公开(公告)号：US20240234073A9

公开(公告)日：2024-07-11

申请号：US18381146

申请日：2023-10-17

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Ashur J. ATANOS ,  Khokan C. PAUL ,  Tao SHENG

IPC: H01J9/50 ,  G01T1/185

CPC classification number: H01J9/50 ,  G01T1/185 ,  G01J2001/4247

Abstract: Embodiments of the present disclosure relates to methods, systems, and apparatus for monitoring radiation output of lamps of processing chambers. In some embodiments, a system contains a plurality of lamps coupled to a chamber, and one or more radiation sensors. Each lamp is identified with one or more zones, the radiation sensors are coupled to the chamber, where each radiation sensor is proximal at least one lamp. A controller contains instructions that, when executed, cause: the radiation sensors to convey, to the controller, information associated with radiation emitted by the lamps; the controller to analyze the information, the analyzing including: for each zone: determining a function of radiation over time; and monitoring the function for a condition associated with lamp aging; and the controller to, based on the analyzing the information, perform at least one of the following: vary input power delivered to the lamps; and generate an alert.

公开(公告)号：US20240038575A1

公开(公告)日：2024-02-01

申请号：US17875302

申请日：2022-07-27

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Ashur J. ATANOS ,  Nimrod SMITH ,  Richard O. COLLINS

IPC: H01L21/687 ,  C30B25/12 ,  C23C16/458

CPC classification number: H01L21/68742 ,  C30B25/12 ,  C23C16/4583

Abstract: Embodiments described herein relate to a susceptor kit. The susceptor kit includes a susceptor support plate including a plurality of susceptor lift pin holes and a plurality of susceptor support holes, a plurality of susceptor supports recessed within the plurality of susceptor support holes and coupled to the susceptor support plate, and a lift pin assembly. The plurality of susceptor supports receive a plurality of susceptor support pins. The support body supports the support pin link in a spaced apart relation to the susceptor support plate. The lift pin assembly is received in the plurality of susceptor lift pin holes. The lift pin assembly includes a lift pin cap and a susceptor lift pin comprising a susceptor stop plate. The susceptor support plate stop is receivable within the susceptor lift pin holes.

公开(公告)号：US20230386803A1

公开(公告)日：2023-11-30

申请号：US17871505

申请日：2022-07-22

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Ala MORADIAN ,  Tao SHENG ,  Nimrod SMITH ,  Ashur J. ATANOS ,  Vinh N. TRAN

IPC: H01J37/32 ,  C23C14/56 ,  C23C16/458 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01J37/32834 ,  C23C14/564 ,  C23C16/4585 ,  H01L21/02057 ,  H01L21/67051 ,  H01J37/32477

Abstract: The present disclosure relates to flow guides, process kits, and related methods for processing chambers to facilitate deposition process adjustability. In one implementation, a flow guide applicable for use in semiconductor manufacturing, includes a plate having a first face and a second face opposing the first face. The flow guide includes a first fin set extending from the second face, and a second fin set extending from the second face. The second fin set is spaced from the first fin set to define a flow path between the first fin set and the second fin set. The flow path has a serpentine pattern between the first fin set and the second fin set.

公开(公告)号：US20230375460A1

公开(公告)日：2023-11-23

申请号：US17751197

申请日：2022-05-23

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Tao SHENG ,  Ashur J. ATANOS

IPC: G01N21/03 ,  G01N21/84 ,  H01L21/67 ,  C30B25/16 ,  C30B25/14

CPC classification number: G01N21/0332 ,  G01N21/8422 ,  H01L21/67253 ,  C30B25/16 ,  C30B25/14 ,  G01N2021/8427 ,  G01N2021/0389

Abstract: A method and apparatus for determining a growth rate on a semiconductor substrate is described herein. The apparatus is an optical sensor, such as an optical growth rate sensor. The optical sensor is positioned in an exhaust of a deposition chamber. The optical sensor is self-heated using one or more internal heating elements, such as a resistive heating element. The internal heating elements are configured to heat a sensor coupon. A film is formed on the sensor coupon by exhaust gases flowed through the exhaust and is correlated to film growth on a substrate within a process volume of the deposition chamber.

公开(公告)号：US20250037975A1

公开(公告)日：2025-01-30

申请号：US18361267

申请日：2023-07-28

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Ashur J. ATANOS ,  Nimrod SMITH ,  Khokan C. PAUL ,  Tao SHENG

IPC: H01J37/32 ,  H01L21/67

Abstract: A flow apparatus and process chamber having the same are described herein. In one example, flow apparatus for use in semiconductor processing comprises an inject assembly and an inductive heater coupled to the inject assembly. The inject assembly comprises an inject body, a first gas inlet configured to flow a first gas through the inject body, and a plurality of flow channels disposed in the inject body, the plurality of flow channels coupled to the first gas inlet. The inductive heater is configured to heat a gas and comprises a heater housing, a graphite rod disposed in the heater housing, the graphite rod having a distal end and proximate end, an inductive coil disposed around the graphite rod, and a second gas inlet configured to flow a second gas between the heater housing and a graphite rod.

公开(公告)号：US20240141487A1

公开(公告)日：2024-05-02

申请号：US17975195

申请日：2022-10-27

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Ashur J. ATANOS ,  Khokan C. PAUL ,  Nimrod SMITH ,  Tao SHENG ,  Vinh TRAN

IPC: C23C16/455 ,  C23C16/458 ,  C30B25/12 ,  C30B25/14

CPC classification number: C23C16/45517 ,  C23C16/4583 ,  C30B25/12 ,  C30B25/14 ,  C23C16/4408

Abstract: Embodiments disclosed herein generally provide improved control of gas flow in processing chambers. In at least one embodiment, a disk and liner assembly includes a quartz disk having an outer diameter, a plurality of holes or slots formed in the quartz disk, and a quartz ring having an inner diameter less than the outer diameter of the quartz disk.

公开(公告)号：US20240035161A1

公开(公告)日：2024-02-01

申请号：US17873842

申请日：2022-07-26

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Ashur J. ATANOS ,  Tao SHENG ,  Nimrod SMITH ,  Vinh N. TRAN

IPC: C23C16/458 ,  C23C16/48 ,  H05B1/02 ,  H05B3/00 ,  H05B3/06

CPC classification number: C23C16/4585 ,  C23C16/482 ,  H05B1/0233 ,  H05B3/0047 ,  H05B3/06

Abstract: An apparatus for heating a gas is described. The apparatus is a pre-heat ring and heater assembly positioned in a deposition chamber, such as an epitaxial deposition chamber. The pre-heat ring has a first portion configured to be heated using one or more heaters. The one or more heaters are disposed through a sidewall of the process volume beneath the pre-heat ring and are configured to heat the pre-heat ring so that gas flowed over the pre-heat ring is also heated before being flowed over a substrate. The one or more heaters may include two heaters disposed at distal ends of the first portion of the pre-heat ring. One or more temperature sensors are also configured to measure a temperature of the pre-heat ring.

公开(公告)号：US20230407478A1

公开(公告)日：2023-12-21

申请号：US17871607

申请日：2022-07-22

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Ala MORADIAN ,  Tao SHENG ,  Nimrod SMITH ,  Ashur J. ATANOS ,  Vinh N. TRAN

IPC: C23C16/458 ,  C23C16/44

CPC classification number: C23C16/458 ,  C23C16/4408 ,  C23C16/4405

Abstract: The present disclosure relates to flow guides, process kits, and related methods for processing chambers to facilitate deposition process adjustability. In one implementation, a process kit for disposition in a processing chamber applicable for use in semiconductor manufacturing includes a plate having a first face and a second face opposing the first face. The process kit includes a liner. The liner includes an annular section, and one or more ledges extending inwardly relative to the annular section. The one or more ledges are configured to support one or more outer regions of the second face of the plate. The liner includes one or more inlet openings extending to an inner surface of the annular section on a first side of the liner, and one or more outlet openings extending to the inner surface of the annular section on a second side of the liner.

公开(公告)号：US20250146173A1

公开(公告)日：2025-05-08

申请号：US19018386

申请日：2025-01-13

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Tao SHENG ,  Errol Antonio C. SANCHEZ ,  Michael R. RICE ,  Nimrod SMITH ,  Ashur J. ATANOS

IPC: C30B25/14 ,  C23C16/44 ,  C23C16/455 ,  C23C16/46 ,  C30B25/10

Abstract: A method and apparatus for processing substrates suitable for use in semiconductor manufacturing. The method includes heating a substrate positioned on a substrate support. The method includes flowing a purge gas over an isolation plate disposed above the substrate, the flowing the purge gas including diverting a portion of the purge gas below the isolation plate through a plurality of perforations in the isolation plate. The method includes flowing one or more process gases over the substrate to deposit a material on the substrate, the flowing of the one or more process gases over the substrate comprising guiding the one or more process gases through one or more flow paths defined at least in part by a space between the isolation plate and the substrate.

公开(公告)号：US20250129509A1

公开(公告)日：2025-04-24

申请号：US18382429

申请日：2023-10-20

Applicant: Applied Materials, Inc.

Inventor： Zhepeng CONG ,  Alain DUBOUST ,  Ala MORADIAN ,  Tao SHENG ,  Nimrod SMITH ,  Ashur J. ATANOS

IPC: C30B25/14 ,  C30B25/10 ,  C30B25/12

Abstract: The present disclosure relates to an auxiliary flow plate for process kits and semiconductor processing chambers, and related methods and flow guides. In one or more embodiments, a chamber kit includes a liner, a first plate, and a second plate. The liner includes an inner face, a first ledge disposed along the inner face, and a second ledge disposed along the inner face. The second ledge is spaced from the first ledge along the inner face. The first plate is sized and shaped to be disposed within the liner on the first ledge. The second plate is sized and shaped to be disposed within the liner on the second ledge.