公开(公告)号：US09597703B2

公开(公告)日：2017-03-21

申请号：US14625353

申请日：2015-02-18

Applicant: LAM RESEARCH AG

Inventor： Stefan Detterbeck ,  Thomas Passegger ,  Bhaskar Bandarapu ,  Richard Findenig

IPC: B05B1/00 ,  B05C5/02 ,  B05B1/04 ,  B05B15/02 ,  B05B1/28 ,  B05B15/00 ,  H01L21/00

CPC classification number: B05C5/0254 ,  B05B1/00 ,  B05B1/04 ,  B05B1/044 ,  B05B1/28 ,  B05B15/40 ,  B05B15/50 ,  H01L21/00 ,  H01L21/67051

Abstract: A slit nozzle for dispensing liquid onto a surface of a wafer, comprises a nozzle body having a discharge opening whose length is from 10-100 mm and whose width is from 0.5-5 mm. The nozzle body has a dispensing chamber positioned upstream of the discharge opening and extending to the discharge opening, and a liquid distribution chamber positioned upstream of the dispensing chamber. The dispensing chamber and the liquid distribution chamber are in fluid communication with one another and are separated by a reduction section of the nozzle body whose cross-sectional area is at least 20% less than a cross-sectional area of each of the discharge opening and the liquid distribution chamber.

公开(公告)号：US10167552B2

公开(公告)日：2019-01-01

申请号：US14615099

申请日：2015-02-05

Applicant: LAM RESEARCH AG

Inventor： Andreas Gleissner ,  Markus Junk ,  Bhaskar Bandarapu

IPC: C23C16/455 ,  C23C16/458 ,  H01L21/67

Abstract: An apparatus for processing wafer-shaped articles comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, and a rotating shower head for supplying process gas to a surface of a wafer-shaped article when held by the spin chuck. The rotating shower head comprises an outlet plate having plural openings formed in each of a central and a peripheral region thereof. A process gas feed is provided so as to supply process gas to a gas distribution chamber. The gas distribution chamber is in fluid communication with a plurality of openings formed in the shower head.

公开(公告)号：US09911630B2

公开(公告)日：2018-03-06

申请号：US14928802

申请日：2015-10-30

Applicant: LAM RESEARCH AG

Inventor： Andreas Gleissner ,  Bhaskar Bandarapu

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67023 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/68785 ,  H01L21/68792

Abstract: A device for processing wafer-shaped articles comprises a closed process chamber providing a gas-tight enclosure, and a rotary chuck located within the closed process chamber. The closed process chamber comprises an annular duct surrounding the rotary chuck and extending along a first direction radially outwardly of the rotary chuck and obliquely to a rotary axis of the rotary chuck, from an inlet end that communicates with the rotary chuck to an outlet end that communicates with an exhaust duct. The annular duct comprises a duct section extending between the inlet and outlet ends that is defined by an inner chamber wall spaced apart from an outer chamber wall. The extent of the duct section along the first direction is at least twice a spacing of the inner and outer chamber walls throughout the duct section, as measured in a direction perpendicular to the first direction.

公开(公告)号：US12198945B2

公开(公告)日：2025-01-14

申请号：US17269609

申请日：2019-08-21

Applicant: LAM RESEARCH AG

Inventor： Bhaskar Bandarapu ,  David Mui ,  Karl-Heinz Hohenwarter ,  Butch Berney ,  Nathan Lavdovsky ,  Christian Putzi ,  Hongbo Si ,  Robert Johnson ,  Michael Klemm ,  Bernhard Loidl

IPC: H01L21/67 ,  H01L21/687

Abstract: A vapor delivery head for wet treatment of a substrate includes a body including an upper surface, a lower surface, an upper plenum and a lower plenum. A first bore is arranged on the upper surface of the body and fluidly connected to the upper plenum to supply heated fluid. A second bore is arranged on the upper surface of the body and connected to the upper plenum to remove heated fluid. A third bore is arranged on the upper surface of the body and connected to the lower plenum to receive a gas mixture. A plurality of through holes through the lower surface of the body are in fluid communication with the lower plenum.

公开(公告)号：US09887122B2

公开(公告)日：2018-02-06

申请号：US15148778

申请日：2016-05-06

Applicant: LAM RESEARCH AG

Inventor： Hongbo Si ,  Bhaskar Bandarapu ,  Andreas Gleissner ,  Bernhard Loidl

IPC: H01L21/687 ,  H01L21/67 ,  B05C13/00 ,  G03F7/16 ,  B05C9/14 ,  B05C5/02

CPC classification number: H01L21/68785 ,  B05C5/0208 ,  B05C9/14 ,  B05C13/00 ,  G03F7/162 ,  G03F7/168 ,  G03F7/42 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67115 ,  H01L21/67178 ,  H01L21/68792 ,  Y10S134/902

Abstract: In an apparatus for treating a wafer-shaped article, a spin chuck is configured to hold a wafer-shaped article of a predetermined diameter. A non-rotating plate is positioned relative to the spin chuck such that the non-rotating plate is beneath and parallel to a wafer-shaped article when positioned on the spin chuck. A fluid dispensing nozzle passes through the non-rotating plate and terminates in a discharge end positioned above and adjacent to the non-rotating plate. The discharge end comprises a horizontal gas discharge nozzle configured to distribute gas radially outwardly across an upper surface of the non-rotating plate.