Abstract:
A substrate measuring method, a program, a computer-readable recording medium storing the program thereon, and a substrate processing system are provided to prevent piling up of substrates waiting to be measured, since a first substrate measurement in a successive lot of two successive lots can be made right after the completion of the substrate processing. A substrate measuring method for measuring processing states of a plurality of substrates, that have been successively transferred from a plurality of lots(L1-L4) comprising a plurality of substrates, the method is characterized by that the substrate measurement is performed in each lot, and the substrate measurement of two successive substrates is performed such that the measurement of the last substrate in a previous lot is completed at the time of completion of the processing of a substrate for first substrate measurement in a subsequent lot.
Abstract:
PURPOSE: A developing apparatus, a developing method, and memory media are provided to increase the reactivity of developing liquid and resist in a specific region of a substrate. CONSTITUTION: A developing apparatus includes a substrate loading and supporting part(11), a developing liquid supplying part, a radiation light irradiating part, and a washing liquid supplying part(71). Resist is applied on the surface of the substrate loading and supporting part. The substrate loading and supporting part horizontally loads and supports a substrate after exposure. The developing liquid supplying part supplies developing liquid to the surface of the substrate. The developing liquid supplying part develops the resist. The developing liquid on the specific region of the substrate is heated to improve the reactivity of the developing liquid to the resist by irradiating radiation light with a substrate material wavelength absorbing region. The washing liquid supplying part supplies washing liquid to the surface of the substrate to eliminate the developing liquid.
Abstract:
본 발명의 과제는 제품 웨이퍼의 처리량을 저하시키지 않고 제품 웨이퍼의 측정을 행하는 것이다. 도포 현상 처리 시스템에 있어서, 복수의 로트(L 1 내지 L 4 )의 웨이퍼(W)를 연속적으로 처리하고, 그 처리가 종료된 웨이퍼(W) 중 일부의 웨이퍼(W)의 선폭 측정을 행한다. 각 로트(L 1 내지 L 4 )마다 선폭 측정이 행해지고, 앞뒤로 연속되는 뒤의 로트의 최초의 선폭 측정(S2)을 행하는 웨이퍼의 웨이퍼 처리(S1)의 종료 시에 앞의 로트의 최후의 선폭 측정이 종료되어 있도록 앞뒤의 각 로트(L 1 내지 L 4 )의 선폭 측정을 행한다. 예를 들어, 뒤의 로트(L 2 )의 최초의 선폭 측정(S2)을 행하는 웨이퍼(W 2-1 )의 웨이퍼 처리(S1)의 종료 시에, 앞의 로트(L 1 )의 최후의 선폭 측정[웨이퍼(W 1-6 )의 선폭 측정]이 종료되어 있도록 앞뒤의 로트(L 1 , L 2 )의 선폭 측정이 행해진다. 웨이퍼, 로트, 도포 현상 처리 시스템, 폭 측정 장치, 카세트