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公开(公告)号：US20190207363A1
公开(公告)日：2019-07-04
申请号：US16297238
申请日：2019-03-08
Applicant: Cisco Technology, Inc.
Inventor： Mudasir Ahmad , Weidong Xie , Yaoyu Pang , Chiyu Liu , Qiang Wang
CPC classification number: H01S5/02256 , H01S5/024 , H05K1/181 , H05K2201/068 , H05K2201/09563 , H05K2201/10121
Abstract: Systems, devices, methods, and computer-readable media for preventing laser kink failures. A laser diode device can include one or more laser diodes configured to emit electromagnetic radiation coherently. The laser diode device can also include one or more submounts upon which the one or more laser diodes are mounted. The one or more submounts can include one or more through vias including one or more fill materials different from a material of the one or more submounts. Further, one or more properties of the one or more through vias in the one or more submounts can be selected to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.
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公开(公告)号：US20170234584A1
公开(公告)日：2017-08-17
申请号：US15584544
申请日：2017-05-02
Applicant: Cisco Technology, Inc.
Inventor： Jovica Savic , Mudasir Ahmad , Thomas Brenner
CPC classification number: F25B21/02 , B65D43/0202 , B65D51/24 , B65D81/18 , H01L35/30 , H01L2224/48227 , H01L2224/48247
Abstract: A hermetically sealed package effectively dissipates heat generated inside the package. The hermetically sealed package includes a hermetically sealed enclosure formed from a base portion and a lid. Within the enclosure two or more heat generating elements, such as integrated circuit chips, are supported by the base portion and rise to different heights from the base portion. At least one resilient heat exchange component, such as a leaf spring, extends from the lid of the hermetically sealed enclosure to the different heights. The heat exchange component is configured to conduct heat from the plurality of heat generating elements to the lid of the enclosure.
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公开(公告)号：US09688453B2
公开(公告)日：2017-06-27
申请号：US14617078
申请日：2015-02-09
Applicant: Cisco Technology, Inc.
Inventor： Jovica Savic , Mudasir Ahmad , Thomas Brenner
CPC classification number: F25B21/02 , B65D43/0202 , B65D51/24 , B65D81/18 , H01L35/30 , H01L2224/48227 , H01L2224/48247
Abstract: A hermetically sealed package effectively dissipates heat generated inside the package. The hermetically sealed package includes a hermetically sealed enclosure formed from a base portion and a lid. Within the enclosure two or more heat generating elements, such as integrated circuit chips, are supported by the base portion and rise to different heights from the base portion. At least one resilient heat exchange component, such as a leaf spring, extends from the lid of the hermetically sealed enclosure to the different heights. The heat exchange component is configured to conduct heat from the plurality of heat generating elements to the lid of the enclosure.
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4.发明申请METHOD AND APPARATUS FOR SUPPORTING A COMPUTER CHIP ON A PRINTED CIRCUIT BOARD ASSEMBLY 审中-公开在印刷电路板组件上支持计算机芯片的方法和装置公开(公告)号：US20150173177A1
公开(公告)日：2015-06-18
申请号：US14629181
申请日：2015-02-23
Applicant: Cisco Technology, Inc.
Inventor： Mohan R. Nagar , Kuo-Chuan Liu , Mudasir Ahmad , Bangalore J. Shanker , Jie Xue
CPC classification number: H05K1/0271 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H05K1/181 , H05K3/305 , H05K2201/068 , H05K2201/09036 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , Y10T29/49144 , H01L2924/00 , H01L2224/0401
Abstract: A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.
Abstract translation: 一种印刷电路板组件和组装方法，其中将底部填充物放置在芯片和基板之间以支撑芯片。 沟槽形成在印刷电路板的上层中以限制底部填充物的流动，特别是限制底部填充物与相邻部件接触，使得底部填充物不会干扰印刷电路板组件上的相邻部件。
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公开(公告)号：US10468318B2
公开(公告)日：2019-11-05
申请号：US15881896
申请日：2018-01-29
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Mudasir Ahmad , Weidong Xie , Qiang Wang , Yaoyu Pang
IPC: H01L25/065 , H01L23/16 , H01L23/00 , H01L23/498 , H01L21/56
Abstract: In one embodiment, an apparatus includes a microelectronic package comprising a plurality of semiconductor chips connected to a substrate and a stiffener mounted on the substrate. The stiffener is mounted on the substrate with the semiconductor chips disposed within an opening in the stiffener and the opening defines an asymmetric shape relative to the semiconductor chips to control overall warpage in the microelectronic package by the stiffener.
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Patent Agency Ranking
公开(公告)号：US20190237371A1
公开(公告)日：2019-08-01
申请号：US15881896
申请日：2018-01-29
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Mudasir Ahmad , Weidong Xie , Qiang Wang , Yaoyu Pang
IPC: H01L23/16 , H01L23/00 , H01L23/498 , H01L25/065
Abstract: In one embodiment, an apparatus includes a microelectronic package comprising a plurality of semiconductor chips connected to a substrate and a stiffener mounted on the substrate. The stiffener is mounted on the substrate with the semiconductor chips disposed within an opening in the stiffener and the opening defines an asymmetric shape relative to the semiconductor chips to control overall warpage in the microelectronic package by the stiffener.
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公开(公告)号：US10230212B1
公开(公告)日：2019-03-12
申请号：US15852475
申请日：2017-12-22
Applicant: Cisco Technology, Inc.
Inventor： Mudasir Ahmad , Weidong Xie , Yaoyu Pang , Chiyu Liu , Qiang Wang
Abstract: Systems, devices, methods, and computer-readable media for preventing laser kink failures. A laser diode device can include one or more laser diodes configured to emit electromagnetic radiation coherently. The laser diode device can also include one or more submounts upon which the one or more laser diodes are mounted. The one or more submounts can include one or more through vias including one or more fill materials different from a material of the one or more submounts. Further, one or more properties of the one or more through vias in the one or more submounts can be selected to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.
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公开(公告)号：US10186839B1
公开(公告)日：2019-01-22
申请号：US15896968
申请日：2018-02-14
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Chiyu Liu , Weidong Xie , Qiang Wang , Mudasir Ahmad
Abstract: In one embodiment, an apparatus includes a carrier and a semiconductor laser bonded to the carrier, the semiconductor laser comprising a grating extending longitudinally along the semiconductor laser. The grating is pre-distorted to vary a pitch of the grating according to a longitudinal strain profile of the grating to compensate for bonding induced stress such that the grating has a uniform pitch following bonding of the laser to the carrier.
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公开(公告)号：US20160229618A1
公开(公告)日：2016-08-11
申请号：US14617078
申请日：2015-02-09
Applicant: Cisco Technology, Inc.
Inventor： Jovica Savic , Mudasir Ahmad , Thomas Brenner
CPC classification number: F25B21/02 , B65D43/0202 , B65D51/24 , B65D81/18 , H01L35/30 , H01L2224/48227 , H01L2224/48247
Abstract: A hermetically sealed package effectively dissipates heat generated inside the package. The hermetically sealed package includes a hermetically sealed enclosure formed from a base portion and a lid. Within the enclosure two or more heat generating elements, such as integrated circuit chips, are supported by the base portion and rise to different heights from the base portion. At least one resilient heat exchange component, such as a leaf spring, extends from the lid of the hermetically sealed enclosure to the different heights. The heat exchange component is configured to conduct heat from the plurality of heat generating elements to the lid of the enclosure.
Abstract translation: 密封的包装有效地散发了包装内产生的热量。 密封的包装包括由基部和盖形成的气密密封的外壳。 在外壳内，两个或多个发热元件（例如集成电路芯片）由基座支撑并且从底座部分升高到不同的高度。 至少一个弹性热交换部件（例如板簧）从密封的密封件的盖子延伸到不同的高度。 热交换部件构造成将热量从多个发热元件传导到外壳的盖子。
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公开(公告)号：US09086267B2
公开(公告)日：2015-07-21
申请号：US14013103
申请日：2013-08-29
Applicant: Cisco Technology, Inc.
Inventor： Mudasir Ahmad , Weidong Xie , Qiang Wang
CPC classification number: G01B7/22 , G01L1/06 , G01L1/142 , H05K1/0268 , H05K3/3442 , H05K2201/10151
Abstract: Strain sensing may be provided. First, a strain threshold for a circuit board may be determined. Then a strain capacitor may be selected that will fail when the circuit board is subjected to the strain threshold while the strain capacitor is mounted on the circuit board. The strain capacitor may be ceramic and may be in a commercially available size. The strain capacitor may then be mounted to the circuit board and monitored for failure.
Abstract translation: 可以提供应变感测。 首先，可以确定电路板的应变阈值。 然后可以选择应变电容器，当应变电容器安装在电路板上时，当电路板经受应变阈值时将失效。 应变电容器可以是陶瓷的，并且可以是市售的尺寸。 然后可以将应变电容器安装到电路板并监测故障。
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