Abstract:
A method for forming a bottom spin valve sensor having a synthetic antiferromagnetic pinned (SyAP) layer, antiferromagnetically coupled to a pinning layer, in which one of the layers of the SyAP is formed as a three layer lamination that contains a specularly reflecting oxide layer of FeTaO. The sensor formed according to this method has an extremely high GMR ratio and exhibits good pinning strength.
Abstract:
A method of forming a DSMR head comprises the steps of forming a first ferromagnetic (FM) strip on a substrate with a first anti-FM (AFM) pinning layer over a portion of the first ferromagnetic strip, the first AFM pinning layer being composed of a first material. Then perform a first high temperature annealing step. Form a non-magnetic layer over the strip and the pinning layer. Then form a second FM strip on the non-magnetic layer, and form a second AFM pinning layer over a portion of the second FM strip, with a second AFM pinning layer being composed identically of the first material. Perform a second high temperature annealing step on the first and second FM strips and the first and second pinning layers and the intermediate non-magnetic layer in the presence of a second magnetic field antiparallel to the first magnetic field. A head with NiFe FM strips and FeMn or MnPt, etc, AFM layers for both strips is provided.
Abstract:
A method for forming an NiCr seed layer based bottom spin valve sensor element having a synthetic antiferromagnet pinned (SyAP) layer and a capping layer comprising either a single specularly reflecting nano-oxide layer (NOL) or a bi-layer comprising a non-metallic layer and a specularly reflecting nano-oxide layer and the sensor element so formed. The method of producing these sensor elements provides elements having higher GMR ratios and lower resistances than elements of the prior art.
Abstract:
Within a method for forming a magnetoresistive (MR) sensor element there is first provided a substrate. There is then formed over the substrate a first magnetoresistive (MR) layer having formed contacting the first magnetoresistive (MR) layer a magnetically biased first magnetic bias layer biased in a first magnetic bias direction with a first magnetic bias field strength. There is also formed separated from the first magnetoresistive (MR) layer by a spacer layer a second magnetoresistive (MR) layer having formed contacting the second magnetoresistive (MR) layer a magnetically un-biased second magnetic bias layer. There is then biased through use of a first thermal annealing method employing a first thermal annealing temperature, a first thermal annealing exposure time and a first extrinsic magnetic bias field the magnetically un-biased second magnetic bias layer to form a magnetically biased second magnetic bias layer having a second magnetic bias field strength in a second magnetic bias direction non-parallel to the first magnetic bias direction while simultaneously partially demagnetizing the magnetically biased first magnetic bias layer to provide a partially demagnetized magnetically biased first magnetic bias layer having a partially demagnetized first magnetic bias field strength less than the first magnetic bias field strength. Finally, there is then annealed thermally through use of a second thermal annealing employing a second thermal annealing temperature and a second thermal annealing exposure time without a second magnetic bias field: (1) the partially demagnetized magnetically biased first magnetic bias layer layer to form a remagnetized partially demagnetized first magnetic bias layer having a remagnetized partially demagnetized first netic bias field strength greater than the partially demagnetized first magnetic bias field strength; and (2) the magnetically biased second magnetic bias layer to form a further magnetically biased second magnetic bias layer having a further magnetized second magnetic bias field strength greater than the second magnetic bias field strength.