Abstract:
The present invention is a an effective thermal barrier between the thermistor and higher temperature solids or electrical components in a thermostat or its equivalent device. The invention thermal barrier substantially reduces or essentially eliminates undesired conductive heating of the thermistor from support means or other electrical components.
Abstract:
An electrical connector includes a base, solder balls, terminals and locking members. The base is formed with terminal slots and solder ball slots. The terminal slots respectively communicate with the solder ball slots via channels. The solder balls are respectively disposed in the solder ball slots. Each solder ball has a bottom protruding beyond a bottom of the base. Each ball contacts a bottom surface of the solder ball slot disposed between the terminal slot and the solder ball. The terminals are respectively disposed in the terminal slots and electrically connected to the solder balls. The terminals have contacts extending in a direction toward tops of the terminal slots. The locking members are separated from the terminals and respectively inserted into the solder ball slots. Each locking member locks up at one side of the solder ball to prevent the solder ball from escaping out of the solder ball slot.
Abstract:
An electrical connector includes a base, solder balls, terminals and locking members. The base is formed with terminal slots and solder ball slots. The terminal slots respectively communicate with the solder ball slots via channels. The solder balls are respectively disposed in the solder ball slots. Each solder ball has a bottom protruding over a bottom of the base. The terminals are respectively disposed in the terminal slots and electrically connected to the solder balls. The terminals have contacts extending in a direction toward tops of the terminal slots. The locking members are respectively inserted into the solder ball slots. Each locking member locks up at one side of the solder ball to prevent the solder ball from escaping out of the solder ball slot.
Abstract:
A manufacturing method for legless electronic parts used in a surface mounting type printing circuit board is disclosed. The legless electronic parts are made from leg type electronic elements. The method comprises the steps of: manufacturing a leg type electronic part and painting; cutting legs of a leg type parts to become legless electronic parts; pressing metal caps into two ends of the legless parts for replacing the legs; testing the resistance of a legless parts for determining the resistance, error and fault ratio; removing unqualified parts; and packing the tested parts.
Abstract:
A method and device for improved assembly to hole-free PCBs of high aspect ratio components or any other components that are not easily assembled to a hole-free PCB by standard surface-mount technology (SMT), such as pins, lugs, tabs, and test points. A metal or other electrically conductive member having one or more holes ("holed component") is mounted to the PCB, typically on a solder pad on the PCB. The said electrically conductive member, will have a low aspect ratio. The hole, which may be round, rectangular, or threaded, is sized to provide an interference fit with the male projection of the component which will be inserted within the hole. The holed component, like other low aspect ratio SMT components, may be delivered on tape and reel and conventional surface mount or pick and place equipment is used to surface mount the holed component on the hole-free PCB, following which the holed component is soldered in place. Then, the male projections of the components can be press-fitted into the holes of one or more of such soldered holed components in the same manner as such components were previously interference fitted into the holes of PCBs, using high speed inserter machines.
Abstract:
A hybrid integrated circuit device includes a circuit board having at least two electrical conductors; a chip resistor bridgingly disposed across two of the electrical conductors of the circuit board; and solder electrically connecting the chip resistor to the two electrical conductors. The chip resistor has an electrically insulating substrate, two electrodes disposed on the electrically insulating substrate, separated from each other, and each electrode has a contact end electrically contacting the electrical conductors of the circuit board and a resistor element disposed on the electrically insulating substrate and electrically connected to the contact ends of the electrodes. The solder electrically connects the electrodes of the chip resistor to the electrical conductors of the circuit board.
Abstract:
A printed circuit board apparatus comprises a printed circuit board. The printed circuit board includes a first and a second surface and a hole portion. A printed pattern is formed on the first surface, and a parts having a lead is mounted on the second surface. The printed circuit board apparatus also includes an eyelet and plural solder entering portions. The eyelet includes a curling portion and a head portion positioned on the first and second surfaces of the printed circuit board, respectively, and a cylindrical portion, connecting the head and curling portion, inserted into the hole of the printed circuit board. A plurality of solder entering portions are formed at equal intervals on the curling portion. From the solder entering portions, solder enters into space between the curling portion and the first surface face of the printed pattern surrounding the hole of the printed circuit board and the eyelet.
Abstract:
The present invention concerns a polarized chip type electronic component comprising a body provided with a cathode contact or negative input and an anode contact or positive output. A first metallic caliper is connected to the cathode contact and a second metallic caliper is disposed opposite the first, substantially parallel to it, the second caliper being constituted by one face extended by two lateral arms, the face comprising a fold which is substantially parallel to the arms of the said caliper and on which is fixed the anode wire, an insulating packing material being disposed between the two calipers in such a way as to coat its body and its electrodes. The fold in the caliper gives an external notification of polarization.
Abstract:
Finished electrical components having wire lead terminals are converted to elements having planar terminations by placing end caps or shoes over the ends of an existing component. A finished film capacitor having radial wire leads that is presently on a distributor's shelf, ready for shipment, may be converted to a capacitor for solder reforming by the use of these conversion caps. The capacitor may then be secured in a planar fashion to a substrate.
Abstract:
Surface connections of electrical component leads to circuit substrate lands are made with split sleeves on the lead ends, adjusted for contact with the lands, and soldered in position to join leads, sleeves, and lands.