公开(公告)号：US09919916B2

公开(公告)日：2018-03-20

申请号：US15031957

申请日：2014-10-15

Applicant: Semitechnologies Limited

Inventor： Yufei Lui ,  Owen Guy

IPC: B44C1/22 ,  C25F3/00 ,  B81C1/00 ,  A61M37/00 ,  C23C16/40

CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2201/0159 ,  B81C2201/0176 ,  B81C2201/0181 ,  C23C16/402

Abstract: A method of forming microneedles where through a series of coating and etching processes microneedles are formed from a surface as an array. The microneedles have a bevelled end and bore which are formed as part of the process with no need to use a post manufacturing process to finish the microneedle.