公开(公告)号：US06410860B2

公开(公告)日：2002-06-25

申请号：US08897428

申请日：1997-07-21

Applicant: Koetsu Tamura

Inventor： Koetsu Tamura

IPC: H05K116

CPC classification number: H05K3/363 ,  H01L2224/32225 ,  H05K3/3478 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10666 ,  H05K2201/10681

Abstract: An electronic circuit package assembly of the present invention and implemented by a TAB (Tape Automated Bonding) system includes a sheet formed of thermosetting resin. The sheet intervenes between a substrate and an organic insulating film carrying an LSI (Large Scale Integrated circuit) chip thereon. Solder is buried in the sheet beforehand. The assembly is heated to cause the solder to melt and connect wiring electrodes formed on the substrate and outer leads provided on the organic insulating film. The assembly has high reliability when compared with other connection methods using solder and effectively prevents migration of the tape carrier.

Abstract translation: 本发明的电子电路封装组件由TAB（Tape Automated Bonding）系统实现，包括由热固性树脂形成的片材。 片材介于衬底和承载LSI（大规模集成电路）芯片的有机绝缘膜之间。 事先将焊料埋在片材中。 加热组件使焊料熔化并连接形成在基板上的布线电极和设置在有机绝缘膜上的外引线。 与使用焊料的其他连接方法相比，该组件具有高可靠性，并且有效地防止了带状载体的迁移。

公开(公告)号：US06472724B1

公开(公告)日：2002-10-29

申请号：US09551172

申请日：2000-04-17

Applicant: Hajime Matsuzawa ,  Koetsu Tamura

Inventor： Hajime Matsuzawa ,  Koetsu Tamura

IPC: H01L23552

CPC classification number: H05K1/0218 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: In an electronic device structure, a high dam is formed on a circuit board so as to enclose input/output terminals of an electronic component mounted on the circuit board. The input/output terminals are projected from a body of the electronic component and connected to a printed circuit formed on the circuit board. The body is covered with a metal case.

Abstract translation: 在电子装置结构中，在电路板上形成高阻挡层，以便包围安装在电路板上的电子部件的输入/输出端子。 输入/输出端子从电子部件的主体突出并连接到形成在电路板上的印刷电路。 身体被金属外壳覆盖。

公开(公告)号：US06208022B1

公开(公告)日：2001-03-27

申请号：US09048215

申请日：1998-03-26

Applicant: Koetsu Tamura

Inventor： Koetsu Tamura

IPC: H01L2348

CPC classification number: H01L24/50 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H05K3/0058 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3447 ,  H05K3/361 ,  H05K3/363 ,  H05K3/4015 ,  H05K2201/09827 ,  H05K2201/10242 ,  H05K2201/10318 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2201/10977 ,  H01L2924/00

Abstract: An electronic-circuit assembly according to the present invention comprises a first substrate on the upper surface of which a plurality of electrodes are provided. A second substrate is placed on the first substrate. The second substrate comprises a plurality of through-holes on the positions opposing to the plurality of terminals on the first substrate, respectively. The plurality of terminals on the first substrate are connected to the plurality of through-holes on the second substrate via a plurality of connecting members, respectively. A plate is placed on the upper surface of the second substrate. A plurality of pins which are provided on the under surface of the plate are inserted into the plurality of through-holes on the second substrate, respectively.

Abstract translation: 根据本发明的电子电路组件包括在其上表面上设置有多个电极的第一基板。 将第二基板放置在第一基板上。 第二基板在与第一基板上的多个端子相对的位置上分别包括多个通孔。 第一基板上的多个端子分别经由多个连接构件连接到第二基板上的多个通孔。 板被放置在第二基板的上表面上。 设置在板的下表面上的多个销分别插入第二基板上的多个通孔中。

公开(公告)号：US06310780B1

公开(公告)日：2001-10-30

申请号：US09187087

申请日：1998-11-05

Applicant: Koetsu Tamura ,  Hajime Matsuzawa

Inventor： Koetsu Tamura ,  Hajime Matsuzawa

IPC: H05K332

CPC classification number: H05K1/183 ,  H05K1/0284 ,  H05K1/117 ,  H05K3/1225 ,  H05K3/3405 ,  H05K3/3484 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2201/10734

Abstract: A plurality of indentations 21, 22, and 23 are formed in one major surface of a printed board 1. A plurality of electrode pads 41, 42, 43, and 44 are provided on the one major surface and the bottom of the indentations. A plurality of solder portions 91, 92, 93, and 94 are formed on the respective electrode pads. A plurality of electronic components 5, 6, 7, and 8 each having a plurality of terminals are connected to the electrode pads in the corresponding indentations by means of the solder portions.

Abstract translation: 在印刷电路板1的一个主表面上形成有多个凹口21,22和23。多个电极焊盘41,42,43和44设置在压痕的一个主表面和底部上。 在各个电极焊盘上形成多个焊料部分91,92,93和94。 每个具有多个端子的多个电子部件5,6,7和8通过焊料部分连接到相应凹口中的电极焊盘。

公开(公告)号：US5976910A

公开(公告)日：1999-11-02

申请号：US89131

申请日：1998-06-02

Applicant: Koetsu Tamura ,  Shinichi Hasegawa

Inventor： Koetsu Tamura ,  Shinichi Hasegawa

IPC: H01L21/56 ,  H01L23/495 ,  H01L23/498 ,  H01L21/44 ,  H01L21/30 ,  H01L21/46 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L21/563 ,  H01L23/49572 ,  H01L23/49816 ,  H01L2224/73203 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011

Abstract: An electronic device assembly includes a large-scale integrated circuit (LSI) chip mounted on a flexible substrate. The flexible substrate is connected to a second substrate via solder. The flexible substrate is also attached to the second substrate via a resin. When the assembly is manufactured, the solder is provided between the substrates. The resin fills an area between the substrates. The solder and the resin are heated simultaneously. The solder melts to electrically connect the substrates. The resin is set to mechanically couple the substrates.

Abstract translation: 电子设备组件包括安装在柔性基板上的大规模集成电路（LSI）芯片。 柔性基板通过焊料与第二基板连接。 柔性基板也通过树脂附接到第二基板。 当制造组件时，在衬底之间提供焊料。 树脂填充基板之间的区域。 焊料和树脂同时加热。 焊料熔化以电连接基板。 将树脂设置为机械地连接基板。

公开(公告)号：US5896276A

公开(公告)日：1999-04-20

申请号：US520791

申请日：1995-08-30

Applicant: Koetsu Tamura ,  Shinichi Hasegawa

Inventor： Koetsu Tamura ,  Shinichi Hasegawa

IPC: H01L21/56 ,  H01L23/495 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K1/11

CPC classification number: H05K3/363 ,  H01L21/563 ,  H01L23/49572 ,  H05K3/361 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K2201/0367 ,  H05K2201/10378 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3484

Abstract: An electronic device assembly includes a large-scale integrated circuit (LSI) chip mounted on a flexible substrate. The flexible substrate is connected to a second substrate via solder. The flexible substrate is also attached to the second substrate via a resin. When the assembly is manufactured, the solder is provided between the substrates. The resin fills an area between the substrates. The solder and the resin are heated simultaneously. The solder melts to electrically connect the substrates. The resin is set to mechanically couple the substrates.

Abstract translation: 电子设备组件包括安装在柔性基板上的大规模集成电路（LSI）芯片。 柔性基板通过焊料与第二基板连接。 柔性基板也通过树脂附接到第二基板。 当制造组件时，在衬底之间提供焊料。 树脂填充基板之间的区域。 焊料和树脂同时加热。 焊料熔化以电连接基板。 将树脂设置为机械地连接基板。

公开(公告)号：US5814882A

公开(公告)日：1998-09-29

申请号：US498797

申请日：1995-07-06

Applicant: Yuzo Shimada ,  Koetsu Tamura

Inventor： Yuzo Shimada ,  Koetsu Tamura

IPC: H01L21/60 ,  H01L23/02 ,  H01L23/28 ,  H01L23/31 ,  H01L23/433 ,  H01L23/12 ,  H01L23/495 ,  H01L23/52

CPC classification number: H01L23/4334 ,  H01L23/3121 ,  H01L23/3185 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025

Abstract: An organic insulation film has inner leads electrically connecting a conductor thereof with an LSI chip. The inner leads are connected to pads on the periphery of the LSI chip. The connecting portions between the inner leads and the pads of the LSI chip are sealed by casting a plastic seal. The plastic seal extends over the back side of the organic insulative film. The projected portion of the plastic seal at the back side of the organic insulative film is covered with a moisture-proofing seal member to provide more inexpensive than transfer molding and highly reliable seal structure for a tape carrier package.

Abstract translation: 有机绝缘膜具有将导体与LSI芯片电连接的内部引线。 内部引线连接到LSI芯片外围的焊盘。 LSI芯片的内部引线和焊盘之间的连接部分通过铸造塑料密封来密封。 塑料密封件在有机绝缘膜的背面延伸。 塑料密封件在有机绝缘膜的后侧的突出部分被防潮密封件覆盖，以提供比传送模塑成本更便宜和用于带状载体包装的高度可靠的密封结构。