公开(公告)号：US20090147472A1

公开(公告)日：2009-06-11

申请号：US12260315

申请日：2008-10-29

Applicant: Glen Mantych ,  Jay Stanke ,  Tom Hensley

Inventor： Glen Mantych ,  Jay Stanke ,  Tom Hensley

IPC: H05K7/20

CPC classification number: H05K7/1404 ,  H05K7/20563

Abstract: A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. The convection bridge is clamped between the VME electronics module and the modified chassis, requiring no modifications to the VME electronics module. For enhanced performance, additional features may include having any individual or combination of fin orientation on the convection bridge, interstitial material such as grease or indium foil can be inserted between the convection bridge and the VME electronics module, and compatible air-moving appliances such as a fan as part of the modified VME chassis.

Abstract translation: 提供了一种在空气冷却系统中使用传导冷却的VME电子模块的方法。 这种装置包括改进的对流冷却VME兼容底盘，其包括与VME电子模块热接口的对流桥，就像导电底盘一样。 对流桥被夹在VME电子模块和改型机架之间，不需要对VME电子模块进行任何修改。 为了增强性能，附加特征可以包括在对流桥上具有翅片取向的任何单独或组合，诸如油脂或铟箔之类的间隙材料可以插入在对流桥和VME电子模块之间，以及兼容的气动装置，例如 作为修改的VME机箱的一部分的风扇。

公开(公告)号：US20060000638A1

公开(公告)日：2006-01-05

申请号：US11136120

申请日：2005-05-24

Applicant: Aaron Levine ,  Jay Stanke

Inventor： Aaron Levine ,  Jay Stanke

IPC: H05K1/11

CPC classification number: H01L21/485 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/225 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/09645 ,  H01L2924/00

Abstract: A miniature PWB with features that incorporate the required circuitry changes and component footprints, which has been enhanced with micro-castellations such as those found on ceramic surface mount packages. The miniature PWB is mounted on the circuit board using techniques well known in the art. This combination of technologies provides an adaptable, durable interconnect methodology, which allows for circuit and part changes without changing the layout of the base printed wiring board.

公开(公告)号：US20120282787A1

公开(公告)日：2012-11-08

申请号：US13460599

申请日：2012-04-30

Applicant: Jay Stanke

Inventor： Jay Stanke

IPC: H01R12/71

CPC classification number: H05K3/3421 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/147 ,  H05K3/32 ,  H05K2201/049 ,  H05K2201/0979 ,  H05K2201/1031 ,  H05K2201/10477 ,  H05K2201/10575 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A printed board assembly includes a printed board, an electrical component, a first interconnect that electrically connects the component to the printed board, and a second interconnect that electrically connects the first interconnect to the printed board. In some examples, the second interconnect extends between the first interconnect and the same electrical contact on the printed board to which the first interconnect is electrically connected. The first and second interconnects provide an at least partially redundant electrical pathway between the component and the printed board.

Abstract translation: 印刷电路板组件包括印刷电路板，电气部件，将组件电连接到印刷电路板的第一互连以及将第一互连电连接到印刷电路板的第二互连。 在一些示例中，第二互连在第一互连和第一互连电连接到的印刷电路板上的相同电触点之间延伸。 第一和第二互连件在部件和印刷电路板之间提供至少部分冗余的电路径。