公开(公告)号：US20220293391A1

公开(公告)日：2022-09-15

申请号：US17637728

申请日：2019-08-23

Applicant: Hitachi High-Tech Corporation

Inventor： Hitoshi KAMOSHIDA ,  Hisayuki TAKASU ,  Atsushi KAMINO ,  Shota AIDA ,  Megumi NAKAMURA

IPC: H01J37/305 ,  H01J37/20 ,  H01J37/304 ,  H01J37/08

Abstract: The invention provides an ion milling device capable of cross-sectional milling on an all-solid-state battery while reducing an occurrence of a short circuit due to a redeposition film. The ion milling device includes a sample stage 5 on which a sample 8 is placed, an ion source 1 configured to emit an unfocused ion beam 4 toward the sample, a stage controller 6 configured to cause the sample stage to perform a swing operation centered on a swing axis S0 set to be orthogonal to an ion beam center B0 of the ion beam, and cause the sample stage to perform a sliding operation along a line of intersection between a plane (YZ plane) including the ion beam center and perpendicularly intersecting the swing axis and a sample placement surface of the sample stage, in which the stage controller causes, in a first mode operation, the sample stage to perform the swing operation and the ion source to emit the ion beam to mill the sample, and causes in a second mode operation, the sample stage to perform the sliding operation and the ion source to emit the ion beam to remove sputter particles adhered again to the sample in the first mode operation.

公开(公告)号：US20250149289A1

公开(公告)日：2025-05-08

申请号：US19012150

申请日：2025-01-07

Applicant: Hitachi High-Tech Corporation

Inventor： Shota AIDA ,  Hisayuki TAKASU ,  Atsushi KAMINO ,  Hitoshi KAMOSHIDA

IPC: H01J37/305 ,  H01J37/20

Abstract: Provided is an ion milling apparatus capable of enhancing reproducibility of an ion distribution. The ion milling apparatus includes: an ion source 101; a sample stage 102 on which a sample to be processed by being irradiated with an unfocused ion beam from the ion source 101 is placed; and a measurement member holding unit 106 that holds an ion beam current measurement member 105. A covering material 120 is provided so as to cover at least a surface of the measurement member holding unit 106 and the sample stage 102 facing the ion source 101. A material of the covering material 120 contains, as a main component, an element having an atomic number smaller than that of an element of a material of a structure on which the covering material is provided. The ion beam current measurement member 105 is moved in an irradiation range of the ion beam on a trajectory, which is located between the ion source and the sample stage, in a state where the ion beam is output from the ion source 101 under a first irradiation condition, and an ion beam current flowing when the ion beam current measurement member 105 is irradiated with the ion beam is measured.

公开(公告)号：US20250149288A1

公开(公告)日：2025-05-08

申请号：US18835838

申请日：2022-03-01

Applicant: Hitachi High-Tech Corporation

Inventor： Naohiro FUJITA ,  Hisayuki TAKASU ,  Atsushi KAMINO ,  Hitoshi KAMOSHIDA

IPC: H01J37/244 ,  G01N23/2251 ,  H01J37/20 ,  H01J37/305

Abstract: An ion milling device includes: a first monitoring mechanism that measures an amount of sputtered particles generated by irradiating a sample with an ion beam; and a second monitoring mechanism that images a processed surface of the sample formed by irradiating the sample with the ion beam, in which processing on the sample ends when a sputtering amount of the sample estimated through measurement by the first monitoring mechanism and a shape of the processed surface image extracted from a picture captured by the second monitoring mechanism satisfy processing end conditions set for the sputtering amount and the shape of the processed surface.

公开(公告)号：US20220367148A1

公开(公告)日：2022-11-17

申请号：US17788610

申请日：2019-12-24

Applicant: Hitachi High-Tech Corporation

Inventor： Shota AIDA ,  Hisayuki TAKASU ,  Atsushi KAMINO ,  Hitoshi KAMOSHIDA

IPC: H01J37/305 ,  H01J37/20

Abstract: Provided is an ion milling apparatus capable of enhancing reproducibility of an ion distribution. The ion milling apparatus includes: an ion source 101; a sample stage 102 on which a sample to be processed by being irradiated with an unfocused ion beam from the ion source 101 is placed; and a measurement member holding unit 106 that holds an ion beam current measurement member 105. A covering material 120 is provided so as to cover at least a surface of the measurement member holding unit 106 and the sample stage 102 facing the ion source 101. A material of the covering material 120 contains, as a main component, an element having an atomic number smaller than that of an element of a material of a structure on which the covering material is provided. The ion beam current measurement member 105 is moved in an irradiation range of the ion beam on a trajectory, which is located between the ion source and the sample stage, in a state where the ion beam is output from the ion source 101 under a first irradiation condition, and an ion beam current flowing when the ion beam current measurement member 105 is irradiated with the ion beam is measured.

公开(公告)号：US20210183615A1

公开(公告)日：2021-06-17

申请号：US17270893

申请日：2018-08-31

Applicant: Hitachi High-Tech Corporation

Inventor： Hitoshi KAMOSHIDA ,  Hisayuki TAKASU ,  Atsushi KAMINO

IPC: H01J37/304 ,  H01J37/08

Abstract: Provided is an ion milling device capable of improving the reproducibility of an ion distribution. An ion milling device includes: an ion source (1); a sample stage (2) on which a sample (4) to be processed by being irradiated with an unfocused ion beam from the ion source (1) is placed; and a drive unit (8) configured to be arranged between the ion source (1) and the sample stage (2), and to move a linear ion beam measuring member (7) extending in a first direction to a second direction orthogonal to the first direction, in which the drive unit (8) moves the ion beam measuring member (7) within an emission range of the ion beam in a state where the ion beam is outputted from the ion source (1) under a first emission condition, and an ion beam current flowing through the ion beam measuring member (7) is measured by irradiating the ion beam measuring member (7) with the ion beam.

公开(公告)号：US20240120174A1

公开(公告)日：2024-04-11

申请号：US18273325

申请日：2021-01-22

Applicant: Hitachi High-Tech Corporation

Inventor： Shota AIDA ,  Hisayuki TAKASU ,  Atsushi KAMINO ,  Hitoshi KAMOSHIDA

IPC: H01J37/305 ,  H01J37/08 ,  H01J37/24

CPC classification number: H01J37/3056 ,  H01J37/08 ,  H01J37/243

Abstract: In order to improve the processing reproducibility, an ion milling device 100 includes a sample chamber 107, a sample stage 102 that is disposed in the sample chamber on which a sample is placed, an ion source 101 that emits an unfocused ion beam toward the sample, a control unit 112 that controls an output of the ion beam, an oscillator 104 that is disposed in the sample chamber, and an oscillation circuit 111 that oscillates the oscillator and outputs an oscillation signal to the control unit, in which the control unit controls the output of the ion beam such that a vibrational frequency change amount of the oscillator per unit time due to deposition of sputtered particles generated by irradiating the sample with the ion beam on the oscillator is kept within a predetermined range.

公开(公告)号：US20230048299A1

公开(公告)日：2023-02-16

申请号：US17788556

申请日：2019-12-24

Applicant: Hitachi High-Tech Corporation

Inventor： Shota AIDA ,  Hisayuki TAKASU ,  Atsushi KAMINO ,  Hitoshi KAMOSHIDA

IPC: H01J37/244 ,  H01J37/08 ,  H01J37/305

Abstract: There is provided an ion milling apparatus that can enhance reproducibility of ion distribution.
The ion milling apparatus includes an ion source 101, a sample stage 102 on which a sample processed by radiating a non-convergent ion beam from the ion source 101 is placed, a drive unit 107 that moves a measurement member holding section 106 holding an ion beam current measurement member 105 along a track located between the ion source and the sample stage, and an electrode 112 that is disposed near the track, in which a predetermined positive voltage is applied to the electrode 112, the ion beam current measurement member 105 is moved within a radiation range of the ion beam by the drive unit 107, in a state in which the ion beam is output from the ion source 101 under a first radiation condition, and an ion beam current that flows when the ion beam is radiated to the ion beam current measurement member 105 is measured.

公开(公告)号：US20210066020A1

公开(公告)日：2021-03-04

申请号：US16961759

申请日：2018-02-28

Applicant: Hitachi High-Tech Corporation

Inventor： Hitoshi KAMOSHIDA ,  Hisayuki TAKASU ,  Atsushi KAMINO ,  Toru IWAYA

IPC: H01J37/08 ,  H01J37/305 ,  H01J37/20 ,  H01J37/244 ,  H01J37/147

Abstract: By irradiating a sample with an unfocused ion beam, processing accuracy of an ion milling device for processing a sample or reproducibility accuracy of a shape of a processed surface is improved. Therefore, the ion milling device includes a sample chamber, an ion source position adjustment mechanism provided at the sample chamber, an ion source attached to the sample chamber via the ion source position adjustment mechanism and configured to emit an ion beam, and a sample stage configured to rotate around a rotation center. When a direction in which the rotation center extends when an ion beam center of the ion beam matches the rotation center is set as a Z direction, and a plane perpendicular to the Z direction is set as an XY plane, the ion source position adjustment mechanism is capable of adjusting a position of the ion source on the XY plane and a position of the ion source in the Z direction.