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    Method for Producing an Electronic Circuit
    6.
    发明申请
    Method for Producing an Electronic Circuit 有权
    电子电路的制造方法

    公开(公告)号：US20070231968A1

    公开(公告)日：2007-10-04

    申请号：US11575586

    申请日：2005-11-28

    Applicant: Wolfgang Jacob ,  Christoph Ruf ,  Albert-Andreas Hoebel ,  Rolf Becker

    Inventor： Wolfgang Jacob ,  Christoph Ruf ,  Albert-Andreas Hoebel ,  Rolf Becker

    IPC: H01L21/02

    CPC classification number: H01L23/49575 ,  H01L23/49537 ,  H01L23/49562 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips (46) with essentially the same structure are mounted on a surface (13) pertaining to a first conductor carrier (10) and coated with strip conductors (16). Said two semiconductor chips (46) comprise a first surface (49) and a second surface (58), one semiconductor chip (46) being mounted on the conductor carrier surface (13) with the first surface (49) thereof, and the other semiconductor chip (46) being mounted on the conductor carrier surface (13) with the second surface (58) thereof. The second surface (58) of the first semiconductor chip (46) and the first surface (49) of the other semiconductor chip (46) are interconnected by a lead frame (64) with an A.C. power supply (31).

    Abstract translation: 本发明涉及电子电路的制造方法。 根据所述方法，具有基本上相同结构的两个半导体芯片（46）安装在与第一导体载体（10）相关的表面（13）上并且涂覆有带状导体（16）。 所述两个半导体芯片（46）包括第一表面（49）和第二表面（58），一个半导体芯片（46）与其第一表面（49）一起安装在导体载体表面（13）上，另一个半导体芯片 半导体芯片（46）与第二表面（58）安装在导体载体表面（13）上。 第一半导体芯片（46）的第二表面（58）和另一个半导体芯片（46）的第一表面（49）通过引脚框架（64）与交流电源（31）互连。

    Method for improving the manufacturing safety of weld joints
    7.
    发明授权
    Method for improving the manufacturing safety of weld joints 失效
    提高焊接接头的制造安全性的方法

    公开(公告)号：US06488199B1

    公开(公告)日：2002-12-03

    申请号：US09674939

    申请日：2000-12-29

    Applicant: Jürgen Schwaiger ,  Rolf Becker

    Inventor： Jürgen Schwaiger ,  Rolf Becker

    IPC: B23K3102

    CPC classification number: H05K3/403 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/248 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/035 ,  H05K2201/09181 ,  H05K2201/10909 ,  Y02P70/613

    Abstract: A method for increasing the manufacturing certainty of soldered connections between a ceramic carrier and a printed-circuit board. It includes the method step of applying a first decomposition-resistant metallization layer on a ceramic carrier and the subsequent imprinting onto the first metallizing layer of a second metallizing layer, improving the wetting performance. In this manner, it is possible to achieve an increase in the overall metallizing layer thickness in the edge area of a soldered connection, whose solder rise in turn makes possible an optical, fully-automatic monitoring of the soldered connection.

    Abstract translation: 一种用于增加陶瓷载体和印刷电路板之间的焊接连接的制造确定性的方法。 其包括在陶瓷载体上施加第一耐分解金属化层的方法步骤，以及随后的压印到第二金属化层的第一金属化层上，改善润湿性能。 以这种方式，可以实现焊接连接的边缘区域中的整体金属化层厚度的增加，其焊料上升反过来使得焊接连接的光学全自动监控成为可能。

    Inflatable foil sachet, especially for packaging purposes
    9.
    发明授权
    Inflatable foil sachet, especially for packaging purposes 失效
    充气箔袋，特别适用于包装用途

    公开(公告)号：US5351828A

    公开(公告)日：1994-10-04

    申请号：US118950

    申请日：1993-09-08

    Applicant: Rolf Becker ,  Wolfram Becker

    Inventor： Rolf Becker ,  Wolfram Becker

    IPC: B65D30/22 ,  B65D30/24 ,  B65D81/05 ,  B65D81/07 ,  B65D33/24

    CPC classification number: B31D5/0073 ,  B65D31/147 ,  B65D81/052 ,  B29L2031/7138

    Abstract: The invention relates to a foil sachet (1) with at least one chamber (7) consisting of an upper and lower foil (2, 3) secured together by a closed seam (5, 6). In order to fill the chambers (7) with a substance, especially air, there is a channel (10, 14) having channel sections (14) opening in the region of a seam (5, 6) and preferably in the region of the corner of the chamber concerned where there is an aperture in said chamber. There are preferably a main (10) and a subsidiary channel (14), wherein the main channel may also run outside the foil sachet (1).

    Abstract translation: PCT No.PCT / DE90 / 00516 Sec。 一九九二年二月二十八日 102（e）日期1992年2月28日PCT提交1990年7月11日PCT公布。 公开号WO91 / 00834 日本1991年1月24日。本发明涉及一种具有至少一个室（7）的薄片小袋（1），所述室（7）由通过封闭接缝（5,6）固定在一起的上部和下部薄片（2,3）组成。 为了用物质（特别是空气）填充室（7），存在通道（10,14），其具有在接缝（5,6）的区域中开口的通道部分（14），并且优选地在 所述腔室的角部位于所述腔室中有孔。 优选地具有主（10）和辅助通道（14），其中主通道也可以在箔袋（1）外部流动。

    Vehicle with an antilock controller
    10.
    发明授权
    Vehicle with an antilock controller 失效
    带有防抱死控制器的车辆

    公开(公告)号：US5316379A

    公开(公告)日：1994-05-31

    申请号：US71197

    申请日：1993-06-02

    Applicant: Rolf Becker ,  Ulrich Belzner ,  Rolf-Hermann Mergenthaler ,  Gerhard Heess

    Inventor： Rolf Becker ,  Ulrich Belzner ,  Rolf-Hermann Mergenthaler ,  Gerhard Heess

    IPC: B60T8/1755 ,  B60T8/1764 ,  B62D6/04 ,  B62D7/15 ,  B62D6/00 ,  B60T8/32

    CPC classification number: B62D6/003 ,  B60T8/1755 ,  B60T8/1764 ,  B62D7/159 ,  B60T2201/16 ,  B60T2260/022 ,  B60T2260/024

    Abstract: System for controlling yawing moment in a vehicle equipped with ABS and rear wheel steering includes a controller which generates a compensation steering angle for the rear wheels based on the difference between brake pressures at the front wheels. The difference is filtered so that the angle is zero up to a minimum pressure threshold and thereafter consists of a constant portion added to a variable portion which decreases with time. The compensation steering angle so generated may be modified by a correction factor dependent on the transverse acceleration of the vehicle and a further correction factor dependent on the velocity.

    Abstract translation: 用于控制配备有ABS和后轮转向装置的车辆中的横摆力矩的系统包括基于前轮上的制动压力的差产生后轮的补偿转向角的控制器。 该差被滤波，使得角度为零直到最小压力阈值，其后由加到可随时间减小的可变部分的恒定部分组成。 所产生的补偿转向角可以通过取决于车辆的横向加速度的校正因子和取决于速度的另外的校正因子来修改。

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