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    METHOD FOR FORMING THIN FILM PATTERN
    2.
    发明申请
    METHOD FOR FORMING THIN FILM PATTERN 审中-公开
    形成薄膜图案的方法

    公开(公告)号：US20150017321A1

    公开(公告)日：2015-01-15

    申请号：US14500767

    申请日：2014-09-29

    Applicant: V TECHNOLOGY CO., LTD.

    Inventor： Syuji KUDO ,  Michinobu MIZUMURA ,  Koichi KAJIYAMA ,  Hany Maher AZIZ ,  Yoshitaka KAJIYAMA

    IPC: H01M4/00

    CPC classification number: H01M4/00 ,  H01L27/3211 ,  H01L51/0016

    Abstract: To provide a method for forming a thin film pattern 14 having a predetermined shape on a surface of a substrate 1 having an electrode formed in advance in a thin film pattern forming region, there are included the steps of: bringing a resin film 2, which transmits visible light, into close contact with the substrate 1; irradiating the thin film pattern forming region 11 on the substrate 1 with laser light L, thereby forming an opening pattern 21 having the same shape as the thin film pattern 14 in the film 2; forming the thin film pattern 14 in the thin film pattern forming region 11 on the substrate 1 through the opening pattern 21 of the film 2; and peeling off the film 2.

    Abstract translation: 为了提供在具有预先形成在薄膜图案形成区域中的电极的基板1的表面上形成具有预定形状的薄膜图案14的方法，包括以下步骤：使树脂膜2 透射可见光，与基板1紧密接触; 用激光L对基板1上的薄膜图案形成区域11进行照射，从而形成与膜2中的薄膜图案14相同形状的开口图案21; 通过膜2的开口图案21在基板1上的薄膜图案形成区域11中形成薄膜图案14; 并剥离薄膜2。

    EXPOSURE HEAD AND EXPOSURE DEVICE
    4.
    发明申请
    EXPOSURE HEAD AND EXPOSURE DEVICE 有权
    曝光头和曝光装置

    公开(公告)号：US20150009478A1

    公开(公告)日：2015-01-08

    申请号：US14490638

    申请日：2014-09-18

    Applicant: V TECHNOLOGY CO., LTD.

    Inventor： Koichi KAJIYAMA ,  Michinobu MIZUMURA

    IPC: G03F7/20

    CPC classification number: G03F7/70191 ,  G03F7/201 ,  G03F7/2041 ,  G03F7/70341 ,  G03F7/70891

    Abstract: An exposure head according to the invention includes: a transparent substrate; a plurality of exposure light sources which is formed in the transparent substrate and emits exposure light; at least one condensing lens which condenses the exposure light from the exposure light sources on the exposure object; an imaging unit which is disposed on the opposite side to the condensing lens with the transparent substrate interposed therebetween and images the exposure object; and a control unit which controls the turning on of the exposure light sources based on image information imaged by the imaging unit. An exposure device according to the invention includes the exposure head according to the invention. By virtue of such a configuration, it is possible to improve alignment precision of the exposure object and to improve exposure precision of the exposure object.

    Abstract translation: 根据本发明的曝光头包括：透明基板; 多个曝光光源，其形成在所述透明基板中并且发射曝光光; 至少一个聚光透镜，其将来自曝光光源的曝光光凝结在曝光对象上; 成像单元，其设置在聚光透镜的相对侧，透明基板插入其间并对曝光对象进行成像; 以及控制单元，其基于由所述成像单元成像的图像信息来控制所述曝光光源的接通。 根据本发明的曝光装置包括根据本发明的曝光头。 通过这样的结构，能够提高曝光对象的对准精度，提高曝光对象的曝光精度。

    FULL-COLOR LED DISPLAY PANEL
    6.
    发明申请
    FULL-COLOR LED DISPLAY PANEL 审中-公开

    公开(公告)号：US20200098952A1

    公开(公告)日：2020-03-26

    申请号：US16699481

    申请日：2019-11-29

    Applicant: V TECHNOLOGY CO., LTD.

    Inventor： Koichi KAJIYAMA ,  Takafumi HIRANO

    IPC: H01L33/50 ,  H01L33/58 ,  H01L25/075

    Abstract: The present invention includes: an LED array substrate 1 in which multiple LEDs 3 are arranged in a matrix pattern on a substrate, each of the multiple LEDs emitting light in an ultraviolet to blue wavelength band; multiple fluorescent layers 5 arranged side by side above the multiple LEDs 3 in a manner corresponding to three primary colors of light, each fluorescent layer 5 being configured to perform wavelength conversion by being excited by excitation light emitted from a corresponding LED 3 and by emitting fluorescence having a corresponding color; and an excitation light blocking layer 8 disposed to cover the fluorescent layers 5, the excitation light blocking layer 8 being configured to block the excitation light.

    NONDESTRUCTIVE INSPECTION APPARATUS AND INSPECTION SYSTEM OF STRUCTURE
    7.
    发明申请
    NONDESTRUCTIVE INSPECTION APPARATUS AND INSPECTION SYSTEM OF STRUCTURE 有权
    非结构检查装置和结构检查系统

    公开(公告)号：US20150063410A1

    公开(公告)日：2015-03-05

    申请号：US14475327

    申请日：2014-09-02

    Applicant: V TECHNOLOGY CO., LTD.

    Inventor： Koichi KAJIYAMA ,  Michinobu MIZUMURA ,  Yoshinori OGAWA

    IPC: G01N25/72 ,  G01J5/02 ,  G01J5/08

    CPC classification number: G01N25/72 ,  G02B26/10

    Abstract: A nondestructive inspection apparatus of a structure includes: an inspection apparatus body 1 provided with an infrared light irradiation unit irradiating a structure 3 to be inspected with heating infrared light, a temperature variation measuring unit measuring a variation in temperature of the structure due to the irradiation with infrared light from the infrared light irradiation unit, a drive-control-and-accumulation unit performing drive control of the infrared light irradiation unit and the temperature variation measuring unit and performing data accumulation; and a self-running mechanism unit 2 enabling the inspection apparatus body 1 to move along the structure 3. The structure 3 is inspected for an internal defect by irradiating the structure 3 with heating infrared light while the apparatus moves along the structure 3 through the use of the self-running mechanism unit 2 and measuring the variation in temperature of the structure 3 due to the irradiation with infrared light.

    Abstract translation: 一种结构的非破坏性检查装置包括：检查装置主体1，其设置有用加热红外光照射被检查结构3的红外光照射单元;温度变化测量单元，其测量由于照射引起的结构的温度变化 利用来自红外光照射单元的红外光，驱动控制和累加单元执行红外光照射单元和温度变化测量单元的驱动控制并执行数据累积; 以及能够使检查装置主体1沿着结构体3移动的自行进机构单元2.通过在结构体3通过使用而沿着结构体3移动的同时，通过用加热红外光照射结构体3来检查结构3的内部缺陷 并且测量由红外线照射引起的结构3的温度变化。

    SUBSTRATE MOUNTING METHOD AND ELECTRONIC-COMPONENT-MOUNTED SUBSTRATE
    8.
    发明申请
    SUBSTRATE MOUNTING METHOD AND ELECTRONIC-COMPONENT-MOUNTED SUBSTRATE 有权

    公开(公告)号：US20210119098A1

    公开(公告)日：2021-04-22

    申请号：US17253829

    申请日：2019-05-29

    Applicant: V TECHNOLOGY CO., LTD.

    Inventor： Koichi KAJIYAMA ,  Koichiro FUKAYA ,  Takafumi HIRANO ,  Yoshikatsu YANAGAWA

    IPC: H01L33/62 ,  H01L23/00 ,  H01L33/00 ,  H01L21/50

    Abstract: A substrate mounting method of an electronic component on a wiring substrate includes steps of patterning to form a conductive elastic protrusion on an electrode pad provided on the wiring substrate to correspond to a contact point of the electronic component, forming an adhesive layer made of a photosensitive thermosetting resin on the wiring substrate, lowering viscosity of the adhesive layer by heating the adhesive layer to a first temperature zone, electrically connecting the contact point of the electronic component to the electrode pad on the wiring substrate through the conductive elastic protrusion, under a state where the viscosity of the adhesive layer is lowered, by pressing the electronic component after the electronic component is positioned on the wiring substrate, and fixing the electronic component onto the wiring substrate by heating the adhesive layer to a second temperature zone higher than the first temperature zone to cure the adhesive layer.

    BOARD CONNECTION STRUCTURE, BOARD MOUNTING METHOD, AND MICRO-LED DISPLAY
    9.
    发明申请
    BOARD CONNECTION STRUCTURE, BOARD MOUNTING METHOD, AND MICRO-LED DISPLAY 审中-公开

    公开(公告)号：US20200243739A1

    公开(公告)日：2020-07-30

    申请号：US16847526

    申请日：2020-04-13

    Applicant: V TECHNOLOGY CO., LTD.

    Inventor： Koichiro FUKAYA ,  Koichi KAJIYAMA

    IPC: H01L33/62 ,  H01L25/075

    Abstract: Provided is a board connection structure for mounting a micro LED 3 on a wiring board 4. A conductive elastic protrusion 7 is formed by patterning on an electrode pad 6 provided on the wiring board 4 at a position corresponding to a position of a corresponding electrode 5 of the micro LED 3. The elastic protrusion 7 is configured to electrically connect the electrode 5 and the electrode pad 6. This enables mounting of electronic components with a narrow electrode spacing.

    INSPECTION METHOD FOR LED CHIP, INSPECTION DEVICE THEREFOR, AND MANUFACTURING METHOD FOR LED DISPLAY
    10.
    发明申请
    INSPECTION METHOD FOR LED CHIP, INSPECTION DEVICE THEREFOR, AND MANUFACTURING METHOD FOR LED DISPLAY 审中-公开

    公开(公告)号：US20200243712A1

    公开(公告)日：2020-07-30

    申请号：US16847531

    申请日：2020-04-13

    Applicant: V TECHNOLOGY CO., LTD.

    Inventor： Koichiro FUKAYA ,  Koichi KAJIYAMA

    IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

    Abstract: An inspection method for multiple LED chips 6 formed on a sapphire substrate 7, comprising: a first step of positioning the sapphire substrate 7 above an inspection wiring board 11 such that each electrode 10 of the multiple LED chips 6 is arranged above a corresponding electrode pad 12 provided on the inspection wiring board 11 at a position corresponding to the electrode 10, and then placing the sapphire substrate 7 on the inspection wiring board 11; a second step of electrically connecting each electrode 10 of the multiple LED chips 6 and the corresponding electrode pad 12 of the inspection wiring board 11; and a third step of supplying a current to the multiple LED chips 6 through the inspection wiring board 11, and determining the quality of the LED chips 6.

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