公开(公告)号：US10468318B2

公开(公告)日：2019-11-05

申请号：US15881896

申请日：2018-01-29

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mudasir Ahmad ,  Weidong Xie ,  Qiang Wang ,  Yaoyu Pang

IPC: H01L25/065 ,  H01L23/16 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56

Abstract: In one embodiment, an apparatus includes a microelectronic package comprising a plurality of semiconductor chips connected to a substrate and a stiffener mounted on the substrate. The stiffener is mounted on the substrate with the semiconductor chips disposed within an opening in the stiffener and the opening defines an asymmetric shape relative to the semiconductor chips to control overall warpage in the microelectronic package by the stiffener.

公开(公告)号：US20190207363A1

公开(公告)日：2019-07-04

申请号：US16297238

申请日：2019-03-08

Applicant: Cisco Technology, Inc.

Inventor： Mudasir Ahmad ,  Weidong Xie ,  Yaoyu Pang ,  Chiyu Liu ,  Qiang Wang

IPC: H01S5/022 ,  H05K1/18 ,  H01S5/024

CPC classification number: H01S5/02256 ,  H01S5/024 ,  H05K1/181 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/10121

Abstract: Systems, devices, methods, and computer-readable media for preventing laser kink failures. A laser diode device can include one or more laser diodes configured to emit electromagnetic radiation coherently. The laser diode device can also include one or more submounts upon which the one or more laser diodes are mounted. The one or more submounts can include one or more through vias including one or more fill materials different from a material of the one or more submounts. Further, one or more properties of the one or more through vias in the one or more submounts can be selected to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.

公开(公告)号：US20190237371A1

公开(公告)日：2019-08-01

申请号：US15881896

申请日：2018-01-29

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mudasir Ahmad ,  Weidong Xie ,  Qiang Wang ,  Yaoyu Pang

IPC: H01L23/16 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

Abstract: In one embodiment, an apparatus includes a microelectronic package comprising a plurality of semiconductor chips connected to a substrate and a stiffener mounted on the substrate. The stiffener is mounted on the substrate with the semiconductor chips disposed within an opening in the stiffener and the opening defines an asymmetric shape relative to the semiconductor chips to control overall warpage in the microelectronic package by the stiffener.

公开(公告)号：US10230212B1

公开(公告)日：2019-03-12

申请号：US15852475

申请日：2017-12-22

Applicant: Cisco Technology, Inc.

Inventor： Mudasir Ahmad ,  Weidong Xie ,  Yaoyu Pang ,  Chiyu Liu ,  Qiang Wang

IPC: H01S5/022 ,  H05K1/18

Abstract: Systems, devices, methods, and computer-readable media for preventing laser kink failures. A laser diode device can include one or more laser diodes configured to emit electromagnetic radiation coherently. The laser diode device can also include one or more submounts upon which the one or more laser diodes are mounted. The one or more submounts can include one or more through vias including one or more fill materials different from a material of the one or more submounts. Further, one or more properties of the one or more through vias in the one or more submounts can be selected to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.