two electrodes disposed on the electrically insulating substrate, separated from each other, and each electrode has a contact end electrically contacting the electrical conductors of the circuit board and a resistor element disposed on the electrically insulating substrate and electrically connected to the contact ends of the electrodes. The solder electrically connects the electrodes of the chip resistor to the electrical conductors of the circuit board.

    Abstract translation: 混合集成电路装置包括具有至少两个电导体的电路板; 桥接电路,跨过电路板的两个电导体; 以及将芯片电阻器与两个电导体电连接的焊料。 芯片电阻器具有电绝缘基板,设置在电绝缘基板上的两个电极彼此分离,并且每个电极具有与电路板的电导体和设置在电绝缘基板上的电阻元件电接触的接触端, 电连接到电极的接触端。 焊料将芯片电阻器的电极与电路板的电导体电连接。

    Printed circuit board apparatus
    87.
    发明授权
    Printed circuit board apparatus 失效
    印刷电路板装置

    公开(公告)号:US5281770A

    公开(公告)日:1994-01-25

    申请号:US707041

    申请日:1991-05-29

    Abstract: A printed circuit board apparatus comprises a printed circuit board. The printed circuit board includes a first and a second surface and a hole portion. A printed pattern is formed on the first surface, and a parts having a lead is mounted on the second surface. The printed circuit board apparatus also includes an eyelet and plural solder entering portions. The eyelet includes a curling portion and a head portion positioned on the first and second surfaces of the printed circuit board, respectively, and a cylindrical portion, connecting the head and curling portion, inserted into the hole of the printed circuit board. A plurality of solder entering portions are formed at equal intervals on the curling portion. From the solder entering portions, solder enters into space between the curling portion and the first surface face of the printed pattern surrounding the hole of the printed circuit board and the eyelet.

    Abstract translation: 印刷电路板装置包括印刷电路板。 印刷电路板包括第一和第二表面和孔部分。 印刷图案形成在第一表面上,具有引线的部分安装在第二表面上。 印刷电路板装置还包括孔眼和多个焊料进入部分。 孔眼分别包括位于印刷电路板的第一和第二表面上的卷曲部分和头部,以及连接头部和卷曲部分的插入印刷电路板的孔中的圆柱形部分。 多个焊料进入部分以相等的间隔形成在卷曲部分上。 从焊料进入部分,焊料进入位于印刷电路板和孔眼的孔周围的印刷图案的卷曲部分和第一表面之间的空间中。

    Polarized electronic component and its manufacturing process
    88.
    发明授权
    Polarized electronic component and its manufacturing process 失效
    极化电子元件及其制造工艺

    公开(公告)号:US4562514A

    公开(公告)日:1985-12-31

    申请号:US588708

    申请日:1984-03-12

    Applicant: Jose V. Sansa

    Inventor: Jose V. Sansa

    Abstract: The present invention concerns a polarized chip type electronic component comprising a body provided with a cathode contact or negative input and an anode contact or positive output. A first metallic caliper is connected to the cathode contact and a second metallic caliper is disposed opposite the first, substantially parallel to it, the second caliper being constituted by one face extended by two lateral arms, the face comprising a fold which is substantially parallel to the arms of the said caliper and on which is fixed the anode wire, an insulating packing material being disposed between the two calipers in such a way as to coat its body and its electrodes. The fold in the caliper gives an external notification of polarization.

    Abstract translation: 本发明涉及一种极化芯片型电子部件,其包括设置有阴极触点或负极输入以及阳极触点或正极输出的主体。 第一金属卡钳连接到阴极接触件,并且第二金属卡钳布置成与第一金属卡钳相对,第一金属卡钳基本上平行于第一金属卡钳,第二卡钳由由两个侧臂延伸的一个面构成, 所述卡钳的臂固定在阳极线上,绝缘包装材料以这样的方式设置在两个卡钳之间,以便涂覆其主体及其电极。 卡尺的折叠给出了极化的外部通知。

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