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    Ultraminiature Broadband Light Source and Method of Manufacturing Same
    2.
    发明申请
    Ultraminiature Broadband Light Source and Method of Manufacturing Same 有权
    超微型宽带光源及其制造方法相同

    公开(公告)号：US20110006663A1

    公开(公告)日：2011-01-13

    申请号：US12795356

    申请日：2010-06-07

    Applicant: Margaret L. Tuma ,  Joseph S. Collura ,  Henry Helvajian ,  Michael D. Pocha ,  Glenn A. Meyer ,  Charles F. McConaghy ,  Barry L. Olsen ,  William W. Hansen

    Inventor： Margaret L. Tuma ,  Joseph S. Collura ,  Henry Helvajian ,  Michael D. Pocha ,  Glenn A. Meyer ,  Charles F. McConaghy ,  Barry L. Olsen ,  William W. Hansen

    IPC: H01K1/14

    CPC classification number: H01K1/14 ,  G01J3/10 ,  H01K1/18 ,  H01K7/00

    Abstract: An ultraminiature light source using a double-spiral shaped tungsten filament includes end contact portions which are separated to allow for radial and length-wise unwinding of the spiral. The double-spiral filament is spaced relatively far apart at the end portions thereof so that contact between portions of the filament upon expansion is avoided. The light source is made by fabricating a double-spiral ultraminiature tungsten filament from tungsten foil and housing the filament in a ceramic package having a reflective bottom and a well wherein the filament is suspended. A vacuum furnace brazing process attaches the filament to contacts of the ceramic package. Finally, a cover with a transparent window is attached onto the top of the ceramic package by solder reflow in a second vacuum furnace process to form a complete hermetically sealed package.

    Abstract translation: 使用双螺旋形钨丝的超微型光源包括端部接触部分，其被分离以允许螺旋的径向和纵向展开。 双螺旋丝在其端部处间隔相对较远，从而避免了在膨胀时细丝部分之间的接触。 光源通过从钨箔制造双螺旋超薄钨丝制成，并将灯丝容纳在具有反射底部和阱的陶瓷封装中，其中灯丝被悬挂。 真空炉钎焊工艺将灯丝连接到陶瓷封装的触点。 最后，通过在第二真空炉工艺中通过回流焊接将具有透明窗口的盖子附接到陶瓷封装的顶部，以形成完整的密封封装。

    Ultraviolet method of embedding structures in photocerams
    3.
    发明授权
    Ultraviolet method of embedding structures in photocerams 有权
    紫外线包埋结构在光油中的应用

    公开(公告)号：US06932933B2

    公开(公告)日：2005-08-23

    申请号：US09821918

    申请日：2001-03-30

    Applicant: Henry Helvajian ,  Peter D. Fuqua ,  William W. Hansen

    Inventor： Henry Helvajian ,  Peter D. Fuqua ,  William W. Hansen

    IPC: B44C1/22 ,  B81C1/00 ,  C03C23/00 ,  C03C15/00

    CPC classification number: B81C1/00492 ,  B44C1/227 ,  B44C1/228 ,  B81C2201/0133 ,  B81C2201/0143 ,  C03C23/0025

    Abstract: A laser direct write method creates true three dimensional structures within photocerams using an focused pulsed ultraviolet laser with a wavelength in a weakly absorbing region of the photoceram material. A critical dose of focused laser UV light selectively exposes embedded volumes of the material for subsequent selective etching. The photoceram material exposure is nonlinear with the laser fluence and the critical dose depends on the square of the per shot fluence and the number of pulses. The laser light is focused to a focal depth for selective volumetric exposure of the material within a focal volume within the remaining collateral volumes that is critically dosed for selecting etching and batch fabrication of highly defined embedded structures.

    Abstract translation: 激光直接写入方法使用在光致抗蚀剂材料的弱吸收区域中具有波长的聚焦脉冲紫外激光器在光泽内产生真正的三维结构。 聚焦激光UV光的关键剂量选择性地暴露了材料的嵌入体积，用于随后的选择性蚀刻。 光泽材料暴露是非线性的，具有激光注量，临界剂量取决于每个射流注量的平方和脉冲数。 激光被聚焦到焦点深度，用于在残留的临时体积内的焦点体积内材料的选择性体积暴露，其被批量选择用于选择高度限定的嵌入结构的蚀刻和批量制造。

    Acoustic devices embedded in photostructurable ceramics
    5.
    发明授权
    Acoustic devices embedded in photostructurable ceramics 有权
    嵌入光可陶瓷陶瓷的声学器件

    公开(公告)号：US08410660B2

    公开(公告)日：2013-04-02

    申请号：US12686989

    申请日：2010-01-13

    Applicant: Henry Helvajian ,  William W. Hansen ,  Lee F. Steffeney

    Inventor： Henry Helvajian ,  William W. Hansen ,  Lee F. Steffeney

    IPC: H01L41/08

    CPC classification number: B29C67/0048 ,  B01J19/00 ,  B01L3/502707 ,  B41J2/00 ,  B81B2203/0338 ,  B81C1/00 ,  B81C1/00634 ,  C03C23/00 ,  G03F7/00 ,  Y10T29/42

    Abstract: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

    Abstract translation: 使用用于将器件嵌入可光可陶瓷陶瓷体积内的光学结构化工艺步骤来处理可光电陶瓷，该器件可以包括化学，机械，电子，电磁，光学和声学设备中的一种或多种，​​所有这些都部分地通过在 陶瓷或通过陶瓷体的表面端口设置器件材料，使用内部连接和表面接口互连这些器件。

    Ultraminiature broadband light source with spiral shaped filament
    7.
    发明授权
    Ultraminiature broadband light source with spiral shaped filament 有权
    超微型宽带光源带螺旋形灯丝

    公开(公告)号：US08264134B2

    公开(公告)日：2012-09-11

    申请号：US12795356

    申请日：2010-06-07

    Applicant: Margaret L. Tuma ,  Joseph S. Collura ,  Henry Helvajian ,  Michael D. Pocha ,  Glenn A. Meyer ,  Charles F. McConaghy ,  Barry L. Olsen ,  William W Hansen

    Inventor： Margaret L. Tuma ,  Joseph S. Collura ,  Henry Helvajian ,  Michael D. Pocha ,  Glenn A. Meyer ,  Charles F. McConaghy ,  Barry L. Olsen ,  William W Hansen

    IPC: H01J17/04 ,  H01J61/04

    CPC classification number: H01K1/14 ,  G01J3/10 ,  H01K1/18 ,  H01K7/00

    Abstract: An ultraminiature light source using a double-spiral shaped tungsten filament includes end contact portions which are separated to allow for radial and length-wise unwinding of the spiral. The double-spiral filament is spaced relatively far apart at the end portions thereof so that contact between portions of the filament upon expansion is avoided. The light source is made by fabricating a double-spiral ultraminiature tungsten filament from tungsten foil and housing the filament in a ceramic package having a reflective bottom and a well wherein the filament is suspended. A vacuum furnace brazing process attaches the filament to contacts of the ceramic package. Finally, a cover with a transparent window is attached onto the top of the ceramic package by solder reflow in a second vacuum furnace process to form a complete hermetically sealed package.

    Abstract translation: 使用双螺旋形钨丝的超微型光源包括端部接触部分，其被分离以允许螺旋的径向和纵向展开。 双螺旋丝在其端部处间隔相对较远，从而避免了在膨胀时细丝部分之间的接触。 光源通过从钨箔制造双螺旋超薄钨丝制成，并将灯丝容纳在具有反射底部和阱的陶瓷封装中，其中灯丝被悬挂。 真空炉钎焊工艺将灯丝连接到陶瓷封装的触点。 最后，通过在第二真空炉工艺中通过回流焊接将具有透明窗口的盖子附接到陶瓷封装的顶部，以形成完整的密封封装。

    Photostructured Mechanical Devices and Methods for Making Same
    10.
    发明申请
    Photostructured Mechanical Devices and Methods for Making Same 审中-公开
    光电结构机械设备及其制作方法

    公开(公告)号：US20110167941A1

    公开(公告)日：2011-07-14

    申请号：US12686976

    申请日：2010-01-13

    Applicant: Henry Helvajian

    Inventor： Henry Helvajian

    IPC: F16M11/00 ,  B23P11/00

    CPC classification number: B81C1/00634 ,  B81B2201/051 ,  B81B2203/0338

    Abstract: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

    Abstract translation: 使用用于将器件嵌入可光可陶瓷陶瓷体积内的光学结构化工艺步骤来处理可光电陶瓷，该器件可以包括化学，机械，电子，电磁，光学和声学设备中的一种或多种，​​所有这些都部分地通过在 陶瓷或通过陶瓷体的表面端口设置器件材料，使用内部连接和表面接口互连这些器件。

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