METHOD, SYSTEM AND APPARATUS FOR FORMING A METAL SULFIDE LAYER

    公开(公告)号:US20250109492A1

    公开(公告)日:2025-04-03

    申请号:US18900427

    申请日:2024-09-27

    Abstract: A method, system and apparatus are disclosed for depositing a threshold voltage shifting layer comprising an oxygen-free metal sulfide on a substrate, wherein the depositing further comprises, providing a substrate having a surface within a reaction chamber, a) providing an oxygen-free precursor comprising a metal to the reaction chamber to contact the surface, b) providing an oxygen-free, sulfur-containing reactant to the reaction chamber to contact the surface, c) purging the reaction chamber and repeating operations a), b) or c) or any combination thereof until the threshold voltage shifting layer of a predetermined thickness is deposited on the surface.

Patent Agency Ranking