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公开(公告)号：US20220155365A1
公开(公告)日：2022-05-19
申请号：US17524788
申请日：2021-11-12
Applicant: MPI Corporation
Inventor： Volker Hansel , Sebastian Giessmann , Frank Fehrmann , Chien-Hung Chen
Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.
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公开(公告)号：US10678370B2
公开(公告)日：2020-06-09
申请号：US16104309
申请日：2018-08-17
Applicant: MPI Corporation
Inventor： Lin-Lin Chih , Guan-Jhih Liou , Chien-Hung Chen , Yung-Chin Liu
Abstract: An aligning method for use in semiconductor inspection apparatus is provided. The semiconductor inspection apparatus includes a stage and a touch-control screen. The aligning method includes defining a reference direction; displaying an image of a device under test supported by the stage on the touch-control screen; detecting a first touch point and a second touch point occurred on the touch-control screen; defining a straight line according to the first touch point and the second touch point; calculating an included angle defined by the straight and the reference direction; and rotating the stage according to the included angle.
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公开(公告)号：US20190187206A1
公开(公告)日：2019-06-20
申请号：US16213498
申请日：2018-12-07
Applicant: MPI Corporation
Inventor： Lin-Lin Chih , Chien-Hung Chen , Guan-Jhih Liou , Yu-Hsun Hsu
IPC: G01R31/28
CPC classification number: G01R31/2893 , H04N5/23299
Abstract: A wafer inspection method was provided. A motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position of an adjustment range along a Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper limit position and a lower limit position in a displacement range. The wafer inspection method includes: determining a position of the control rod in the displacement range based on a measurement signal; determining a moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; and controlling, based on the control signal, the motorized chuck stage and a camera stage to be displaced the same distance.
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公开(公告)号：US11353501B2
公开(公告)日：2022-06-07
申请号：US17094408
申请日：2020-11-10
Applicant: MPI Corporation
Inventor： Lin-Lin Chih , Chien-Hung Chen , Guan-Jhih Liou , Yu-Hsun Hsu
IPC: G01R31/28
Abstract: A wafer inspection method, wherein a motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position along Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper and an lower limit positions. The wafer inspection method includes: determining a position of the control rod based on a measurement signal; determining a first moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; controlling the motorized chuck stage to be displaced along a second moving direction opposite to the first moving direction; and controlling an objective lens module to keep focusing on the wafer when the motorized chuck stage is on the move.
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公开(公告)号：US20220155366A1
公开(公告)日：2022-05-19
申请号：US17524833
申请日：2021-11-12
Applicant: MPI Corporation
Inventor： Volker Hansel , Sebastian Giessmann , Frank Fehrmann , Chien-Hung Chen
IPC: G01R31/28
Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.
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Patent Agency Ranking
公开(公告)号：US10096505B2
公开(公告)日：2018-10-09
申请号：US15414873
申请日：2017-01-25
Applicant: MPI Corporation
Inventor： Lin-Lin Chih , Chien-Hung Chen , Cheng-Rong Yang , Stojan Kanev
IPC: G01R31/01 , H01L21/677 , A47B88/497 , A47B88/457 , G01K13/00 , G01R31/28 , H01L21/673 , A47B88/988
Abstract: A wafer cassette includes a case, a plurality of wafer trays, and a plurality of transmission mechanisms. The wafer trays are disposed in the case. Each of the wafer trays includes a central opening, a first groove, and a second groove. The diameter of the second groove is greater than that of the first groove. A bottom surface of the second groove is higher than that of the first groove. The first and second grooves surround the central opening. Each of the transmission mechanisms is connected to the corresponding wafer tray to move the wafer tray between a pick-up position and a received position. Since the wafer tray has grooves with different diameters, the wafer tray is capable of receiving wafers with different sizes.
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公开(公告)号：US11693050B2
公开(公告)日：2023-07-04
申请号：US17524833
申请日：2021-11-12
Applicant: MPI Corporation
Inventor： Volker Hansel , Sebastian Giessmann , Frank Fehrmann , Chien-Hung Chen
CPC classification number: G01R31/2891 , G01R31/2887 , H01L22/12
Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.
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公开(公告)号：US10996239B1
公开(公告)日：2021-05-04
申请号：US16872390
申请日：2020-05-12
Applicant: MPI Corporation
Inventor： Ingo Berg , Chien-Hung Chen , Frank Fehrmann , Sebastian Giessmann
Abstract: A method of positioning probe tips relative to pads includes: focusing on each of the probe tips in a first image as viewed by a microscope and collecting the coordinates of the corresponding probe tip relative to a first reference point in the first image; focusing on each of the pads in a second image as viewed by the microscope and collecting the coordinates of the corresponding pad relative to a second reference point in the second image, a relative position of the second reference point to the first reference point being predetermined; matching the pads with the probe tips when the quantity of the probe tips and the pads are equal while minimizing a maximum value of the distances calculated between each of the probe tips and the corresponding pad; and moving the probe tips to touch the pads with the maximum value minimized.
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公开(公告)号：US20170221733A1
公开(公告)日：2017-08-03
申请号：US15414873
申请日：2017-01-25
Applicant: MPI Corporation
Inventor： LIN-LIN CHIH , Chien-Hung Chen , Cheng-Rong Yang , Stojan Kanev
IPC: H01L21/677 , A47B88/457 , A47B88/497
CPC classification number: H01L21/6773 , A47B88/457 , A47B88/497 , A47B88/988 , G01K13/00 , G01R31/2891 , G01R31/44 , H01L21/67346 , H01L21/67386
Abstract: A wafer cassette includes a case, a plurality of wafer trays, and a plurality of transmission mechanisms. The wafer trays are disposed in the case. Each of the wafer trays includes a central opening, a first groove, and a second groove. The diameter of the second groove is greater than that of the first groove. A bottom surface of the second groove is higher than that of the first groove. The first and second grooves surround the central opening. Each of the transmission mechanisms is connected to the corresponding wafer tray to move the wafer tray between a pick-up position and a received position. Since the wafer tray has grooves with different diameters, the wafer tray is capable of receiving wafers with different sizes.
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公开(公告)号：US20240219427A1
公开(公告)日：2024-07-04
申请号：US18402824
申请日：2024-01-03
Applicant: MPI CORPORATION
Inventor： STOJAN KANEV , Chien-Hung Chen , Ming-Yang Liu , Yu-Hsun Hsu , Yan-Cheng Chen , Lin-Lin Chih
CPC classification number: G01R1/07392 , G01R31/003 , G01R31/2607
Abstract: A positioning method and probe system for performing the same, a method for operating probe system, and a method for utilizing probe system to produce a tested semiconductor device are provided. The positioning method is used for positioning a plurality of probe assemblies with an under-test device including a plurality of pads, each of the probe assemblies have at least one probe tip that corresponds to each of the pads for contact, and at least one fixed probe assembly and at least one motorized probe assembly are defined among the probe assemblies during a positioning process.
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