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    Printed circuit board, semiconductor package, card apparatus, and system
    1.
    发明授权
    Printed circuit board, semiconductor package, card apparatus, and system 有权
    印刷电路板，半导体封装，卡片设备和系统

    公开(公告)号：US08026616B2

    公开(公告)日：2011-09-27

    申请号：US12352056

    申请日：2009-01-12

    Applicant: Soon-yong Hur ,  Mo-rae Kim ,  Hyeong-seob Kim

    Inventor： Soon-yong Hur ,  Mo-rae Kim ,  Hyeong-seob Kim

    IPC: H01L23/52 ,  H01L23/48

    CPC classification number: H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/099 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A printed circuit board providing high reliability using a packaging of high capacity semiconductor chip, a semiconductor package, and a card and a system using the semiconductor package. The semiconductor package includes a substrate having a first surface and a second surface, a semiconductor chip mounted on the first surface of the substrate, at least one land disposed on the second surface of the substrate, and whose circumference includes a plurality of first group arcs, a mask layer covering the second surface of the substrate and including at least one opening that exposes the at least one land, and at least one external terminal disposed on the at least one land, wherein a portion of the at least one land is covered by the mask layer, and a sidewall of another portion of the at least one land is exposed by the at least one opening, and the circumference of the at least one opening includes a plurality of second group arcs, and a radius of the outermost arc from among the plurality of first group arcs is equal to a radius of the outermost arc from among the plurality of second group arcs.

    Abstract translation: 一种印刷电路板，其使用大容量半导体芯片，半导体封装和卡的封装以及使用半导体封装的系统提供高可靠性。 半导体封装包括具有第一表面和第二表面的衬底，安装在衬底的第一表面上的半导体芯片，设置在衬底的第二表面上的至少一个焊盘，并且其周边包括多个第一组弧 覆盖基板的第二表面并包括暴露至少一个焊盘的至少一个开口的掩模层和设置在至少一个焊盘上的至少一个外部端子，其中所述至少一个焊盘的一部分被覆盖 并且所述至少一个平台的另一部分的侧壁被所述至少一个开口暴露，并且所述至少一个开口的圆周包括多个第二组弧，并且所述最外弧的半径 多个第一组弧之间的距离等于多个第二组弧之中的最外弧的半径。

    PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, CARD APPARATUS, AND SYSTEM
    3.
    发明申请
    PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, CARD APPARATUS, AND SYSTEM 有权
    印刷电路板，半导体封装，卡装置和系统

    公开(公告)号：US20090189271A1

    公开(公告)日：2009-07-30

    申请号：US12352056

    申请日：2009-01-12

    Applicant: Soon-yong HUR ,  Mo-rae Kim ,  Hyeong-seob Kim

    Inventor： Soon-yong HUR ,  Mo-rae Kim ,  Hyeong-seob Kim

    IPC: H01L23/498

    CPC classification number: H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/099 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A printed circuit board providing high reliability using a packaging of high capacity semiconductor chip, a semiconductor package, and a card and a system using the semiconductor package. The semiconductor package includes a substrate having a first surface and a second surface, a semiconductor chip mounted on the first surface of the substrate, at least one land disposed on the second surface of the substrate, and whose circumference includes a plurality of first group arcs, a mask layer covering the second surface of the substrate and including at least one opening that exposes the at least one land, and at least one external terminal disposed on the at least one land, wherein a portion of the at least one land is covered by the mask layer, and a sidewall of another portion of the at least one land is exposed by the at least one opening, and the circumference of the at least one opening includes a plurality of second group arcs, and a radius of the outermost arc from among the plurality of first group arcs is equal to a radius of the outermost arc from among the plurality of second group arcs.

    Abstract translation: 一种印刷电路板，其使用大容量半导体芯片，半导体封装和卡的封装以及使用半导体封装的系统提供高可靠性。 半导体封装包括具有第一表面和第二表面的衬底，安装在衬底的第一表面上的半导体芯片，设置在衬底的第二表面上的至少一个焊盘，并且其周边包括多个第一组弧 覆盖基板的第二表面并包括暴露至少一个焊盘的至少一个开口的掩模层和设置在至少一个焊盘上的至少一个外部端子，其中所述至少一个焊盘的一部分被覆盖 并且所述至少一个平台的另一部分的侧壁被所述至少一个开口暴露，并且所述至少一个开口的圆周包括多个第二组弧，并且所述最外弧的半径 多个第一组弧之间的距离等于多个第二组弧之中的最外弧的半径。

    Memory module and connection interface between the memory module and circuit board
    5.
    发明授权
    Memory module and connection interface between the memory module and circuit board 失效
    内存模块和内存模块与电路板之间的连接接口

    公开(公告)号：US07573724B2

    公开(公告)日：2009-08-11

    申请号：US11146000

    申请日：2005-06-07

    Applicant: Soon-Yong Hur

    Inventor： Soon-Yong Hur

    IPC: H01R12/16

    CPC classification number: H05K3/325 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H05K1/141 ,  H05K3/284 ,  H05K2201/10159 ,  H05K2201/10446 ,  H05K2201/10537 ,  H05K2201/10545 ,  H05K2201/2018 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: A motherboard may have contact pads arranged along a peripheral region on one or both surfaces thereof. A memory module may have unit packages fixed to an upper plate and a lower plate of a module frame. The unit packages may be spaced apart from each other. The upper and the lower unit packages may have contact terminals facing each other. The contact terminals may be elastically bendable, and/or the unit packages may be mounted on the plates via elastic members. The peripheral region of the motherboard may be inserted into the memory module, so the contact terminals of the memory module may elastically contact with and be electrically coupled to the contact pads of the motherboard.

    Abstract translation: 主板可以具有沿着其一个或两个表面上的周边区域布置的接触垫。 存储器模块可以具有固定到模块框架的上板和下板的单元封装。 单元包装可以彼此间隔开。 上部和下部单元封装可以具有彼此面对的接触端子。 接触端子可以是弹性弯曲的，和/或单元包装件可以经由弹性构件安装在板上。 母板的周边区域可以被插入到存储器模块中，因此存储器模块的接触端子可以与母板的接触垫弹性地接触并与其电耦合。

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