-
公开(公告)号：US10678370B2
公开(公告)日：2020-06-09
申请号：US16104309
申请日：2018-08-17
Applicant: MPI Corporation
Inventor： Lin-Lin Chih , Guan-Jhih Liou , Chien-Hung Chen , Yung-Chin Liu
Abstract: An aligning method for use in semiconductor inspection apparatus is provided. The semiconductor inspection apparatus includes a stage and a touch-control screen. The aligning method includes defining a reference direction; displaying an image of a device under test supported by the stage on the touch-control screen; detecting a first touch point and a second touch point occurred on the touch-control screen; defining a straight line according to the first touch point and the second touch point; calculating an included angle defined by the straight and the reference direction; and rotating the stage according to the included angle.
-
公开(公告)号：US20190187206A1
公开(公告)日：2019-06-20
申请号：US16213498
申请日：2018-12-07
Applicant: MPI Corporation
Inventor： Lin-Lin Chih , Chien-Hung Chen , Guan-Jhih Liou , Yu-Hsun Hsu
IPC: G01R31/28
CPC classification number: G01R31/2893 , H04N5/23299
Abstract: A wafer inspection method was provided. A motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position of an adjustment range along a Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper limit position and a lower limit position in a displacement range. The wafer inspection method includes: determining a position of the control rod in the displacement range based on a measurement signal; determining a moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; and controlling, based on the control signal, the motorized chuck stage and a camera stage to be displaced the same distance.
-
公开(公告)号：US11353501B2
公开(公告)日：2022-06-07
申请号：US17094408
申请日：2020-11-10
Applicant: MPI Corporation
Inventor： Lin-Lin Chih , Chien-Hung Chen , Guan-Jhih Liou , Yu-Hsun Hsu
IPC: G01R31/28
Abstract: A wafer inspection method, wherein a motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position along Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper and an lower limit positions. The wafer inspection method includes: determining a position of the control rod based on a measurement signal; determining a first moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; controlling the motorized chuck stage to be displaced along a second moving direction opposite to the first moving direction; and controlling an objective lens module to keep focusing on the wafer when the motorized chuck stage is on the move.
-
公开(公告)号：US10096505B2
公开(公告)日：2018-10-09
申请号：US15414873
申请日：2017-01-25
Applicant: MPI Corporation
Inventor： Lin-Lin Chih , Chien-Hung Chen , Cheng-Rong Yang , Stojan Kanev
IPC: G01R31/01 , H01L21/677 , A47B88/497 , A47B88/457 , G01K13/00 , G01R31/28 , H01L21/673 , A47B88/988
Abstract: A wafer cassette includes a case, a plurality of wafer trays, and a plurality of transmission mechanisms. The wafer trays are disposed in the case. Each of the wafer trays includes a central opening, a first groove, and a second groove. The diameter of the second groove is greater than that of the first groove. A bottom surface of the second groove is higher than that of the first groove. The first and second grooves surround the central opening. Each of the transmission mechanisms is connected to the corresponding wafer tray to move the wafer tray between a pick-up position and a received position. Since the wafer tray has grooves with different diameters, the wafer tray is capable of receiving wafers with different sizes.
-
公开(公告)号：US11144198B2
公开(公告)日：2021-10-12
申请号：US16364747
申请日：2019-03-26
Applicant: MPI Corporation
Inventor： Chien-Hung Chen , Guan-Jhih Liou , Lin-Lin Chih , Stojan Kanev
IPC: G06F3/0488 , G06F3/0484 , G01R31/317 , G01R31/319 , G09G3/00
Abstract: A control method of a touch display apparatus applicable to a probe station is provided. The probe station includes a movable element. The movable element is a chuck stage, a camera stage, a probe platen, or a positioner. The control method of a touch display apparatus includes displaying a first window and a second window on a touch display apparatus; displaying an operation interface on the first window and displaying a real-time image on the second window; and detecting a touch instruction generated on the operation interface, where the movable element moves according to the touch instruction.
-
Patent Agency Ranking
公开(公告)号：USD922396S1
公开(公告)日：2021-06-15
申请号：US29650384
申请日：2018-06-06
Applicant: MPI Corporation
Designer： Lin-Lin Chih , Guan-Jhih Liou , Chien-Hung Chen , Yung-Chin Liu
-
公开(公告)号：US20190171328A1
公开(公告)日：2019-06-06
申请号：US16104309
申请日：2018-08-17
Applicant: MPI Corporation
Inventor： Lin-Lin Chih , Guan-Jhih Liou , Chien-Hung Chen , Yung-Chin Liu
Abstract: An aligning method for use in semiconductor inspection apparatus is provided. The semiconductor inspection apparatus includes a stage and a touch-control screen. The aligning method includes defining a reference direction; displaying an image of a device under test supported by the stage on the touch-control screen; detecting a first touch point and a second touch point occurred on the touch-control screen; defining a straight line according to the first touch point and the second touch point; calculating an included angle defined by the straight and the reference direction; and rotating the stage according to the included angle.
-
公开(公告)号：US20240219427A1
公开(公告)日：2024-07-04
申请号：US18402824
申请日：2024-01-03
Applicant: MPI CORPORATION
Inventor： STOJAN KANEV , Chien-Hung Chen , Ming-Yang Liu , Yu-Hsun Hsu , Yan-Cheng Chen , Lin-Lin Chih
CPC classification number: G01R1/07392 , G01R31/003 , G01R31/2607
Abstract: A positioning method and probe system for performing the same, a method for operating probe system, and a method for utilizing probe system to produce a tested semiconductor device are provided. The positioning method is used for positioning a plurality of probe assemblies with an under-test device including a plurality of pads, each of the probe assemblies have at least one probe tip that corresponds to each of the pads for contact, and at least one fixed probe assembly and at least one motorized probe assembly are defined among the probe assemblies during a positioning process.
-
公开(公告)号：US11036390B2
公开(公告)日：2021-06-15
申请号：US16351008
申请日：2019-03-12
Applicant: MPI Corporation
Inventor： Chien-Hung Chen , Guan-Jhih Liou , Lin-Lin Chih , Stojan Kanev
IPC: G01R31/319 , G01R31/317 , G06F3/0488 , G09G3/00 , G06F3/0484
Abstract: A display method of a display apparatus is provided. The method includes: displaying, on a touch display apparatus, a first window and a second window that overlap with each other, where the first window is smaller than the second window; displaying a first image on the first window, and displaying a second image on the second window, where the second image is an image captured by the camera module in real time; displaying the first image on the second window and displaying the second image on the first window according to the first touch instruction; and displaying the first image on the first window and displaying the second image on the second window according to the second touch instruction.
-
公开(公告)号：US10976363B2
公开(公告)日：2021-04-13
申请号：US16213498
申请日：2018-12-07
Applicant: MPI Corporation
Inventor： Lin-Lin Chih , Chien-Hung Chen , Guan-Jhih Liou , Yu-Hsun Hsu
Abstract: A wafer inspection method was provided. A motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position of an adjustment range along a Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper limit position and a lower limit position in a displacement range. The wafer inspection method includes: determining a position of the control rod in the displacement range based on a measurement signal; determining a moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; and controlling, based on the control signal, the motorized chuck stage and a camera stage to be displaced the same distance.
-
-
-
-
-
-
-
-
-
Search Results
11
records
(took 0.012 seconds)
