公开(公告)号：US11781904B2

公开(公告)日：2023-10-10

申请号：US17530090

申请日：2021-11-18

Applicant: MPI CORPORATION

Inventor： Hung-I Lin ,  Bo-Sian Lee ,  Yi-Hung Chen

IPC: G01R31/26 ,  G01J1/02 ,  G01J1/42

CPC classification number: G01J1/0223 ,  G01R31/2635 ,  G01J2001/4252

Abstract: A chip chuck includes front and back slopes obliquely extending toward a bottom surface from front and back edges of a top surface having a chip placement area for supporting a chip under test, and is defined with an imaginary vertical reference line perpendicular to the chip placement area and an imaginary horizontal reference line. The front and back slopes are connected with the chip placement area and each provided with an included acute angle with respect to the imaginary horizontal reference line, thereby avoiding interference with light emitted from the chip. A chip supporting device includes a chip chuck, and an optical sensing module fixed relative thereto and including an optical sensor whose light receiving surface faces toward a back light emitting surface of the chip, thereby enabling optical characteristic inspection of front and back light emitting surfaces of the chip at the same time.

公开(公告)号：US11656271B2

公开(公告)日：2023-05-23

申请号：US17699610

申请日：2022-03-21

Applicant: MPI CORPORATION

Inventor： Yi-Hsuan Cheng ,  Hung-I Lin ,  Po-Han Peng

IPC: G01R1/067 ,  G01R31/28

CPC classification number: G01R31/2865 ,  G01R1/06727

Abstract: A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.

公开(公告)号：US12158493B2

公开(公告)日：2024-12-03

申请号：US18105103

申请日：2023-02-02

Applicant: MPI CORPORATION

Inventor： Yi-Hsuan Cheng ,  Hung-I Lin ,  Po-Han Peng

IPC: G01R31/28

Abstract: A wafer inspection system includes probe and supporting devices opposite to each other. The probe device includes a probe and an electrically conductive module for transmitting test signal of a driver IC. The supporting device includes a chuck, an annular elastic module detachably disposed on the chuck, and a carrier. The chuck has a supporting portion located correspondingly to a hollow portion of the annular elastic module, which is larger than or equal to the carrier in size on an imaginary horizontal plane, enabling the carrier carrying a wafer to be placed on the supporting portion to be electrically connected with the annular elastic module. When the wafer is contacted by the probe, the electrically conductive module is abutted against the annular elastic module to form a short-path test loop. As a result, it is convenient to pick and place the carrier and wafer, enhancing inspection efficiency.

公开(公告)号：US20170191867A1

公开(公告)日：2017-07-06

申请号：US15334296

申请日：2016-10-26

Applicant: MPI Corporation

Inventor： Duen-Tsai Liau ,  Hung-I Lin

IPC: G01J1/02 ,  G01J1/04

CPC classification number: G01J1/0252 ,  G01J1/04 ,  G01J2001/0481

Abstract: An integrating sphere cover covering an integrating sphere having a light receiving entrance is provided and includes a first casing and a fixing assembly. The first casing partially covers the integrating sphere and includes a first opening where the light receiving entrance passes. A curvature radius of the first casing is greater than that of the integrating sphere. The fixing assembly is disposed at the first casing, and the first casing is fixed to the integrating sphere through the fixing assembly. The first casing or the fixing assembly includes a nozzle. When the first casing covers the integrating sphere, a first interval communicating with the first opening and the nozzle is between the first casing and the integrating sphere to form a first hollow intermediate layer. An air flow passes through the first hollow intermediate layer via the nozzle and the first opening. An integrating sphere module is also provided.