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公开(公告)号:US20180286777A1
公开(公告)日:2018-10-04
申请号:US15761977
申请日:2016-10-21
Applicant: KYOCERA Corporation
Inventor: Kouichi KAWASAKI
IPC: H01L23/36 , H01L23/498 , H01L23/12
CPC classification number: H01L23/36 , H01L23/12 , H01L23/49811 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
Abstract: The wiring board includes an insulating substrate having a main surface, an external electrode on the main surface and an outer edge portion of the insulating substrate, and a dissipating metal layer on the main surface of the insulating substrate, the dissipating metal layer having a greater area than the external electrode if viewed in a plan, the dissipating metal layer being adjacent to the external electrode and having a slit. The slit has an opening at an outer periphery of the dissipating metal layer. The external electrode faces the opening.
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公开(公告)号:US20180247898A1
公开(公告)日:2018-08-30
申请号:US15559092
申请日:2016-03-23
Applicant: KYOCERA Corporation
Inventor: Kensaku MURAKAMI , Kouichi KAWASAKI , Yousuke MORIYAMA
IPC: H01L23/00 , H01L23/498 , H01L33/62 , H01L25/16
CPC classification number: H01L23/562 , H01L23/13 , H01L23/3121 , H01L23/49822 , H01L23/49838 , H01L24/16 , H01L25/167 , H01L33/62 , H01L2224/16225 , H01L2224/16227 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/3511 , H01L2924/00012
Abstract: A wiring board includes an insulating substrate, mount electrodes arranged to face each other on a first main surface of the insulating substrate along a pair of opposing sides of the insulating substrate in a plan view, and terminal electrodes arranged to face each other on a second main surface of the insulating substrate along another pair of opposing sides of the insulating substrate in a perspective plan view.
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公开(公告)号:US20150373846A1
公开(公告)日:2015-12-24
申请号:US14764795
申请日:2014-07-30
Applicant: KYOCERA CORPORATION
Inventor: Kouichi KAWASAKI
CPC classification number: H05K1/111 , H01L23/13 , H01L23/24 , H01L23/49838 , H01L24/32 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2224/83385 , H01L2924/181 , H05K1/0209 , H05K1/181 , H05K3/243 , H05K3/244 , H05K3/3431 , H05K3/4629 , H05K2201/09154 , H05K2201/09163 , H05K2201/09381 , H05K2201/094 , H05K2201/09418 , H05K2201/09663 , H05K2201/097 , H05K2201/098 , H05K2201/10068 , H05K2201/10075 , H05K2201/10106 , H05K2201/10151 , H05K2201/2054 , H05K2203/1178 , Y02P70/611 , Y02P70/613 , H01L2924/00014 , H01L2924/00012
Abstract: A wiring board has an insulation base plate, and a plurality of electrodes provided adjacent to each other in plan view on the insulation base plate, the electrodes have an opening in the outer periphery and a slit oriented from the outer periphery to the interior, and, among two electrodes adjacent to each other, the slit in one electrode has a central line intersecting the outer periphery of the other electrode.
Abstract translation: 布线板具有绝缘基板和在绝缘基板上的平面图中彼此相邻设置的多个电极,电极在外周具有开口,并且具有从外周到内部的狭缝,以及 在彼此相邻的两个电极中,一个电极中的狭缝具有与另一个电极的外周相交的中心线。
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公开(公告)号:US20180040773A1
公开(公告)日:2018-02-08
申请号:US15551961
申请日:2016-02-23
Applicant: KYOCERA Corporation
Inventor: Kenjirou FUKUDA , Kensaku MURAKAMI , Kouichi KAWASAKI
CPC classification number: H01L33/46 , H01L33/486 , H01L33/54 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H01L2933/0058 , H01L2924/00014 , H01L2924/00012
Abstract: A light-emitter mounting package includes an insulating base, a wiring conductor, and a metal layer. The insulating base has a main surface including a recess in which a light emitter is mountable. The wiring conductor is arranged on a peripheral portion of a bottom surface of the recess that is adjacent to an inner wall of the recess. The insulating base has a side surface including a sloping surface adjacent to the main surface. The metal layer is spaced from the wiring conductor, and extends on the inner wall of the recess, the main surface, and the sloping surface.
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