公开(公告)号：US11760627B2

公开(公告)日：2023-09-19

申请号：US17343919

申请日：2021-06-10

Applicant: InvenSense, Inc.

Inventor： Roberto Brioschi ,  Benyamin Gholami Bazehhour ,  Milena Vujosevic ,  Kazunori Hayata

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81C1/00325 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/042 ,  B81B2207/012

Abstract: A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.

公开(公告)号：US20230089623A1

公开(公告)日：2023-03-23

申请号：US17737582

申请日：2022-05-05

Applicant: INVENSENSE, INC.

Inventor： Efren Lacap ,  Milena Vujosevic

IPC: H01L23/498 ,  H01L23/36

Abstract: Improving motion sensor robustness utilizing a room-temperature-volcanizing (RTV) material via a solder resist dam is presented herein. A sensor package comprises: a first semiconductor die; a second semiconductor die that is attached to the first semiconductor die to form a monolithic die; and a substrate comprising a top portion and a bottom portion, in which the top portion comprises a plurality of solder resist dams, the monolithic die is attached to the top portion of the substrate via the RTV material being disposed in a defined area of the top portion of the substrate, and the bottom portion of the substrate comprises electrical terminals that facilitate attachment and electrical coupling of signals of the sensor package to a printed circuit board.

公开(公告)号：US20220396472A1

公开(公告)日：2022-12-15

申请号：US17343919

申请日：2021-06-10

Applicant: InvenSense, Inc.

Inventor： Roberto Brioschi ,  Benyamin Gholami Bazehhour ,  Milena Vujosevic ,  Kazunori Hayata

IPC: B81B7/00 ,  B81C1/00

Abstract: A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.