公开(公告)号：US06460247B1

公开(公告)日：2002-10-08

申请号：US09467678

申请日：1999-12-21

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: H01K322

CPC classification number: H05K3/005 ,  H05K1/095 ,  H05K1/112 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/061 ,  H05K3/107 ,  H05K3/1241 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/465 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/025 ,  H05K2203/041 ,  H05K2203/0746 ,  H05K2203/095 ,  H05K2203/1189 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped in the top surface thereof. A conductor material is disposed within the recess, and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion helps to complete an electrically conductor path through the substrate to help complete an electrically conductive path through the substrate.

Abstract translation: 布线板结构包括设置在基底基板中的至少一个微孔，并且包括形成在其顶表面中的深刻印刷杯。 导体材料设置在凹部内，并且具有设置在其底部的部分。 设置在与导体材料底部相对的基板的底表面处的导体有助于完成穿过基板的导电路径，以帮助完成穿过基板的导电路径。

公开(公告)号：US5334279A

公开(公告)日：1994-08-02

申请号：US113392

申请日：1993-08-27

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: B29C33/38 ,  B29C33/42 ,  B29C33/56 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38 ,  B44C1/22 ,  C23F1/00

CPC classification number: H05K1/111 ,  B29C33/3878 ,  B29C33/42 ,  B29C33/56 ,  H05K3/0014 ,  H05K3/205 ,  B29L2031/3425 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/0315 ,  H05K3/025 ,  H05K3/061 ,  H05K3/107 ,  H05K3/384 ,  H05K3/385 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24479 ,  Y10T428/24537 ,  Y10T428/2457 ,  Y10T428/24917

Abstract: A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of groove forming projections disposed in the substrate surface. The method of making the metallized mold includes forming a female parent or predecessor master tool that may be used to produce a large number of the metallized male molds for producing new and improved three-dimensional printed circuit boards. The new and improved three-dimensional printed circuit board includes a substrate composed of a high heat deflective plastic, and a plurality of recesses or grooves molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit. A plurality of metallized sunken pads or lands are adhered or bonded within the grooves for establishing an electrical path within each groove.

Abstract translation: 一种新的改进的印刷电路板工具及其制造和使用方法，用于生产具有在其中具有强粘合或层压金属垫的凹槽的三维印刷电路板。 印刷电路板工具包括具有设置在基板表面中的多个凹槽形成突起的金属化阳模基板。 制造金属化模具的方法包括形成可用于生产大量用于生产新的和改进的三维印刷电路板的金属化阳模的母本或前驱主工具。 新型改进的三维印刷电路板包括由高热偏转塑料构成的基板和模制到基板表面中的多个凹槽或凹槽，用于在其中接收集成电路的细间距，紧密间隔的引线。 多个金属化的凹陷垫或焊盘粘合或粘合在凹槽内，以在每个凹槽内建立电路径。

公开(公告)号：USRE38579E1

公开(公告)日：2004-09-14

申请号：US10032285

申请日：2001-12-20

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: H01R909

CPC classification number: H05K3/005 ,  H05K1/095 ,  H05K1/112 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/061 ,  H05K3/107 ,  H05K3/1241 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/465 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/025 ,  H05K2203/041 ,  H05K2203/0746 ,  H05K2203/095 ,  H05K2203/1189 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped recess in the top surface thereof. A conductor material is disposed within the recess, and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion helps to complete an electrically conductor path through the substrate to help complete an electrically conductive path through the substrate.

公开(公告)号：US5351393A

公开(公告)日：1994-10-04

申请号：US913880

申请日：1992-07-15

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: H01L23/495 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/3426 ,  H01L23/49555 ,  H05K1/141 ,  H01L2924/0002 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10303 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/49135 ,  Y10T29/4914

Abstract: A surface-mount integrated circuit converter board assembly having a pin grid array arranged enables a conventional surface-mount lead device to be mounted for subsequent attachment to a printed circuit board. The converter board assembly includes an array of spaced apart pins, arranged in rows and columns for mounting, and a plurality of spaced apart pin pads connected thereto. The pin pads are sufficiently spaced apart to avoid interference. A set of surface-mount lead pads is part of the converter board and is interconnected to the array of pins by a plurality of lead traces. The method of making the converter board with a surface-mount integrated circuit device includes forming or reforming the leads of the device to align with the surface-mount pads.

Abstract translation: 具有布置的引脚格栅阵列的表面贴装集成电路转换器板组件能够安装常规的表面安装引线装置以便随后附接到印刷电路板。 转换器板组件包括排列成行和列的用于安装的间隔开的销的阵列，以及与之连接的多个间隔开的销垫。 引脚垫足够间隔开以避免干扰。 一组表面安装引线焊盘是转换器板的一部分，并通过多个引线与引脚阵列互连。 制造具有表面贴装集成电路器件的转换器板的方法包括将器件的引线形成或重整以与表面安装焊盘对准。

公开(公告)号：US6005198A

公开(公告)日：1999-12-21

申请号：US946297

申请日：1997-10-07

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: H01R12/55 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40 ,  H05K3/46 ,  H01R9/09

CPC classification number: H05K3/005 ,  H05K1/115 ,  H05K3/107 ,  H05K3/4652 ,  H05K1/095 ,  H05K1/112 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/025 ,  H05K2203/041 ,  H05K2203/0746 ,  H05K2203/095 ,  H05K2203/1189 ,  H05K2203/1572 ,  H05K3/0014 ,  H05K3/061 ,  H05K3/1241 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/465 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped recess in the top surface thereof. A conductor material is disposed within the recess, and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion helps to complete an electrically conductor path through the substrate to help complete an electrically conductive path through the substrate.

Abstract translation: 布线板结构包括设置在基底基板中的至少一个微孔，并且在其顶表面中包括深刻刻的杯形凹部。 导体材料设置在凹部内，并且具有设置在其底部的部分。 设置在与导体材料底部相对的基板的底表面处的导体有助于完成穿过基板的导电路径，以帮助完成穿过基板的导电路径。

公开(公告)号：US5451722A

公开(公告)日：1995-09-19

申请号：US317326

申请日：1994-10-04

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: B29C33/38 ,  B29C33/42 ,  B29C33/56 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38 ,  H05K1/02

CPC classification number: H05K1/111 ,  B29C33/3878 ,  B29C33/42 ,  B29C33/56 ,  H05K3/0014 ,  H05K3/205 ,  B29L2031/3425 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/0315 ,  H05K3/025 ,  H05K3/061 ,  H05K3/107 ,  H05K3/384 ,  H05K3/385 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24479 ,  Y10T428/24537 ,  Y10T428/2457 ,  Y10T428/24917

Abstract: A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of groove forming projections disposed in the substrate surface. The method of making the metallized mold includes forming a female parent or predecessor master tool that may be used to produce a large number of the metallized male molds for producing new and improved three-dimensional printed circuit boards. The new and improved three-dimensional printed circuit board includes a substrate composed of a high heat deflective plastic, and a plurality of recesses or grooves molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit. A plurality of metallized sunken pads or lands are adhered or bonded within the grooves for establishing an electrical path within each groove.

Abstract translation: 一种新的改进的印刷电路板工具及其制造和使用方法，用于生产具有在其中具有强粘合或层压金属垫的凹槽的三维印刷电路板。 印刷电路板工具包括具有设置在基板表面中的多个凹槽形成突起的金属化阳模基板。 制造金属化模具的方法包括形成可用于生产大量用于生产新的和改进的三维印刷电路板的金属化阳模的母本或前驱主工具。 新型改进的三维印刷电路板包括由高热偏转塑料构成的基板和模制到基板表面中的多个凹槽或凹槽，用于在其中接收集成电路的细间距，紧密间隔的引线。 多个金属化的凹陷垫或焊盘粘合或粘合在凹槽内，以在每个凹槽内建立电路径。

公开(公告)号：US5390412A

公开(公告)日：1995-02-21

申请号：US45366

申请日：1993-04-08

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: B29C33/38 ,  B29C33/42 ,  B29C33/56 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38 ,  H01K3/22 ,  H01K3/10

CPC classification number: H05K1/111 ,  B29C33/3878 ,  B29C33/42 ,  B29C33/56 ,  H05K3/0014 ,  H05K3/205 ,  B29L2031/3425 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/0315 ,  H05K3/025 ,  H05K3/061 ,  H05K3/107 ,  H05K3/384 ,  H05K3/385 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24479 ,  Y10T428/24537 ,  Y10T428/2457 ,  Y10T428/24917

Abstract: A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of groove forming projections disposed in the substrate surface. The method of making the metallized mold includes forming a female parent or predecessor master tool that may be used to produce a large number of the metallized male molds for producing new and improved three-dimensional printed circuit boards. The new and improved three-dimensional printed circuit board includes a substrate composed of a high heat deflective plastic, and a plurality of recesses or grooves molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit. A plurality of metallized sunken pads or lands are adhered or bonded within the grooves for establishing an electrical path within each groove.

Abstract translation: 一种新的改进的印刷电路板工具及其制造和使用方法，用于生产具有在其中具有强粘合或层压金属垫的凹槽的三维印刷电路板。 印刷电路板工具包括具有设置在基板表面中的多个凹槽形成突起的金属化阳模基板。 制造金属化模具的方法包括形成可用于生产大量用于生产新的和改进的三维印刷电路板的金属化阳模的母本或前驱主工具。 新型改进的三维印刷电路板包括由高热偏转塑料构成的基板和模制到基板表面中的多个凹槽或凹槽，用于在其中接收集成电路的细间距，紧密间隔的引线。 多个金属化的凹陷垫或焊盘粘合或粘合在凹槽内，以在每个凹槽内建立电路径。