公开(公告)号：US09578745B2

公开(公告)日：2017-02-21

申请号：US14504842

申请日：2014-10-02

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro Yoshikawa ,  Takashi Kariya

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/02 ,  H05K3/04 ,  H05K3/18 ,  H01L25/00 ,  H05K3/40 ,  H05K1/02 ,  H05K1/14 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K3/46

CPC classification number: H05K1/113 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/144 ,  H05K1/183 ,  H05K3/244 ,  H05K3/282 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/0392 ,  H05K2203/0577 ,  H05K2203/0723 ,  H05K2203/1383 ,  Y10T29/49156

Abstract: A method for manufacturing a printed wiring board includes forming a removable layer over first pads in central portion of an interlayer insulation layer to mount IC chip, forming on the interlayer and removable layers a resin insulation layer having openings exposing second pads in peripheral portion of the interlayer layer to connect second substrate, forming a seed layer on the resin layer, in the openings and on the second pads, forming on the seed layer a plating resist having resist openings exposing the openings of the resin layer with diameters greater than the openings, filling the resist openings with electrolytic plating such that metal posts are formed in the resist openings, removing the resist, removing the seed layer exposed on the resin layer, and removing the removable layer and the resin layer on the removable layer such that cavity exposing the first pads is formed in the resin layer.

Abstract translation: 一种制造印刷电路板的方法，包括在层间绝缘层的中心部分的第一焊盘上形成可移除层以安装IC芯片，在中间层和可去除层上形成具有露出第二焊盘的开口的树脂绝缘层， 层间层，用于连接第二基板，在树脂层上，在开口和第二焊盘上形成种子层，在种子层上形成具有抗蚀剂开口的电镀抗蚀剂，该抗蚀剂开口露出具有大于开口的直径的树脂层的开口， 通过电解电镀填充抗蚀剂开口，使得在抗蚀剂开口中形成金属柱，去除抗蚀剂，除去暴露在树脂层上的种子层，以及去除可去除层上的可去除层和树脂层， 在树脂层中形成第一焊盘。

公开(公告)号：US09572256B2

公开(公告)日：2017-02-14

申请号：US14633864

申请日：2015-02-27

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro Yoshikawa ,  Takashi Kariya

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/11 ,  H01L23/00 ,  H05K3/28 ,  H05K3/40 ,  H05K1/14 ,  H05K3/46 ,  H05K3/34

CPC classification number: H05K1/111 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/09 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K1/144 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/042 ,  H05K2201/068 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/10977 ,  H05K2201/2072 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/0405 ,  H05K2203/0594 ,  H05K2203/0597 ,  H05K2203/1184 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A printed wiring board includes an uppermost insulating layer, first pads positioned to mount an IC chip on the insulating layer, second pads positioned to mount a second printed wiring board on the insulating layer, metal posts formed on the second pads, respectively, such that the metal posts mount the second board over the chip, and a solder resist layer formed on the uppermost insulating layer and having first and second openings such that the first openings exposes the first pads and that the second openings exposes the second pads, respectively. The metal posts are formed such that each of the metal posts has a diameter which is smaller than a diameter of each of the second opening portions, and the second opening portions are formed such that the diameter of each of the second opening portions is smaller than a diameter of each of the second pads.

Abstract translation: 印刷布线板包括最上层的绝缘层，位于绝缘层上的IC芯片安装的第一焊盘，位于绝缘层上的第二印刷电路板安装的第二焊盘，分别形成在第二焊盘上的金属柱，使得 金属柱将第二板安装在芯片上，以及形成在最上层绝缘层上并具有第一和第二开口的阻焊层，使得第一开口暴露第一焊盘，并且第二开口分别暴露第二焊盘。 金属柱形成为使得每个金属柱的直径小于每个第二开口部的直径，并且第二开口部形成为使得每个第二开口部的直径小于 每个第二垫的直径。

公开(公告)号：US09307645B2

公开(公告)日：2016-04-05

申请号：US13938637

申请日：2013-07-10

Applicant: IBIDEN Co., Ltd.

Inventor： Yasuhiko Mano ,  Kazuhiro Yoshikawa ,  Takashi Kariya

IPC: H05K1/16 ,  H05K3/30 ,  H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/165 ,  H01L2924/3511 ,  H05K1/0233 ,  H05K1/186 ,  H05K3/0032 ,  H05K3/30 ,  H05K3/4676 ,  H05K3/4697 ,  H05K2201/0209 ,  Y10T29/4913

Abstract: A printed wiring board includes a core substrate, a first buildup layer formed on a first surface of the core substrate and including an insulation layer and a conductive layer, a second buildup layer formed on a second surface of the core substrate on the opposite side with respect to the first buildup layer and including an insulation layer and a conductive layer, and an inductor device positioned in the second buildup layer and including a resin insulation layer and a coil layer formed on the resin insulation layer. The second buildup layer has a cavity in which the inductor device is accommodated.

Abstract translation: 印刷电路板包括芯基板，形成在芯基板的第一表面上并包括绝缘层和导电层的第一累积层，在相对侧的芯基板的第二表面上形成的第二累积层， 相对于第一累积层，并且包括绝缘层和导电层，以及位于第二堆积层中的电感器件，并且包括树脂绝缘层和形成在树脂绝缘层上的线圈层。 第二累积层具有容纳电感器装置的空腔。

公开(公告)号：US09287034B2

公开(公告)日：2016-03-15

申请号：US13729106

申请日：2012-12-28

Applicant: IBIDEN CO., LTD.

Inventor： Yasuhiko Mano ,  Kazuhiro Yoshikawa ,  Takashi Kariya

IPC: H05K1/18 ,  H01F27/28 ,  H01F17/00 ,  H05K1/16 ,  H05K3/46

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F2017/002 ,  H01F2017/0066 ,  H05K1/162 ,  H05K1/165 ,  H05K1/18 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2203/0191 ,  H05K2203/1469

Abstract: A printed wiring board has a core base having an opening portion, an inductor component accommodated in the opening portion, and a filler resin filling gap between the component and a side wall of the opening portion. The component has a support layer, a first conductive pattern on the support, an interlayer insulation layer on the support and first pattern, a second conductive pattern on the insulation layer, and a via conductor in the insulation layer and connecting the first and second patterns, the insulation layer includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer includes magnetic material and resin material and has a first hole, the insulation layer has a second hole penetrating through the resin layer such that the second hole passes through the first hole and extends to the first pattern, and the via conductor is formed in the second hole.

Abstract translation: 印刷电路板具有：具有开口部的芯基部，容纳在开口部的电感器部，以及所述部件与所述开口部的侧壁之间的填充树脂填充间隙。 所述部件具有支撑层，支撑体上的第一导电图案，支撑件上的层间绝缘层和第一图案，绝缘层上的第二导电图案，以及绝缘层中的通孔导体，并连接第一和第二图案 所述绝缘层包括磁性层和覆盖所述磁性层的树脂层，所述磁性层包括磁性材料和树脂材料，并且具有第一孔，所述绝缘层具有穿过所述树脂层的第二孔，使得所述第二孔通过 通过第一孔延伸到第一图案，并且通孔导体形成在第二孔中。

公开(公告)号：US20150098204A1

公开(公告)日：2015-04-09

申请号：US14509354

申请日：2014-10-08

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro YOSHIKAWA ,  Takashi Kariya

IPC: H05K1/14 ,  H05K1/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/46 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/144 ,  H01L21/4853 ,  H01L23/00 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16237 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K3/4007 ,  H05K2203/054 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A method for manufacturing a printed wiring board includes forming a resin layer on an interlayer layer such that the resin layer has first openings exposing circuits in central portion and second openings exposing circuits in peripheral portion of the interlayer layer, forming solder bumps on the circuits in the first openings, forming a plating resist over the bumps and resin layer such that the resist has openings having diameters greater than the second openings and exposing the second openings, forming a seed layer on the resist, in the openings and on the circuits through the second openings, applying electrolytic plating on the resist such that electrolytic plating fills the openings and forms a plated film on the resist and metal posts in the openings, etching the plating such that the plated film is removed and recesses are formed on end surfaces of the posts, and removing the resist.

Abstract translation: 一种制造印刷电路板的方法包括在层间层上形成树脂层，使得树脂层具有在中心部分露出电路的第一开口和在层间层的周边部分露出电路的第二开口，在电路中形成焊料凸块 所述第一开口在所述凸起和树脂层上形成电镀抗蚀剂，使得所述抗蚀剂具有直径大于所述第二开口的开口并露出所述第二开口，在所述开口中和所述电路上通过所述开口和所述电路在所述电路上形成种子层 第二开口，在抗蚀剂上施加电解电镀，使得电解电镀填充开口并在开口中的抗蚀剂和金属柱上形成镀膜，蚀刻电镀，使得镀膜被去除，并且凹陷形成在 帖子，并删除抗蚀剂。

公开(公告)号：US09497849B2

公开(公告)日：2016-11-15

申请号：US13754185

申请日：2013-01-30

Applicant: IBIDEN CO., LTD.

Inventor： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Furusawa

IPC: H05K1/02 ,  H05K3/46 ,  H01L21/48 ,  H01L23/498

CPC classification number: H05K1/02 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K3/4644 ,  H05K2201/029 ,  H05K2201/09136 ,  H01L2924/00

Abstract: A printed wiring board includes a core substrate, first and second buildup structures on surfaces of the core, respectively, and first and second solder-resist layers on the first and second structures, respectively. The core includes insulative substrate, conductive layers on surfaces of the substrate and through-hole conductor connecting the conductive layers, the first structure includes interlayer insulation layer and conductive layer in the first structure, the second structure includes interlayer insulation layer and conductive layer in the second structure, a thickness between the outer surfaces of the first and second solder-resist layers is set in range of from 150 μm or greater and less than 380 μm, and at least one of the core, first and second structures, and first and second solder-resist layers includes reinforcing material in amount such that the board includes the material in amount in range of from 20 to 35 vol. %.

Abstract translation: 印刷电路板分别包括芯基板，在芯的表面上的第一和第二累积结构以及分别在第一和第二结构上的第一和第二阻焊层。 芯包括绝缘衬底，衬底表面上的导电层和连接导电层的通孔导体，第一结构包括第一结构中的层间绝缘层和导电层，第二结构包括层间绝缘层和导电层 第二结构，第一和第二阻焊层的外表面之间的厚度设定在150μm以上且小于380μm的范围内，以及芯，第一和第二结构中的至少一个，第一和第二结构 第二阻焊层包括增强材料，其量使得该板包括量为20至35体积的材料。 ％。

公开(公告)号：US09119322B2

公开(公告)日：2015-08-25

申请号：US14510219

申请日：2014-10-09

Applicant: IBIDEN CO., LTD.

Inventor： Yukinobu Mikado ,  Shunsuke Sakai ,  Takashi Kariya ,  Toshiki Furutani

IPC: H05K1/18 ,  H05K3/30 ,  H01G2/06 ,  H05K1/11 ,  H05K3/32 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/185 ,  H01G2/06 ,  H05K1/0207 ,  H05K1/115 ,  H05K3/30 ,  H05K3/32 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49146

Abstract: A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component.

Abstract translation: 布线板包括具有开口部分的基板，位于基板的开口部分中的电子部件，并且包括第一和第二电子部件，以及形成在基板和第一和第二部件上的绝缘层。 第一部件具有在第一部件的侧面具有侧部的第一电极和第二电极，第二部件具有第一部件和第二电极，第一部件的第一电极和第二电极具有在第二部件的侧面上的侧面部分，第一部件的第一电极和第一部件的第一电极 第二部件被设定为具有大致相同的电位，并且第一部件和第二部件位于基板的开口部分中，使得第一部件的第一电极的侧部位于第二部件的侧部 第二部件的第一电极。

公开(公告)号：US09066435B2

公开(公告)日：2015-06-23

申请号：US13853227

申请日：2013-03-29

Applicant: IBIDEN CO., LTD.

Inventor： Makoto Terui ,  Daiki Komatsu ,  Masatoshi Kunieda ,  Takashi Kariya

IPC: H05K7/10 ,  H05K1/11 ,  H05K3/10 ,  H01L23/498 ,  H01L21/56 ,  H01L23/538 ,  H05K3/46 ,  H01L23/00

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5382 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/03 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2924/12042 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/115 ,  H05K3/10 ,  H05K3/103 ,  H05K3/20 ,  H05K3/32 ,  H05K3/4602 ,  H05K3/4658 ,  H05K3/4694 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/1053 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2924/014

Abstract: A wiring board includes a first insulation layer, a second insulation layer formed on the first insulation layer, a wiring structure interposed between the first insulation layer and the second insulation layer and including an insulation layer and conductive patterns formed on the insulation layer, second conductive patterns formed on the second insulation layer, and a via conductor formed through the second insulation layer and connected to one of the second conductive patterns on the second insulation layer.

Abstract translation: 布线板包括第一绝缘层，形成在第一绝缘层上的第二绝缘层，插入在第一绝缘层和第二绝缘层之间的布线结构，并且包括绝缘层和形成在绝缘层上的导电图案，第二导电 形成在第二绝缘层上的图案，以及通过第二绝缘层形成并连接到第二绝缘层上的第二导电图案之一的通路导体。

公开(公告)号：US20150114690A1

公开(公告)日：2015-04-30

申请号：US14522768

申请日：2014-10-24

Applicant: IBIDEN Co., Ltd.

Inventor： Teruyuki ISHIHARA ,  Michimasa Takahashi ,  Takashi Kariya

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/10 ,  H05K1/11

CPC classification number: H05K3/4691 ,  H05K2201/0187 ,  H05K2203/308

Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer on first surface sides of the flexible and non-flexible substrates, a second wiring layer on second surface sides of the flexible and non-flexible substrates, a first insulating layer covering the first sides of the flexible and non-flexible substrates and having an opening exposing a portion of the first side of the flexible substrate, and a second insulating layer covering the second sides of the flexible and non-flexible substrates and having an opening exposing a portion of the second side of the flexible substrate. The first wiring layer includes first conductor pattern on the first side of the flexible substrate, and the second wiring layer includes second conductor pattern extending across the second sides of the flexible and non-flexible substrates.

Abstract translation: 柔性刚性布线板包括柔性基板，非柔性基板，其定位成使得非柔性基板在柔性基板的水平方向上延伸;柔性基板和非柔性基板的第一表面侧上的第一布线层 ，在所述柔性和非柔性基板的第二表面侧上的第二布线层，覆盖所述柔性和非柔性基板的第一侧的第一绝缘层，并且具有暴露柔性基板的第一侧的一部分的开口， 以及覆盖所述柔性和非柔性基板的第二侧面的第二绝缘层，并且具有暴露所述柔性基板的第二侧的一部分的开口。 所述第一布线层包括在所述柔性基板的第一侧上的第一导体图案，并且所述第二布线层包括延伸穿过所述柔性和非柔性基板的第二侧的第二导体图案。

公开(公告)号：US09893016B2

公开(公告)日：2018-02-13

申请号：US14880299

申请日：2015-10-12

Applicant: IBIDEN CO., LTD.

Inventor： Hajime Sakamoto ,  Yoshinori Shizuno ,  Shigeru Yamada ,  Takashi Kariya

IPC: H01L23/538 ,  H05K3/00 ,  H05K3/46 ,  H01L21/48 ,  H05K3/02

CPC classification number: H01L23/5383 ,  H01L21/486 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2924/15192 ,  H01L2924/15313 ,  H05K3/007 ,  H05K3/025 ,  H05K3/4644 ,  H05K3/4658 ,  H05K3/4694 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/1053

Abstract: A multilayer wiring board includes a main wiring board including insulation layers, first via conductors formed in the insulation layers, and a first conductive layer including first mounting pads such that the first mounting pads are positioned to mount a first electronic component and a second electronic component adjacent to each other on the main wiring board, and a wiring structure body mounted on the main wiring board such that the wiring structure body is positioned in an outermost insulation layer of the insulation layers, the wiring structure body including a second conductive layer which includes second mounting pads such that the second mounting pads are positioned to connect to the first electronic component and the second electronic component mounted on the main wiring board. The first via conductors are formed such that the first via conductors have diameters which increase in a same direction.