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公开(公告)号：US09980367B2
公开(公告)日：2018-05-22
申请号：US15014111
申请日：2016-02-03
Applicant: Cisco Technology, Inc.
Inventor： Shih Fung Perng , Weidong Xie , Nguyet-Anh Nguyen
CPC classification number: H05K1/0213 , H01L2924/15311 , H01L2924/3511 , H05K3/301 , H05K3/303 , H05K3/3436 , H05K2201/2036 , Y02P70/613
Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.
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公开(公告)号：US09282649B2
公开(公告)日：2016-03-08
申请号：US14048069
申请日：2013-10-08
Applicant: Cisco Technology, Inc.
Inventor： Shih Fung Perng , Weidong Xie , Nguyet-Anh Nguyen
CPC classification number: H05K1/0213 , H01L2924/15311 , H01L2924/3511 , H05K3/301 , H05K3/303 , H05K3/3436 , H05K2201/2036 , Y02P70/613
Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.
Abstract translation: 可以提供一种装置。 该装置可以包括基板和电路板。 球栅阵列结构可以设置在基板和电路板之间。 此外，可以在基板和电路板之间设置间隔结构。 支架结构可以与球栅阵列结构相邻。
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公开(公告)号：US20190207363A1
公开(公告)日：2019-07-04
申请号：US16297238
申请日：2019-03-08
Applicant: Cisco Technology, Inc.
Inventor： Mudasir Ahmad , Weidong Xie , Yaoyu Pang , Chiyu Liu , Qiang Wang
CPC classification number: H01S5/02256 , H01S5/024 , H05K1/181 , H05K2201/068 , H05K2201/09563 , H05K2201/10121
Abstract: Systems, devices, methods, and computer-readable media for preventing laser kink failures. A laser diode device can include one or more laser diodes configured to emit electromagnetic radiation coherently. The laser diode device can also include one or more submounts upon which the one or more laser diodes are mounted. The one or more submounts can include one or more through vias including one or more fill materials different from a material of the one or more submounts. Further, one or more properties of the one or more through vias in the one or more submounts can be selected to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.
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公开(公告)号：US20180228017A1
公开(公告)日：2018-08-09
申请号：US15948762
申请日：2018-04-09
Applicant: Cisco Technology, Inc.
Inventor： Shih Fung Perng , Weidong Xie , Nguyet-Anh Nguyen
CPC classification number: H05K1/0213 , H01L2924/15311 , H01L2924/3511 , H05K3/301 , H05K3/303 , H05K3/3436 , H05K2201/2036 , Y02P70/613
Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.
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公开(公告)号：US20160157335A1
公开(公告)日：2016-06-02
申请号：US15014111
申请日：2016-02-03
Applicant: Cisco Technology, Inc.
Inventor： Shih Fung Perng , Weidong Xie , Nguyet-Anh Nguyen
CPC classification number: H05K1/0213 , H01L2924/15311 , H01L2924/3511 , H05K3/301 , H05K3/303 , H05K3/3436 , H05K2201/2036 , Y02P70/613
Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.
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Patent Agency Ranking
公开(公告)号：US20150059487A1
公开(公告)日：2015-03-05
申请号：US14013103
申请日：2013-08-29
Applicant: Cisco Technology, Inc.
Inventor： Mudasir Ahmad , Weidong Xie , Qiang Wang
IPC: G01B7/16
CPC classification number: G01B7/22 , G01L1/06 , G01L1/142 , H05K1/0268 , H05K3/3442 , H05K2201/10151
Abstract: Strain sensing may be provided. First, a strain threshold for a circuit board may be determined. Then a strain capacitor may be selected that will fail when the circuit board is subjected to the strain threshold while the strain capacitor is mounted on the circuit board. The strain capacitor may be ceramic and may be in a commercially available size. The strain capacitor may then be mounted to the circuit board and monitored for failure.
Abstract translation: 可以提供应变感测。 首先，可以确定电路板的应变阈值。 然后可以选择应变电容器，当应变电容器安装在电路板上时，当电路板经受应变阈值时将失效。 应变电容器可以是陶瓷的，并且可以是市售的尺寸。 然后可以将应变电容器安装到电路板并监测故障。
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公开(公告)号：US10468318B2
公开(公告)日：2019-11-05
申请号：US15881896
申请日：2018-01-29
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Mudasir Ahmad , Weidong Xie , Qiang Wang , Yaoyu Pang
IPC: H01L25/065 , H01L23/16 , H01L23/00 , H01L23/498 , H01L21/56
Abstract: In one embodiment, an apparatus includes a microelectronic package comprising a plurality of semiconductor chips connected to a substrate and a stiffener mounted on the substrate. The stiffener is mounted on the substrate with the semiconductor chips disposed within an opening in the stiffener and the opening defines an asymmetric shape relative to the semiconductor chips to control overall warpage in the microelectronic package by the stiffener.
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公开(公告)号：US20190237371A1
公开(公告)日：2019-08-01
申请号：US15881896
申请日：2018-01-29
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Mudasir Ahmad , Weidong Xie , Qiang Wang , Yaoyu Pang
IPC: H01L23/16 , H01L23/00 , H01L23/498 , H01L25/065
Abstract: In one embodiment, an apparatus includes a microelectronic package comprising a plurality of semiconductor chips connected to a substrate and a stiffener mounted on the substrate. The stiffener is mounted on the substrate with the semiconductor chips disposed within an opening in the stiffener and the opening defines an asymmetric shape relative to the semiconductor chips to control overall warpage in the microelectronic package by the stiffener.
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公开(公告)号：US10230212B1
公开(公告)日：2019-03-12
申请号：US15852475
申请日：2017-12-22
Applicant: Cisco Technology, Inc.
Inventor： Mudasir Ahmad , Weidong Xie , Yaoyu Pang , Chiyu Liu , Qiang Wang
Abstract: Systems, devices, methods, and computer-readable media for preventing laser kink failures. A laser diode device can include one or more laser diodes configured to emit electromagnetic radiation coherently. The laser diode device can also include one or more submounts upon which the one or more laser diodes are mounted. The one or more submounts can include one or more through vias including one or more fill materials different from a material of the one or more submounts. Further, one or more properties of the one or more through vias in the one or more submounts can be selected to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.
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公开(公告)号：US10186839B1
公开(公告)日：2019-01-22
申请号：US15896968
申请日：2018-02-14
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Chiyu Liu , Weidong Xie , Qiang Wang , Mudasir Ahmad
Abstract: In one embodiment, an apparatus includes a carrier and a semiconductor laser bonded to the carrier, the semiconductor laser comprising a grating extending longitudinally along the semiconductor laser. The grating is pre-distorted to vary a pitch of the grating according to a longitudinal strain profile of the grating to compensate for bonding induced stress such that the grating has a uniform pitch following bonding of the laser to the carrier.
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