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公开(公告)号：US20240348519A1
公开(公告)日：2024-10-17
申请号：US18351139
申请日：2023-07-12
Applicant: Cisco Technology, Inc.
Inventor： Stanley Wu , Yuefeng Jiang , Qiang Wang , Daemon Yang , Siwei Wu
IPC: H04L43/065 , H04L43/028
CPC classification number: H04L43/065 , H04L43/028
Abstract: Disclosed are systems, apparatuses, methods, and computer-readable media for generating a report in response to detected conditions in a network environment. A method includes: generating one or more triggering policies; determining if the one or more of the triggering policies has been satisfied; starting a netflow process in response to the determination that the one or more of the trigger policies has been satisfied; collecting in real time data for connected devices that satisfy the one or more triggering policies; generating and saving a record associated with the collected data; generating a report based on analysis of the record; displaying a link to the report.
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公开(公告)号：US10468318B2
公开(公告)日：2019-11-05
申请号：US15881896
申请日：2018-01-29
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Mudasir Ahmad , Weidong Xie , Qiang Wang , Yaoyu Pang
IPC: H01L25/065 , H01L23/16 , H01L23/00 , H01L23/498 , H01L21/56
Abstract: In one embodiment, an apparatus includes a microelectronic package comprising a plurality of semiconductor chips connected to a substrate and a stiffener mounted on the substrate. The stiffener is mounted on the substrate with the semiconductor chips disposed within an opening in the stiffener and the opening defines an asymmetric shape relative to the semiconductor chips to control overall warpage in the microelectronic package by the stiffener.
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公开(公告)号：US20150059487A1
公开(公告)日：2015-03-05
申请号：US14013103
申请日：2013-08-29
Applicant: Cisco Technology, Inc.
Inventor： Mudasir Ahmad , Weidong Xie , Qiang Wang
IPC: G01B7/16
CPC classification number: G01B7/22 , G01L1/06 , G01L1/142 , H05K1/0268 , H05K3/3442 , H05K2201/10151
Abstract: Strain sensing may be provided. First, a strain threshold for a circuit board may be determined. Then a strain capacitor may be selected that will fail when the circuit board is subjected to the strain threshold while the strain capacitor is mounted on the circuit board. The strain capacitor may be ceramic and may be in a commercially available size. The strain capacitor may then be mounted to the circuit board and monitored for failure.
Abstract translation: 可以提供应变感测。 首先，可以确定电路板的应变阈值。 然后可以选择应变电容器，当应变电容器安装在电路板上时，当电路板经受应变阈值时将失效。 应变电容器可以是陶瓷的，并且可以是市售的尺寸。 然后可以将应变电容器安装到电路板并监测故障。
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Patent Agency Ranking
公开(公告)号：US20190237371A1
公开(公告)日：2019-08-01
申请号：US15881896
申请日：2018-01-29
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Mudasir Ahmad , Weidong Xie , Qiang Wang , Yaoyu Pang
IPC: H01L23/16 , H01L23/00 , H01L23/498 , H01L25/065
Abstract: In one embodiment, an apparatus includes a microelectronic package comprising a plurality of semiconductor chips connected to a substrate and a stiffener mounted on the substrate. The stiffener is mounted on the substrate with the semiconductor chips disposed within an opening in the stiffener and the opening defines an asymmetric shape relative to the semiconductor chips to control overall warpage in the microelectronic package by the stiffener.
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公开(公告)号：US10230212B1
公开(公告)日：2019-03-12
申请号：US15852475
申请日：2017-12-22
Applicant: Cisco Technology, Inc.
Inventor： Mudasir Ahmad , Weidong Xie , Yaoyu Pang , Chiyu Liu , Qiang Wang
Abstract: Systems, devices, methods, and computer-readable media for preventing laser kink failures. A laser diode device can include one or more laser diodes configured to emit electromagnetic radiation coherently. The laser diode device can also include one or more submounts upon which the one or more laser diodes are mounted. The one or more submounts can include one or more through vias including one or more fill materials different from a material of the one or more submounts. Further, one or more properties of the one or more through vias in the one or more submounts can be selected to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.
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公开(公告)号：US10186839B1
公开(公告)日：2019-01-22
申请号：US15896968
申请日：2018-02-14
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Chiyu Liu , Weidong Xie , Qiang Wang , Mudasir Ahmad
Abstract: In one embodiment, an apparatus includes a carrier and a semiconductor laser bonded to the carrier, the semiconductor laser comprising a grating extending longitudinally along the semiconductor laser. The grating is pre-distorted to vary a pitch of the grating according to a longitudinal strain profile of the grating to compensate for bonding induced stress such that the grating has a uniform pitch following bonding of the laser to the carrier.
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公开(公告)号：US09086267B2
公开(公告)日：2015-07-21
申请号：US14013103
申请日：2013-08-29
Applicant: Cisco Technology, Inc.
Inventor： Mudasir Ahmad , Weidong Xie , Qiang Wang
CPC classification number: G01B7/22 , G01L1/06 , G01L1/142 , H05K1/0268 , H05K3/3442 , H05K2201/10151
Abstract: Strain sensing may be provided. First, a strain threshold for a circuit board may be determined. Then a strain capacitor may be selected that will fail when the circuit board is subjected to the strain threshold while the strain capacitor is mounted on the circuit board. The strain capacitor may be ceramic and may be in a commercially available size. The strain capacitor may then be mounted to the circuit board and monitored for failure.
Abstract translation: 可以提供应变感测。 首先，可以确定电路板的应变阈值。 然后可以选择应变电容器，当应变电容器安装在电路板上时，当电路板经受应变阈值时将失效。 应变电容器可以是陶瓷的，并且可以是市售的尺寸。 然后可以将应变电容器安装到电路板并监测故障。
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公开(公告)号：US20190207363A1
公开(公告)日：2019-07-04
申请号：US16297238
申请日：2019-03-08
Applicant: Cisco Technology, Inc.
Inventor： Mudasir Ahmad , Weidong Xie , Yaoyu Pang , Chiyu Liu , Qiang Wang
CPC classification number: H01S5/02256 , H01S5/024 , H05K1/181 , H05K2201/068 , H05K2201/09563 , H05K2201/10121
Abstract: Systems, devices, methods, and computer-readable media for preventing laser kink failures. A laser diode device can include one or more laser diodes configured to emit electromagnetic radiation coherently. The laser diode device can also include one or more submounts upon which the one or more laser diodes are mounted. The one or more submounts can include one or more through vias including one or more fill materials different from a material of the one or more submounts. Further, one or more properties of the one or more through vias in the one or more submounts can be selected to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.
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