公开(公告)号：US20020089343A1

公开(公告)日：2002-07-11

申请号：US10058951

申请日：2002-01-28

Applicant: Advantest Corp.

Inventor： Theodore A. Khoury ,  Mark R. Jones ,  James W. Frame

IPC: G01R031/02

CPC classification number: G01R3/00 ,  G01R1/06711 ,  G01R1/07342

Abstract: A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed on a planar surface of a substrate by a photolithography technology. The contact structure is formed of a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer formed on the silicon base and abutted from the inclined support, and a conductive layer made of conductive material formed on the insulation layer so that a beam portion is created by the insulation layer and the conductive layer, where wherein the beam portion exhibits a spring force in a transversal direction of the beam portion to establish a contact force when the tip of the beam portion pressed against a contact target.

Abstract translation: 通过光刻技术在基板的平面上形成用于测试半导体晶片，封装LSI或印刷电路板的接触结构。 接触结构由具有通过各向异性蚀刻工艺形成的倾斜支撑部分的硅基底，形成在硅基底上并与倾斜支撑件抵接的绝缘层和由形成在绝缘层上的导电材料制成的导电层形成 梁部分由绝缘层和导电层产生，其中梁部分在梁部分的横向方向上呈现弹簧力，以在梁部分的尖端压靠接触目标时建立接触力。

公开(公告)号：US20020027444A1

公开(公告)日：2002-03-07

申请号：US09929533

申请日：2001-08-13

Applicant: Advantest Corp.

Inventor： Mark R. Jones ,  Theodore A. Khoury

IPC: G01R031/02

CPC classification number: G01R1/06744 ,  G01R3/00 ,  H01R4/04 ,  H01R13/2414

Abstract: A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a micro-fabrication process, a contact pad connected to contact substrate and provided at the bottom surface of the contact substrate, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, a conductive member for connecting the contact pad the PCB pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.

Abstract translation: 由由导电材料制成的接触结构形成的接触结构和通过微加工工艺在接触基板上形成的接触结构的封装和互连，连接到接触基板并设置在接触基板的底表面处的接触焊盘，印刷 设置在与接触焊盘电连接的印刷电路板（PCB）基板上的电路板（PCB）焊盘，用于将接触焊盘连接到PCB焊盘的导电部件，设置在接触基板下方的弹性体，用于允许互连中的灵活性 和接触结构的包装，以及设置在弹性体和PCB基板之间的支撑结构，用于支撑接触结构，接触基底和弹性体。

公开(公告)号：US20030090259A1

公开(公告)日：2003-05-15

申请号：US10326392

申请日：2002-12-23

Applicant: ADVANTEST CORP.

Inventor： James Warren Frame

IPC: G01R001/00

CPC classification number: G01R31/2886 ,  G01R1/07378

Abstract: In order to form a modular interface between a DUT board, which is housing devices under tests (DUT), to cables connected to a test head, a board spacer is provided that has an array of connectors. Each cable is connected to a respective connector, and the DUT board contains a corresponding array of connection points which are less than or equal to the number of connectors in the arrays on the board spacer. In this way, a common board spacer can be used to connect the cables to DUT boards housing different types of DUTs since the location of the connection points on the board spacer is known and kept constant. This interface allows a high speed and high fidelity connection between the test head and the devices on the DUTs for frequencies in excess of 50 MHz.

公开(公告)号：US20020076971A1

公开(公告)日：2002-06-20

申请号：US10077223

申请日：2002-02-16

Applicant: Advantest Corp.

Inventor： Theodore A. Khoury ,  Robert Edward Aldaz

IPC: H01R004/24

CPC classification number: G01R3/00 ,  G01R1/06733 ,  G01R1/07307 ,  H01R12/57 ,  H01R13/2407

Abstract: A contact structure for establishing electrical contact with contact targets. The contact structure is formed of a contact substrate and a plurality of contactors in which each of the contactors has a hook shape. The contactor has a tip portion which is protruded in a vertical direction to form a contact point, a base portion which is inserted in a through hole provided on the contact substrate in such a way that an end of the contactor functions as a contact pad for electrical connection at a bottom surface of the contact substrate, and a curved portion provided between the tip portion and the base portion which produces a contact force when the contactor is pressed against the contact target. A further aspect is a method for producing a large number of contactors on a wafer in a horizonal direction and removing the contactors from the wafer to be mounted on a substrate to form the contact structure such as a probe card, IC chip, or other contact mechanism in a vertical direction.

Abstract translation: 用于与接触目标建立电接触的接触结构。 接触结构由接触基板和多个接触器形成，其中每个接触器具有钩形。 接触器具有在垂直方向上突出以形成接触点的尖端部，插入到设置在接触基板上的通孔中的基部，使得接触器的一端用作接触垫， 在接触基板的底表面处的电连接，以及设置在尖端部分和基部之间的弯曲部分，当接触器被压靠在接触靶上时产生接触力。 另一方面是一种用于在水平方向上在晶片上产生大量接触器的方法，并且将待接收器从待安装在基板上的晶片移除以形成接触结构，例如探针卡，IC芯片或其它接触 机构在垂直方向。

公开(公告)号：US6363022B2

公开(公告)日：2002-03-26

申请号：US92235101

申请日：2001-08-02

Applicant: ADVANTEST CORP

Inventor： TSUTO MASARU

IPC: G01R31/28 ,  G06F12/16 ,  G11C29/10 ,  G11C29/56 ,  G11C7/00

CPC classification number: G11C29/56 ,  G11C29/10

Abstract: A pattern generator generates parallel pattern data and applies it to packet generating parts provided corresponding to row-address and column-address pins of a memory device under test. The pattern generator contains a packet select signal generating part that generates two packet select signals for generating respective cycle numbers in a sequence of cycles in an arbitrary packet period. In data setting parts provided corresponding to the row-address and column-address pins, respectively, bit positions of the data to be fed to the corresponding pins in the parallel pattern data are prestored in correspondence with the cycle numbers. In each cycle the bit positions corresponding to the cycle number are read out by the packet select signals corresponding to the row-address and column-address pins, and in the corresponding packet generating parts data bits corresponding to their bit positions in the parallel pattern data are selected and provided to the corresponding pins.

Abstract translation: 模式发生器产生并行模式数据并将其应用于与被测存储器件的行地址和列地址引脚相对应地提供的分组生成部分。 图案生成器包括分组选择信号生成部，其生成两个分组选择信号，用于在任意分组周期中以循环周期生成各个周期数。 在与行地址和列地址引脚相对应地设置的数据设置部分中，分别将要馈送到并行模式数据中的相应引脚的数据的位位置与循环数相对应地预存。 在每个周期中，对应于循环编号的位位置由对应于行地址和列地址引脚的分组选择信号读出，并且在对应的分组生成部分中，对应于它们在并行模式数据中的位位置的数据位 被选择并提供给相应的引脚。

公开(公告)号：US20030173661A1

公开(公告)日：2003-09-18

申请号：US10412009

申请日：2003-04-11

Applicant: Advantest Corp.

Inventor： Yu Zhou ,  David Yu ,  Robert Edward Aldaz ,  Theodore A. Khoury

IPC: H01L023/043

CPC classification number: G01R1/06711 ,  G01R1/073 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07371 ,  G01R1/07378 ,  G01R3/00 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01R12/52 ,  H01R12/57 ,  H01R13/2407 ,  H01R13/2414 ,  H01R13/2435 ,  H01R13/2464 ,  H05K3/20 ,  H05K3/4015 ,  H01L2924/00 ,  H01L2224/13 ,  H01L2224/05599

Abstract: A contact structure for establishing electrical connection with contact targets. The contact structure is formed of a contactor carrier and a plurality of contactors. The contactor has an upper end oriented in a vertical direction, a straight beam portion oriented in a direction opposite to the upper end and having a lower end which functions as a contact point for electrical connection with a contact target, a return portion returned from the lower end and running in parallel with the straight beam portion to create a predetermined gap therebetween, a diagonal beam portion provided between the upper end and the straight beam portion to function as a spring.

公开(公告)号：US20020070726A1

公开(公告)日：2002-06-13

申请号：US10066870

申请日：2002-02-04

Applicant: Advantest Corp.

Inventor： Shigeru Sugamori

IPC: G01R001/00

CPC classification number: G01R31/31921 ,  G01R31/3004 ,  G01R31/3191

Abstract: A power source current measurement unit provided in a semiconductor test system for measuring a power source current of a device under test with high speed and accuracy. The power source measurement unit includes a DA (digital-to-analog) converter for generating a source voltage to be supplied to a device under test based on a digital signal received, an operational amplifier for forming a negative feedback loop and supplying the source voltage from the DA converter to a power pin of the device under test thereby supplying a power source current to the power pin through a current measurement resistor whose resistance is known, a voltage amplifier for amplifying a voltage representing the amount of power source current supplied to the device under test, an integration circuit for integrating an output signal of the voltage amplifier for a predetermined integration time, and an AD (analog-to-digital) converter for converting an output signal of the integration circuit after the integration time.

Abstract translation: 一种电源电流测量单元，设置在半导体测试系统中，用于以高速度和精确度测量被测器件的电源电流。 电源测量单元包括：DA（数模转换器），用于根据所接收的数字信号产生要提供给被测器件的电源电压;运算放大器，用于形成负反馈回路并提供源电压 从DA转换器到被测器件的电源引脚，从而通过已知电阻的电流测量电阻将电源电流提供给电源引脚，放大电压放大器，用于放大代表提供给电源的电源电流量 被测器件，用于对预定积分时间积分电压放大器的输出信号的积分电路和用于在积分时间之后转换积分电路的输出信号的AD（模拟 - 数字）转换器。

公开(公告)号：US20020024348A1

公开(公告)日：2002-02-28

申请号：US09929532

申请日：2001-08-13

Applicant: Advantest Corp.

Inventor： Mark R. Jones ,  Theodore A. Khoury

IPC: G01R031/02

CPC classification number: G01R1/06744 ,  G01R3/00 ,  H01R4/04 ,  H01R13/2414

Abstract: A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a micro-fabrication process, a contact pad connected to contact substrate and provided at the bottom surface of the contact substrate, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, a conductive member for connecting the contact pad the PCB pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.

公开(公告)号：US6433877B2

公开(公告)日：2002-08-13

申请号：US81924501

申请日：2001-03-28

Applicant: ADVANTEST CORP

Inventor： WATANABE MASAO ,  OKUBO AKIKO

IPC: G01B11/30 ,  G01N21/21 ,  G01N21/88 ,  G01N21/94 ,  G01N21/95 ,  G01J4/04 ,  G01B21/17

CPC classification number: G01N21/211 ,  G01B11/303 ,  G01N21/88 ,  G01N21/94 ,  G01N21/9501

Abstract: A surface inspection device irradiates a laser beam onto the surface of a sample, scans the surface two-dimensionally, and detects the intensities of the s-polarized light component and p-polarized light component of the reflected laser beam. RR (reflectance ratio), which is the ratio of the reflective intensities of the s- and p-polarized light components, is calculated for each position of the surface of the sample, and the two-dimensional distribution of RR on the surface of the sample is detected. The distribution width of this measured RR is compared with the natural width for a clean sample, and the surface of the sample is determined to be contaminated when, as the result of comparison, the RR distribution width diverges from the natural width. The absence or presence of contamination on the microscopically rough surface of a sample can therefore be quickly and easily determined based on the RR of the reflective intensities of the s- and p-polarized light components.

Abstract translation: 表面检查装置将激光束照射到样品的表面上，二维扫描该表面，并检测反射激光束的s偏振光分量和p偏振光分量的强度。 对样品表面的每个位置计算出s（p偏振光分量）和p偏振光分量的反射强度之比（RR）的RR（反射率比），并且在该表面上的RR的二维分布 检测样品。 将该测量的RR的分布宽度与清洁样品的自然宽度进行比较，并且当作为比较的结果，RR分布宽度与自然宽度分开时，样品的表面被确定为被污染。 因此，可以基于s偏振光分量和p偏振光分量的反射强度的RR快速容易地确定样品的微观粗糙表面上不存在或存在污染。

公开(公告)号：US20010023770A1

公开(公告)日：2001-09-27

申请号：US09765113

申请日：2001-01-18

Applicant: Advantest Corp.

Inventor： Mark R. Jones ,  Theodore A. Khoury

IPC: H02G003/08

CPC classification number: G01R31/2808 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/07811 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a photolithography process, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end, and the other end of the contact trace is provided with a contact pad for establishing packaging and interconnection from an upper surface thereof, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.

Abstract translation: 由导电材料制成的接触结构形成并通过光刻工艺在接触基板上形成的接触结构的封装和互连，形成在接触基板上并且在一端电连接到接触结构的接触迹线 接触迹线的端部设置有用于从其上表面建立封装和互连的接触焊盘，设置在印刷电路板（PCB）基板上以与接触焊盘电连接的印刷电路板（PCB）焊盘， 设置在接触基板下方的弹性体，用于允许接触结构的互连和封装的灵活性，以及​​设置在弹性体和PCB基板之间的用于支撑接触结构，接触基板和弹性体的支撑结构。