PROBE MODULE SUPPORTING LOOPBACK TEST
    1.
    发明申请
    PROBE MODULE SUPPORTING LOOPBACK TEST 审中-公开
    支持模块支持环路测试

    公开(公告)号:US20170003319A1

    公开(公告)日:2017-01-05

    申请号:US15172931

    申请日:2016-06-03

    CPC classification number: G01R1/07378 G01R31/2889 G01R31/31716 G01R31/31905

    Abstract: A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened.

    Abstract translation: 支持环回测试并在PCB和DUT之间提供的探头模块包括适配器,两个探头,在适配器处提供的两个感应元件以及电容元件。 适配器有两个连接电路。 每个探针的一端连接到一个连接电路,而另一端是尖端,与DUT接触。 每个感应部件具有电连接到一个连接电路的端部,另一端通过设置在适配器处的导电部件电连接到PCB,其中电容部件的两端电连接到 连接电路。 由此信号路径由信号频率之间的差异改变,高频信号的传输路径被有效缩短。

    PROBE MODULE
    2.
    发明申请
    PROBE MODULE 审中-公开
    探测模块

    公开(公告)号:US20150168454A1

    公开(公告)日:2015-06-18

    申请号:US14557786

    申请日:2014-12-02

    CPC classification number: G01R1/06772

    Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a PCB, a plurality of probes, a positioning member, and a signal connector. The PCB has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the PCB. The positioning member is made of an insulating material, and provided on the probes. The positioning member is above the substrate, and the probes are between the substrate and the positioning member. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the PCB, and the grounding portion is electrically connected to the at least one grounding of the PCB.

    Abstract translation: 探针模块,其设置在测试器和DUT之间用于在其间传输电信号,包括PCB,多个探针,定位构件和信号连接器。 PCB有一个电路和两个接地。 探头电连接到PCB的电路和接地。 定位构件由绝缘材料制成,并设置在探针上。 定位构件位于基板上方,探针位于基板和定位构件之间。 信号连接器适于电连接到测试器,其中信号连接器具有信号传输部分和接地部分; 信号传输部分电连接到PCB的电路,并且接地部分电连接到PCB的至少一个接地。

    MULTILAYER CIRCUIT BOARD
    3.
    发明申请

    公开(公告)号:US20170150592A1

    公开(公告)日:2017-05-25

    申请号:US15423584

    申请日:2017-02-03

    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.

    PROBE MODULE
    4.
    发明申请
    PROBE MODULE 审中-公开

    公开(公告)号:US20170115326A1

    公开(公告)日:2017-04-27

    申请号:US15333400

    申请日:2016-10-25

    CPC classification number: G01R1/06794 G01R1/07342 G01R31/2889

    Abstract: A probe module includes a base adapted to be fixed to a tester, an engaging seat engaged with the base, a signal connector, an electrical signal transmitting member, and two probes located below the engaging seat. The engaging seat has an engaging opening and a first end surface. The signal connector is provided in the engaging opening, and has a signal conductive portion and a conductive ground. A signal wire and a ground layer of the electrical signal transmitting member are electrically connected to the signal conductive portion and the conductive ground, respectively. The probes are electrically connected to the signal wire and the ground layer, respectively. The probes extend out of a first extending reference plane of the first end surface. Alternatively, a reflector is used to reflect an image of the probes upward. Whereby, a length of the electrical signal transmitting member can be further shortened.

    MULTILAYER CIRCUIT BOARD
    5.
    发明申请
    MULTILAYER CIRCUIT BOARD 有权
    多层电路板

    公开(公告)号:US20160143141A1

    公开(公告)日:2016-05-19

    申请号:US14619944

    申请日:2015-02-11

    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate first substrate a first pad, and a first circuit, wherein the first circuit is embedded in the first substrate, and the first pad is electrically connected to the first circuit. The second substrate has a first through hole, a second pad, and a second circuit, wherein the first through hole is opened at both sides of the second substrate, and the first pad of the first substrate is in the first through hole; the second circuit is embedded in the second substrate, and the second pad is electrically connected to the second circuit. The pads on each substrate are exposed by the through hole(s) of the above substrate(s) to shorten the null sections of the interconnectors and reduce the interference from the null sections.

    Abstract translation: 多层电路板包括第一衬底和堆叠中的第二衬底。 第一衬底第一衬底是第一衬垫和第一电路,其中第一电路嵌入在第一衬底中,并且第一衬垫电连接到第一电路。 第二基板具有第一通孔,第二焊盘和第二电路,其中第一通孔在第二基板的两侧开口,第一基板的第一焊盘位于第一通孔中; 第二电路嵌入第二衬底中,第二衬垫电连接到第二电路。 每个衬底上的焊盘由上述衬底的通孔暴露,以缩短互连器的零部分,并减少无效部分的干扰。

    TESTING JIG
    6.
    发明申请
    TESTING JIG 审中-公开
    测试大

    公开(公告)号:US20150204906A1

    公开(公告)日:2015-07-23

    申请号:US14558302

    申请日:2014-12-02

    CPC classification number: G01R31/041 G01R1/0466

    Abstract: A testing jig includes a substrate and a plurality of conductive elastic pieces, wherein the substrate has a recess and a plurality of circuits; the recess is located on a top surface of the substrate, while the circuits are provided on the top surface of the substrate. The conductive elastic pieces are provided on the substrate, and are respectively electrically connected to the circuits. Each of the conductive elastic pieces has a contact portion located within an orthographic projection range of the recess, wherein each of the contact portions contacts a pad of a DUT. Whereby, attenuation happens while transmitting test signals with high frequency can be effectively reduces by using the conductive elastic pieces to transmit test signals.

    Abstract translation: 测试夹具包括基板和多个导电弹性件,其中所述基板具有凹部和多个电路; 凹部位于基板的顶表面上,而电路设置在基板的顶表面上。 导电弹性片设置在基板上,分别电连接到电路。 每个导电弹性片具有位于凹部的正投影范围内的接触部分,其中每个接触部分接触DUT的焊盘。 由此,通过使用导电弹性片传输测试信号,可以有效地降低传输高频测试信号的衰减。

    PROBE CARD, AND CONNECTING CIRCUIT BOARD AND SIGNAL FEEDING STRUCTURE THEREOF

    公开(公告)号:US20160018441A1

    公开(公告)日:2016-01-21

    申请号:US14797582

    申请日:2015-07-13

    CPC classification number: G01R1/0416 G01R1/06794 G01R31/02 G01R31/2889

    Abstract: A probe card includes a connecting circuit board, a connector, and a probe. The connecting circuit board includes a substrate having a signal via and a plurality of ground vias, a signal feeding structure disposed on the substrate, and a connecting layer having the connector disposed thereon. The signal feeding structure includes a signal feeding pad and a ground pad, which is connected to the ground via, and has a matching compensation opening having a first side and a second side wider than the first side. The signal feeding pad does not contact the ground pad, and has a first end and a second end wider than the first end. The second end is connected to the signal via. The connecting layer has a signal connecting portion connected to the signal via, and a ground connecting portion connected to the ground vias. The probe is connected to the first end.

    PROBE MODULE
    8.
    发明申请
    PROBE MODULE 审中-公开
    探测模块

    公开(公告)号:US20150168453A1

    公开(公告)日:2015-06-18

    申请号:US14553590

    申请日:2014-11-25

    CPC classification number: G01R1/06772

    Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.

    Abstract translation: 在测试器和DUT之间设置用于在其间传输电信号的探针模块包括信号传输部件,多个探针,定位部件和信号连接器。 信号传输部件具有电路和两个接地。 探头电连接到电路和信号传输构件的基础。 定位构件由绝缘材料制成,并设置在探针上。 信号连接器适于电连接到测试器,其中信号连接器具有信号传输部分和接地部分; 信号传输部分电连接到信号传输部件的电路,并且接地部分电连接到信号传输部件的至少一个接地。

    CANTILEVER PROBE CARD FOR HIGH-FREQUENCY SIGNAL TRANSMISSION
    9.
    发明申请
    CANTILEVER PROBE CARD FOR HIGH-FREQUENCY SIGNAL TRANSMISSION 审中-公开
    CANTILEVER探针卡用于高频信号传输

    公开(公告)号:US20150015291A1

    公开(公告)日:2015-01-15

    申请号:US14332200

    申请日:2014-07-15

    CPC classification number: G01R1/06772 G01R1/06727 G01R1/07342

    Abstract: A cantilever probe card, which is provided between a device under test (DUT) and a tester, includes a carrier board, a probe base, two probes, and a transmission device. The carrier board is provided with through holes. The probe base is provided on the carrier board, and the probes are mounted to the probe base. Each probe has a tip to contact a test pad of the DUT. The transmission device is flexible, and has signal circuits. The transmission device passes through the through hole on the carrier board, and the signal circuits connect the probes to the tester respectively.

    Abstract translation: 设置在被测设备(DUT)和测试仪之间的悬臂探针卡包括载板,探针基座,两个探针和传输装置。 载板上设有通孔。 探针底座设置在载板上,探头安装在探针底座上。 每个探头都有一个提示,用于接触DUT的测试焊盘。 传输设备灵活,并具有信号电路。 传输装置通过载板上的通孔,信号电路将探头分别连接到测试仪。

    HIGH-FREQUENCY CANTILEVER TYPE PROBE CARD
    10.
    发明申请
    HIGH-FREQUENCY CANTILEVER TYPE PROBE CARD 有权
    高频CANTILEVER型探头卡

    公开(公告)号:US20160139179A1

    公开(公告)日:2016-05-19

    申请号:US14619597

    申请日:2015-02-11

    CPC classification number: G01R1/06727 G01R1/06772

    Abstract: A high-frequency cantilever type probe card includes a base board, a probe base provided on the base board, two probes, and a capacitor having opposite ends electrically connected to the probes respectively. The probe base is made of an insulating material, and the probes are made of a conductive material. Each of the probes has an arm and a tip, wherein the arm is connected to the probe base, and the tip is adapted to contact a pad of a DUT. When the DUT generates a testing signal with a high frequency, and the testing signal is transmitted to one of the probes, the capacitor, and the other one of the probes in sequence, and then transmitted back to the DUT.

    Abstract translation: 高频悬臂式探针卡包括基板,设置在基板上的探针基座,两个探针和具有与探针分别电连接的相对端的电容器。 探针基座由绝缘材料制成,探针由导电材料制成。 每个探针具有臂和尖端,其中臂连接到探针基座,并且尖端适于接触DUT的焊盘。 当DUT产生高频测试信号时,测试信号按顺序传输到探头之一,电容器和另一个探头,然后传送回DUT。

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