公开(公告)号：US20190207363A1

公开(公告)日：2019-07-04

申请号：US16297238

申请日：2019-03-08

Applicant: Cisco Technology, Inc.

Inventor： Mudasir Ahmad ,  Weidong Xie ,  Yaoyu Pang ,  Chiyu Liu ,  Qiang Wang

IPC: H01S5/022 ,  H05K1/18 ,  H01S5/024

CPC classification number: H01S5/02256 ,  H01S5/024 ,  H05K1/181 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/10121

Abstract: Systems, devices, methods, and computer-readable media for preventing laser kink failures. A laser diode device can include one or more laser diodes configured to emit electromagnetic radiation coherently. The laser diode device can also include one or more submounts upon which the one or more laser diodes are mounted. The one or more submounts can include one or more through vias including one or more fill materials different from a material of the one or more submounts. Further, one or more properties of the one or more through vias in the one or more submounts can be selected to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.

公开(公告)号：US10230212B1

公开(公告)日：2019-03-12

申请号：US15852475

申请日：2017-12-22

Applicant: Cisco Technology, Inc.

Inventor： Mudasir Ahmad ,  Weidong Xie ,  Yaoyu Pang ,  Chiyu Liu ,  Qiang Wang

IPC: H01S5/022 ,  H05K1/18

Abstract: Systems, devices, methods, and computer-readable media for preventing laser kink failures. A laser diode device can include one or more laser diodes configured to emit electromagnetic radiation coherently. The laser diode device can also include one or more submounts upon which the one or more laser diodes are mounted. The one or more submounts can include one or more through vias including one or more fill materials different from a material of the one or more submounts. Further, one or more properties of the one or more through vias in the one or more submounts can be selected to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.

公开(公告)号：US10186839B1

公开(公告)日：2019-01-22

申请号：US15896968

申请日：2018-02-14

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Chiyu Liu ,  Weidong Xie ,  Qiang Wang ,  Mudasir Ahmad

IPC: H01S5/00 ,  H01S5/12 ,  H01S5/022 ,  H01S5/02 ,  H01S5/323

Abstract: In one embodiment, an apparatus includes a carrier and a semiconductor laser bonded to the carrier, the semiconductor laser comprising a grating extending longitudinally along the semiconductor laser. The grating is pre-distorted to vary a pitch of the grating according to a longitudinal strain profile of the grating to compensate for bonding induced stress such that the grating has a uniform pitch following bonding of the laser to the carrier.