公开(公告)号：US6003225A

公开(公告)日：1999-12-21

申请号：US982012

申请日：1997-12-01

Applicant: Sunghee Yoon

Inventor： Sunghee Yoon

IPC: H05K3/06 ,  H05K3/42 ,  H05K3/44 ,  H05K3/10

CPC classification number: H05K3/062 ,  H05K3/44 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K3/427 ,  Y10T29/49165

Abstract: A printed wiring board has an aluminum backing, a dielectric layer overlying the aluminum backing, and a copper layer overlying the dielectric layer. Holes are drilled through the copper and the dielectric layers, and either partially or fully through the aluminum backing, and plated to provide a conductive path between the copper layer and the aluminum backing. Tin-lead traces are applied to the upper surface of the copper layer and the copper layer is etched to define conductive paths. The copper exposed and aluminum exposed surfaces are protected so as to permit processing of the printed wiring board in otherwise-incompatible etchants and other solutions.

Abstract translation: 印刷电路板具有铝背衬，覆盖在铝背衬上的电介质层和覆盖在电介质层上的铜层。 孔穿过铜和电介质层，并且部分或完全穿过铝背衬，并被电镀以在铜层和铝衬垫之间提供导电路径。 锡引线迹线被施加到铜层的上表面，并且铜层被蚀刻以限定导电路径。 铜暴露和铝暴露表面被保护，以便允许在其它不相容的蚀刻剂和其它溶液中处理印刷线路板。

公开(公告)号：US5858557A

公开(公告)日：1999-01-12

申请号：US949981

申请日：1997-10-14

Applicant: Sunghee Yoon ,  William A. Reed

Inventor： Sunghee Yoon ,  William A. Reed

IPC: B05D1/36 ,  B32B15/20 ,  C23C28/02 ,  C25D5/12

CPC classification number: C23C28/021 ,  C23C28/023 ,  C23C28/028 ,  Y10S205/917 ,  Y10T428/12889 ,  Y10T428/1291

Abstract: A copper-tungsten or copper-molybdenum substrate is plated with a nickel/gold plating by first activating a surface of the substrate. In activating, the surface is contacted to a concentrated alkaline solution at elevated temperature, and then to a concentrated acidic solution. The surface is thereafter plated with a nickel strike layer, plated with a nickel primary layer overlying the nickel strike layer, sintered, re-activated in a concentrated acidic solution, plated with a nickel secondary layer overlying the nickel primary layer, and plated with a gold layer overlying the nickel secondary layer.

Abstract translation: 通过首先激活基板的表面，用镍/金镀层对铜 - 钨或铜 - 钼基板进行电镀。 在活化时，表面在升高的温度下与浓缩的碱性溶液接触，然后与浓缩的酸性溶液接触。 该表面此后镀镍触击层，镀镍层，覆盖镍触击层，烧结，在浓酸溶液中重新活化，电镀覆盖在镍基层上的镍二次层，并镀上一层 金层覆盖镍二层。

公开(公告)号：US5603768A

公开(公告)日：1997-02-18

申请号：US278682

申请日：1994-07-21

Applicant: Sunghee Yoon ,  Mark R. Forsyth

Inventor： Sunghee Yoon ,  Mark R. Forsyth

IPC: C23C18/31 ,  C23C18/16 ,  C23C18/38 ,  B05C13/00

CPC classification number: C23C18/1619 ,  C23C18/163

Abstract: Flow-inducing panels for use in electroless copper plating of complex plastic microwave assemblies. A panel comprises a rigid baffle having openings adapted to secure microwave assemblies therein. The panel has a size relative to the electroless copper plating tank that causes sufficient plating solution flow through the channels in the microwave assemblies by minimizing solution flow bypassing of the channels. This achieves complete copper plating of the inner surfaces in the channels. A relatively large panel builds up back pressure as it approaches plating tank walls, which creates a pressure differential as it moves through the plating tank, thus forcing solution through the channels. The flow-inducing panels easily hold many parts in a stabilized manner which yields high productivity, and provide solution flow through the channels using a standard metallization basket used for printed wiring board manufacturing.

Abstract translation: 用于复合塑料微波组件的化学镀铜的导流板。 面板包括具有适于将微波组件固定在其中的开口的刚性挡板。 该面板具有相对于化学镀铜槽的尺寸，其通过使通道的流动旁路最小化而导致足够的电镀液流过微波组件中的通道。 这实现了通道内表面的完全镀铜。 相对较大的面板在接近电镀槽壁时产生背压，当其移动通过电镀槽时产生压差，从而迫使溶液通过通道。 引流面板以稳定的方式容易地容纳许多部件，其产生高生产率，并且使用用于印刷线路板制造的标准金属化篮提供通过通道的溶液流。