Abstract:
본 발명은 광학적 특성 저장 디바이스 및 이를 이용하는 시스템에 관한 것이다. 본 발명의 일 실시예에 따른 디바이스는, 입사광이 가지는 색온도 및 조도의 광학적 특성에 따라 소스 전극 및 드레인 전극 사이의 컨덕턴스(conductance)가 가변되는 광 트랜지스터; 및 제1 전극이 광 트랜지스터의 소스 및 드레인 전극 중 어느 한 전극에 전기적으로 연결되며, 광 트랜지스터의 가변된 컨덕턴스에 따라 가변되는 컨덕턴스를 저장하는 2단자의 가변 저항 메모리 소자;를 포함한다.
Abstract:
A method for extracting intrinsic subgap density of states of an amorphous oxide semiconductor thin film transistor using a channel conduction factor, and a device thereof are disclosed. The method for extracting the intrinsic subgap density of states of the amorphous oxide semiconductor thin film transistor according to an embodiment of the present invention comprises a step of measuring capacitance according to a gate voltage of the thin film transistor; a step of extracting a conduction factor of a channel according to the gate voltage using the measured capacitance; and a step of extracting intrinsic subgap density of states based on the conduction factor of the extracted channel. The step of extracting the intrinsic subgap density of states replaces a physical length between source and drain electrodes with a length of a variable of the conduction factor of the channel and extracts the intrinsic subgap density of states considering the conduction factor of the channel.
Abstract:
A thin film transistor display array is provided. A thin film transistor display array according to one embodiment of the present invention includes a substrate, a gate electrode which is located on the substrate, a gate insulating layer which is located on the gate electrode, a semiconductor layer which is located on the gate insulating layer, a source and a drain electrode which are located on the semiconductor layer and faces each other, a floating metal layer which is located between the source and the drain electrode, and a protection layer which covers the source electrode, the drain electrode, and the floating metal layer. The floating metal layer is electrically floated.
Abstract:
A method for extracting the density of state within an intrinsic band gap of an amorphous oxide semiconductor thin film transistor and a device thereof are disclosed. The method for extracting the density of state within the intrinsic band gap of the amorphous oxide semiconductor thin film transistor comprises; a step of measuring darkroom capacitance according to gate voltage of a thin film transistor; a step of measuring light reaction capacitance of the thin film transistor by irradiating the thin film transistor with a light source of a predetermined wavelength; a step of calculating intrinsic capacitance of the thin film transistor based on the darkroom capacitance and the light reaction capacitance; and a step of extracting the density of state within the intrinsic band gap of the thin film transistor based on the calculated intrinsic capacitance. The step of calculating the intrinsic capacitance extracts the density of state within an independent intrinsic band gap to parasitic capacitance by calculating the intrinsic capacitance after de-embedding the parasitic capacitance of the thin film transistor at the darkroom capacitance and the light reaction capacitance. [Reference numerals] (AA) Start;(BB) End;(S310) Darkroom capacitance according to gate voltage is measured in a darkroom;(S320) Light reaction capacitance according to gate voltage is measured by irradiating a light source;(S330) Intrinsic capacitance is calcualted based on measured darkroom capacitance and light reaction capacitance;(S340) Density of state within a intrinsic band gap is extracted based on calculated intrinsic capacitance
Abstract:
PURPOSE: A manufacturing method of a non-volatile memory cell and a NOR type memory architecture thereof are provided to improve whole memory integration degree by using a non-volatile memory. CONSTITUTION: A character-I like active fin forming a source/drain region on both sides is patterned(S110). An oxide film is deposited(S120). A first oxide film is formed in the active fin region(S130). A character-T like gate is patterned by using a hard mask pattern as the mask on a deposited polysilicon. A second oxide film is formed in the gate region(S150). A charge trapped layer is formed between the first oxide film and the second oxide film(S160).