公开(公告)号：US20090174081A1

公开(公告)日：2009-07-09

申请号：US12174212

申请日：2008-07-16

Applicant: Toru FURUTA

Inventor： Toru FURUTA

IPC: H01L23/52

CPC classification number: H05K1/186 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/113 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/0394 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A combination substrate includes a first substrate having multiple wiring board mounting pads for installing a printed wiring board and multiple connection pads on the opposite side of the wiring board mounting pads, a second substrate having multiple package substrate mounting pads for loading one or more package substrates and multiple connection pads on the opposite side of the package substrate mounting pads, a resin component filling a space between the first substrate and the second substrate, and multiple component loading pads positioned to load an electronic component between the first substrate and the second substrate and formed on one of the first substrate and the second substrate. The connection pads of the second substrate are electrically connected to the connection pads of the first substrate.

Abstract translation: 组合基板包括具有用于安装印刷线路板的多个布线板安装焊盘和在布线板安装焊盘的相对侧上的多个连接焊盘的第一基板，具有用于装载一个或多个封装基板的多个封装基板安装焊盘的第二基板 以及在所述封装衬底安装衬垫的相对侧上的多个连接焊盘，填充所述第一衬底和所述第二衬底之间的空间的树脂部件以及被定位成在所述第一衬底和所述第二衬底之间加载电子部件的多个部件装载垫，以及 形成在第一基板和第二基板中的一个上。 第二基板的连接焊盘电连接到第一基板的连接焊盘。

公开(公告)号：US20130192877A1

公开(公告)日：2013-08-01

申请号：US13562508

申请日：2012-07-31

Applicant: Toru FURUTA ,  Fumitaka TAKAGI

Inventor： Toru FURUTA ,  Fumitaka TAKAGI

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K1/0296 ,  H01L2224/48091 ,  H05K1/114 ,  H05K3/10 ,  H05K3/3452 ,  H05K3/4652 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: A wiring board includes an interlayer insulation layer, conductive patterns formed on the interlayer insulation layer, and a solder-resist layer formed on the interlayer insulation layer and having an opening partially exposing the conductive patterns. The solder-resist layer has an edge portion bordering the opening and intersecting the conductive patterns, and the edge portion of the solder-resist layer has a concavo-convex shape having convex portions and concave portions such that the convex portions and the concave portions are alternately intersecting the conductive patterns.

Abstract translation: 布线板包括层间绝缘层，形成在层间绝缘层上的导电图案，以及形成在层间绝缘层上的具有部分地暴露导电图案的开口的阻焊层。 阻焊层具有与开口相邻并且与导电图案相交的边缘部分，阻焊层的边缘部分具有凹凸形状，具有凸部和凹部，使得凸部和凹部为 交替地与导电图案相交。

公开(公告)号：US20130048355A1

公开(公告)日：2013-02-28

申请号：US13537885

申请日：2012-06-29

Applicant: Toru FURUTA ,  Hirofumi FUTAMURA ,  Hisashi MINOURA

Inventor： Toru FURUTA ,  Hirofumi FUTAMURA ,  Hisashi MINOURA

IPC: H05K1/11 ,  H05K1/09 ,  H05K1/00

CPC classification number: H05K3/4602 ,  H05K1/0373 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/09854

Abstract: A printed wiring board has a core substrate including an insulative base material and having a penetrating hole, a first conductive circuit formed on a first surface of the substrate, a second conductive circuit formed on a second surface of the substrate, and a through-hole conductor including a copper-plated film and formed in the penetrating hole such that the through-hole conductor is connecting the first and second conductive circuits. The insulative base material of the substrate includes reinforcing material and resin and has a thermal expansion coefficient in a Z direction which is set at or above a thermal expansion coefficient of the copper-plated film of the through-hole conductor and set at or below 23 ppm, and the insulative base material of the substrate has a thermal expansion coefficient in an XY direction which is set lower than the thermal expansion coefficient of the copper-plated film of the through-hole conductor.

Abstract translation: 印刷电路板具有包括绝缘基材并具有贯通孔的芯基板，形成在基板的第一表面上的第一导电电路，形成在基板的第二表面上的第二导电电路和通孔 导体，其包括镀铜膜，并形成在贯通孔中，使得通孔导体连接第一和第二导电电路。 基板的绝缘基材包括增强材料和树脂，并且在Z方向上的热膨胀系数设定在通孔导体的镀铜膜的热膨胀系数以上且设定在23以下 ppm，并且基板的绝缘基材的XY方向的热膨胀系数设定为低于通孔导体的镀铜膜的热膨胀系数。

公开(公告)号：US20120151764A1

公开(公告)日：2012-06-21

申请号：US13406915

申请日：2012-02-28

Applicant: Toru FURUTA ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

Inventor： Toru FURUTA ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC: H05K3/02

CPC classification number: H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/3484 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/0401

Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.

Abstract translation: 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的镀金属膜，蚀刻以减少从抗蚀剂暴露的镀金属膜的厚度，去除抗蚀剂，以及通过除去暴露的金属膜，形成具有焊盘和比焊盘更薄的导电电路的布线 通过去除电镀抗蚀剂，在基板和布线的表面上形成阻焊层，在该层中，露出焊盘的开口和与焊盘相邻的电路的一部分，焊盘上的焊料膜和 通过开口暴露的电路，以及通过焊料回流焊盘上的焊料凸块。

公开(公告)号：US20090140415A1

公开(公告)日：2009-06-04

申请号：US12163150

申请日：2008-06-27

Applicant: Toru FURUTA

Inventor： Toru FURUTA

IPC: H01L23/485

CPC classification number: H05K3/4614 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/113 ,  H05K1/185 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A combination substrate includes a first substrate having wiring board mounting pads for installing a printed wiring board and connection pads on an opposite side of the wiring board mounting pads, a second substrate having package substrate mounting pads for mounting one or more package substrates and having connection pads on an opposite side of the package substrate mounting pads, a middle substrate positioned between the first substrate and the second substrate and including conductive members electrically connecting the connection pads on the first substrate and the connection pads on the second substrate, and a die positioned between the first substrate and the second substrate and mounted on one of the first substrate and the second substrate.

Abstract translation: 组合基板包括具有用于安装印刷线路板的布线板安装焊盘和布线板安装焊盘相对侧上的连接焊盘的第一基板，具有用于安装一个或多个封装基板并具有连接的封装基板安装焊盘的第二基板 位于所述封装衬底安装焊盘的相对侧上的焊盘，位于所述第一衬底和所述第二衬底之间的中间衬底，并且包括电连接所述第一衬底上的连接焊盘和所述第二衬底上的所述连接焊盘的导电构件， 在第一基板和第二基板之间并且安装在第一基板和第二基板中的一个上。